公开(公告)号：US20230167024A1

公开(公告)日：2023-06-01

申请号：US17994820

申请日：2022-11-28

Applicant: CORNING INCORPORATED

Inventor： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Farrokh Sheibani

IPC: C03C27/10 ,  G02B3/12

CPC classification number: C03C27/10 ,  G02B3/12

Abstract: A sealed glass package includes a top substrate and a bottom substrate, each of the top substrate and the bottom substrate comprising a first major surface and a second major surface opposite the first major surface; a central substrate disposed between the second major surface of the top substrate and the first major surface of the bottom substrate, the central substrate including a cavity filled by a first liquid and a second liquid; a polymer disposed between the second major surface of the top substrate and the central substrate; a first laser bond joining and hermetically sealing the first major surface of the bottom substrate and the central substrate; and a second laser bond joining and hermetically sealing the second major surface of the top substrate and the central substrate.