公开(公告)号：DE602007013825D1

公开(公告)日：2011-05-19

申请号：DE602007013825

申请日：2007-11-30

Applicant: ERICSSON TELEFON AB L M

Inventor： LIGANDER PER ,  HASSELBLAD MARCUS

IPC: H01P5/107

公开(公告)号：DE60041916D1

公开(公告)日：2009-05-14

申请号：DE60041916

申请日：2000-05-18

Applicant: ERICSSON TELEFON AB L M

Inventor： BERGSTEDT LEIF ,  LIGANDER PER

IPC: H01L23/12 ,  H01L23/373 ,  H01L21/48 ,  H01L21/60 ,  H01L23/15 ,  H01L23/36

Abstract: A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal conduction capacity, so that the carrier provides mechanical support for the components and conducts heat generated by the components.

公开(公告)号：AT287198T

公开(公告)日：2005-01-15

申请号：AT99956422

申请日：1999-10-05

Applicant: ERICSSON TELEFON AB L M

Inventor： BERGSTEDT LEIF ,  LIGANDER PER ,  BOUSTEDT KATARINA

IPC: H05K1/18 ,  H05K3/38 ,  H05K3/46 ,  H05K1/03 ,  H05K1/16

Abstract: Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

公开(公告)号：SE519287C2

公开(公告)日：2003-02-11

申请号：SE0003085

申请日：2000-08-31

Applicant: ERICSSON TELEFON AB L M

Inventor： BERGSTEDT LEIF ,  LIGANDER PER

IPC: H05K1/00 ,  H05K1/16 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46 ,  H01L21/56 ,  H01L23/28 ,  H05K3/12

公开(公告)号：SE0003085L

公开(公告)日：2002-03-01

申请号：SE0003085

申请日：2000-08-31

Applicant: ERICSSON TELEFON AB L M

Inventor： BERGSTEDT LEIF ,  LIGANDER PER

IPC: H05K1/00 ,  H05K1/16 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46 ,  H01L21/56 ,  H01L23/28 ,  H05K3/12

公开(公告)号：SE516087C2

公开(公告)日：2001-11-19

申请号：SE9900349

申请日：1999-02-02

Applicant: ERICSSON TELEFON AB L M

Inventor： LIGANDER PER ,  BERGSTEDT LEIF ROLAND ,  GEVORGIAN SPARTAK

IPC: H05K1/02 ,  H05K1/16 ,  H05K3/32 ,  H01P3/08

Abstract: Method and arrangements for reducing crosstalk between conductors on a conductor carrier, and methods for manufacturing conductor carriers including these arrangements are presented. Crosstalk between the conductors is prevented by providing a dielectric material in the space between each conductor and an earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductors and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index epsir than the dielectric material.

公开(公告)号：SE9903923L

公开(公告)日：2001-05-16

申请号：SE9903923

申请日：1999-10-29

Applicant: ERICSSON TELEFON AB L M

Inventor： BERGSTEDT LEIF ,  LIGANDER PER

IPC: H01L21/98 ,  H01L23/538 ,  H05K1/18 ,  H05K3/40 ,  H01L23/485 ,  H01L23/522 ,  H05K3/32 ,  H05K3/46

公开(公告)号：SE514529C2

公开(公告)日：2001-03-05

申请号：SE9803204

申请日：1998-09-21

Applicant: ERICSSON TELEFON AB L M

Inventor： BOUSTEDT KATARINA ,  BERGSTEDT LEIF ,  LIGANDER PER

IPC: H01L23/13 ,  H01L23/24 ,  H05K3/32 ,  H01L21/60 ,  H01L23/12 ,  H01L23/52

公开(公告)号：AU3688300A

公开(公告)日：2000-09-28

申请号：AU3688300

申请日：2000-03-03

Applicant: ERICSSON TELEFON AB L M

Inventor： BERGSTEDT LEIF ,  LIGANDER PER

IPC: H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  H05K3/00

Abstract: A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.

公开(公告)号：AU2836100A

公开(公告)日：2000-08-25

申请号：AU2836100

申请日：2000-01-14

Applicant: ERICSSON TELEFON AB L M

Inventor： BERGSTEDT LEIF ,  LIGANDER PER ,  GEVORGIAN SPARTAK

IPC: H05K1/02 ,  H05K1/16 ,  H05K3/32 ,  H01P3/08

Abstract: Method and arrangements for reducing crosstalk between conductors on a conductor carrier, and methods for manufacturing conductor carriers including these arrangements are presented. Crosstalk between the conductors is prevented by providing a dielectric material in the space between each conductor and an earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductors and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index epsir than the dielectric material.