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    ULTRA LOW MELTING GLASS FRIT AND FIBERS
    62.
    发明申请
    ULTRA LOW MELTING GLASS FRIT AND FIBERS 审中-公开
    超低熔点玻璃纤维和纤维

    公开(公告)号：US20160347644A1

    公开(公告)日：2016-12-01

    申请号：US15117954

    申请日：2015-02-11

    Applicant: CORNING INCORPORATED

    Inventor： Leonard Charles Dabich II ,  Mark Alejandro Quesada ,  Shari Elizabeth Koval ,  Paul Arthur Tick

    IPC: C03B37/005 ,  C03C3/247 ,  C03C8/08 ,  C03B37/05 ,  C03C13/00

    CPC classification number: C03B37/005 ,  C03B37/01 ,  C03B37/055 ,  C03C3/247 ,  C03C8/06 ,  C03C8/08 ,  C03C8/24 ,  C03C13/00

    Abstract: Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.

    Abstract translation: 本文公开了形成低熔点玻璃纤维的方法，包括提供包含低熔点玻璃的玻璃原料并熔融纺丝玻璃原料以制备玻璃纤维，其中玻璃纤维的玻璃化转变温度小于或等于约 120％玻璃原料的玻璃化转变温度。 本公开还涉及用于形成低熔点玻璃料的方法，还包括喷射研磨玻璃纤维。 本文还公开了通过上述方法制备的低熔点玻璃料和纤维。

    OLEDs comprising light extraction substructures and display devices incorporating the same
    65.
    发明授权
    OLEDs comprising light extraction substructures and display devices incorporating the same 有权
    包含光提取子结构的OLED和包含其的显示装置

    公开(公告)号：US08907365B2

    公开(公告)日：2014-12-09

    申请号：US14041359

    申请日：2013-09-30

    Applicant: Corning Incorporated

    Inventor： David Eugene Baker ,  Daniel Aloysius Nolan ,  Mark Alejandro Quesada ,  Wageesha Senaratne

    IPC: H01L51/52 ,  H01L51/56

    CPC classification number: H01L51/5275 ,  H01L51/5262 ,  H01L51/5268 ,  H01L51/5271 ,  H01L51/56

    Abstract: An organic light emitting diode comprising a light extraction substructure and a diode superstructure is provided. The light extraction substructure comprises a light expulsion matrix distributed over discrete light extraction waveguide elements and a waveguide surface of the glass substrate. The light expulsion matrix is distributed at varying thicknesses to enhance the planarity of a diode superstructure-engaging side of the light extraction substructure and to provide light expulsion sites at the waveguide element termination points of the discrete light extraction waveguide elements. In operation, light originating in the organic light emitting semiconductor material of the diode superstructure is coupled to the discrete waveguide elements of the light extraction substructure as respective coupled modes characterized by an approximate coupling length defined as the propagation distance required for an optical mode to be coupled from the superstructure waveguide to one of the discrete waveguide elements of the light extraction substructure.

    Abstract translation: 提供了一种包括光提取子结构和二极管上层结构的有机发光二极管。 光提取子结构包括分散在离散的光提取波导元件上的光排出矩阵和玻璃基板的波导表面。 光排出矩阵以不同的厚度分布以增强光提取子结构的二极管上结构接合侧的平面度，并且在离散的光提取波导元件的波导元件终端点处提供光排出位置。 在操作中，源自二极管上层结构的有机发光半导体材料的光被耦合到光提取子结构的离散波导元件，作为各自的耦合模式，其特征在于近似耦合长度被定义为光模式所需的传播距离 从超结构波导耦合到光提取子结构的离散波导元件之一。

    SEALED GLASS PACKAGES AND METHOD OF MAKING SAME
    70.
    发明公开
    SEALED GLASS PACKAGES AND METHOD OF MAKING SAME 审中-公开

    公开(公告)号：US20230167024A1

    公开(公告)日：2023-06-01

    申请号：US17994820

    申请日：2022-11-28

    Applicant: CORNING INCORPORATED

    Inventor： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Farrokh Sheibani

    IPC: C03C27/10 ,  G02B3/12

    CPC classification number: C03C27/10 ,  G02B3/12

    Abstract: A sealed glass package includes a top substrate and a bottom substrate, each of the top substrate and the bottom substrate comprising a first major surface and a second major surface opposite the first major surface; a central substrate disposed between the second major surface of the top substrate and the first major surface of the bottom substrate, the central substrate including a cavity filled by a first liquid and a second liquid; a polymer disposed between the second major surface of the top substrate and the central substrate; a first laser bond joining and hermetically sealing the first major surface of the bottom substrate and the central substrate; and a second laser bond joining and hermetically sealing the second major surface of the top substrate and the central substrate.

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