Inspection apparatus and methods, substrates having metrology targets, lithographic system and device manufacturing method

    公开(公告)号:US10761432B2

    公开(公告)日:2020-09-01

    申请号:US15961377

    申请日:2018-04-24

    Abstract: Disclosed is an inspection apparatus for use in lithography. It comprises a support for a substrate carrying a plurality of metrology targets; an optical system for illuminating the targets under predetermined illumination conditions and for detecting predetermined portions of radiation diffracted by the targets under the illumination conditions; a processor arranged to calculate from said detected portions of diffracted radiation a measurement of asymmetry for a specific target; and a controller for causing the optical system and processor to measure asymmetry in at least two of said targets which have different known components of positional offset between structures and smaller sub-structures within a layer on the substrate and calculate from the results of said asymmetry measurements a measurement of a performance parameter of the lithographic process for structures of said smaller size. Also disclosed are substrates provided with a plurality of novel metrology targets formed by a lithographic process.

    Position measuring apparatus, position measuring method, lithographic apparatus and device manufacturing method

    公开(公告)号:US09606442B2

    公开(公告)日:2017-03-28

    申请号:US14418373

    申请日:2013-07-16

    CPC classification number: G03F7/70141 G03F9/7026 G03F9/7034

    Abstract: An apparatus for measuring positions of marks on a substrate, includes an illumination arrangement for supplying radiation with a predetermined illumination profile across a pupil of the apparatus, an objective lens for forming a spot of radiation on a mark using radiation supplied by said illumination arrangement, a radiation processing element for processing radiation that is diffracted by the mark, a first detection arrangement for detecting variations in an intensity of radiation output by the radiation processing element and for calculating therefrom a position of the mark, an optical arrangement, a second detection arrangement, wherein the optical arrangement serves to direct diffracted radiation to the second detection arrangement, and wherein the second detection arrangement is configured to detect size and/or position variations in the radiation and to calculate therefrom a defocus and/or local tilt of the mark.

    Alignment sensor, lithographic apparatus and alignment method
    70.
    发明授权
    Alignment sensor, lithographic apparatus and alignment method 有权
    对准传感器,光刻设备和对准方法

    公开(公告)号:US09547241B2

    公开(公告)日:2017-01-17

    申请号:US14787451

    申请日:2014-04-25

    Abstract: An alignment sensor including an illumination source, such as a white light source, having an illumination grating operable to diffract higher order radiation at an angle dependent on wavelength; and illumination optics to deliver the diffracted radiation onto an alignment grating from at least two opposite directions. For every component wavelength incident on the alignment grating, and for each direction, the zeroth diffraction order of radiation incident from one of the two opposite directions overlaps a higher diffraction order of radiation incident from the other direction. This optically amplifies the higher diffraction orders with the overlapping zeroth orders.

    Abstract translation: 一种对准传感器,包括诸如白光源的照明源,具有可操作以以取决于波长的角度衍射高阶辐射的照明光栅; 和照明光学器件,以将衍射辐射从至少两个相反的方向传送到对准光栅上。 对于入射在对准光栅上的每个分量波长,并且对于每个方向,从两个相反方向之一入射的辐射的零级衍射级与从另一方向入射的较高的辐射衍射级重叠。 这种光学放大了具有重叠零级的较高的衍射级。

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