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    METHOD OF MAKING A NANOSTRUCTURE AND NANOSTRUCTURED ARTICLES
    63.
    发明专利
    METHOD OF MAKING A NANOSTRUCTURE AND NANOSTRUCTURED ARTICLES 未知

    公开(公告)号：SG11201600606TA

    公开(公告)日：2016-02-26

    申请号：SG11201600606T

    申请日：2014-07-23

    Applicant: 3M INNOVATIVE PROPERTIES CO

    Inventor： DAVID MOSES M ,  YU TA-HUA ,  BATES DANIEL S ,  SETH JAYSHREE ,  BERGER MICHAEL S ,  FRANKE CARSTEN ,  ZEHENTMAIER SEBASTIAN F

    IPC: B82B1/00 ,  B82B3/00

    Abstract: A method of making a nanostructure and nanostructured articles by depositing a layer to a major surface of a substrate by plasma chemical vapor deposition from a gaseous mixture while substantially simultaneously etching the surface with a reactive species. The method includes providing a substrate; mixing a first gaseous species capable of depositing a layer onto the substrate when formed into a plasma, with a second gaseous species capable of etching the substrate when formed into a plasma, thereby forming a gaseous mixture; forming the gaseous mixture into a plasma; and exposing a surface of the substrate to the plasma, wherein the surface is etched and a layer is deposited on at least a portion of the etched surface substantially simultaneously, thereby forming the nanostructure. The substrate can be a (co)polymeric material, an inorganic material, an alloy, a solid solution, or a combination thereof. The deposited layer can include the reaction product of plasma chemical vapor deposition using a reactant gas comprising a compound selected from the group consisting of organosilicon compounds, metal alkyl compounds, metal isopropoxide compounds, metal acetylacetonate compounds, metal halide compounds, and combinations thereof. Nanostructures of high aspect ratio and optionally with random dimensions in at least one dimension and preferably in three orthogonal dimensions can be prepared.

    68.
    发明专利
    未知

    公开(公告)号：BRPI0807753A2

    公开(公告)日：2014-06-17

    申请号：BRPI0807753

    申请日：2008-02-07

    Applicant: 3M INNOVATIVE PROPERTIES CO

    Inventor： DAVID MOSES M ,  MCCORMICK FRED B ,  ROEHRIG MARK A

    IPC: H01L51/52

    Abstract: A process for fabricating an amorphous diamond-like film layer for protection of a moisture or oxygen sensitive electronic device is described. The process includes forming a plasma from silicone oil, depositing an amorphous diamond-like film layer from the plasma, and combining the amorphous diamond-like film layer with a moisture or oxygen sensitive electronic device to form a protected electronic device. Articles including the amorphous diamond-like film layer on an organic electronic device are also disclosed.

    METHOD OF CONTACT COATING A MICRONEEDLE ARRAY
    69.
    发明专利
    METHOD OF CONTACT COATING A MICRONEEDLE ARRAY 未知

    公开(公告)号：CA2587387C

    公开(公告)日：2013-06-25

    申请号：CA2587387

    申请日：2005-11-18

    Applicant: 3M INNOVATIVE PROPERTIES CO

    Inventor： CHOI HYE-OK ,  KNUTSON GORDON P ,  DAVID MOSES M

    IPC: B05D1/00 ,  A61M37/00

    Abstract: A method of coating a microneedle array by applying a coating fluid using a flexible film (200) in a brush-like manner. A method of coating a microneedle array (250) comprising: providing a microneedle array having a substrate and a plurality of microneedles (230); providing a flexible film; providing a coating solution (210) comprising a carrier fluid and a coating material; applying the coating solution onto a first major surface of the flexible film; performing a transfer step of bringing the first major surface of the flexible film into contact with the microneedles and removing the flexible film from contact with the microneedles; and allowing the carrier fluid to evaporate. Also, a method of coating a microneedle array by applying a coating solution onto a first major surface of a coating substrate to form a layer of applied coating solution having a thickness equal to or less than the height of at least one of the microneedles and performing a transfer step of bringing the first major surface of the coating substrate into contact with the microneedles and removing the coating substrate from contact with the microneedles, thereby transferring at least a portion of the coating solution to the microneedle array.

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