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公开(公告)号：US20150296146A1
公开(公告)日：2015-10-15
申请号：US14748542
申请日：2015-06-24
Applicant: FLIR Systems, Inc.
Inventor： Thomas J. Scanlon , Michael Fox , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Mark Nussmeier , Eric A. Kurth
CPC classification number: H04N5/247 , H04N5/23241 , H04N5/265 , H04N5/332 , H04N7/181
Abstract: Various techniques are provided to monitor electrical equipment. In some implementations, a monitoring system for a cabinet may include an infrared camera and a non-thermal camera. The infrared camera may be configured to capture one or more thermal images of at least a portion of electrical equipment positioned in an interior cavity of the cabinet. The non-thermal camera may be configured to capture one or more non-thermal images such as visible light images of the portion of electrical equipment. In some implementations, combined images may be generated that include characteristics of the thermal images and the non-thermal images for viewing by a user. In some implementations, the cameras may receive electrical power through a physical coupling to an electrical connector within the cabinet and/or through electromagnetic energy harvesting techniques. Other implementations are also provided.
Abstract translation: 提供各种技术来监测电气设备。 在一些实施方案中，用于机柜的监控系统可以包括红外相机和非热摄像机。 红外摄像机可以被配置为捕获位于机柜的内腔中的电气设备的至少一部分的一个或多个热图像。 非热摄像机可以被配置为捕获一个或多个非热图像，例如电气设备的该部分的可见光图像。 在一些实现中，可以生成包括热图像和非热图像的特征以供用户观看的组合图像。 在一些实施方案中，相机可以通过物理耦合到机柜内的电连接器和/或通过电磁能量收集技术来接收电力。 还提供了其他实现。
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公开(公告)号：US20150288892A1
公开(公告)日：2015-10-08
申请号：US14747202
申请日：2015-06-23
Applicant: FLIR Systems, Inc.
Inventor： Jeffrey D. Frank , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Andrew C. Telch , Dwight Dumpert , Mark Nussmeier , Eric A. Kurth
CPC classification number: H04N5/33 , H04N5/2252 , H04N5/2257 , H04N5/2258 , H04N5/23229 , H04N5/23241 , H04N5/3651
Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.
Abstract translation: 公开了用于提供被配置为可释放地附接到移动电话或其他便携式电子设备并向其提供红外成像功能的设备附件的各种技术。 例如，装置附件可以包括在其后表面上具有桶以至少部分地接收用户装置的壳体，设置在壳体内并被配置为捕获热红外图像数据的红外传感器组件，以及通信地处理模块 耦合到红外传感器组件并且被配置为将热红外图像数据传输到用户设备。 热红外图像数据可以由红外传感器组件捕获，并且响应于由应用程序或在用户设备上运行的其他软件/硬件例程发送的请求，由处理模块传送到用户设备。
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63.发明申请DETERMINATION OF AN ABSOLUTE RADIOMETRIC VALUE USING BLOCKED INFRARED SENSORS 审中-公开使用阻塞式红外传感器确定绝对值的绝对值公开(公告)号：US20140232875A1
公开(公告)日：2014-08-21
申请号：US14245990
申请日：2014-04-04
Applicant: FLIR Systems, Inc.
Inventor： Pierre Boulanger , Per Elmfors , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Barbara Sharp , Eric A. Kurth
IPC: H04N5/33
CPC classification number: H04N5/33 , H04N5/3651
Abstract: Various techniques are provided for using one or more shielded (e.g., blinded, blocked, and/or obscured) infrared sensors of a thermal imaging device. In one example, a method includes capturing a signal from a shielded infrared sensor that is substantially blocked from receiving infrared radiation from a scene. The method also includes capturing a signal from an unshielded infrared sensor configured to receive the infrared radiation from the scene. The method also includes determining an average thermographic offset reference for the shielded and unshielded infrared sensors based on the captured signal of the shielded infrared sensor. The method also includes determining an absolute radiometric value for the scene based on the average thermographic offset reference and the captured signal of the unshielded infrared sensor.
Abstract translation: 提供了用于使用热成像装置的一个或多个屏蔽（例如，盲，阻挡和/或模糊）红外传感器的各种技术。 在一个示例中，一种方法包括捕获来自屏蔽红外传感器的信号，该屏蔽红外传感器基本上被阻挡以免从场景接收红外辐射。 该方法还包括捕获来自被配置为从场景接收红外辐射的非屏蔽红外传感器的信号。 该方法还包括基于屏蔽红外传感器的捕获信号来确定屏蔽和非屏蔽红外传感器的平均热成像偏移参考。 该方法还包括基于平均热成像偏移参考和非屏蔽红外传感器的捕获信号来确定场景的绝对辐射度值。
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公开(公告)号：US20140093133A1
公开(公告)日：2014-04-03
申请号：US14097197
申请日：2013-12-04
Applicant: FLIR Systems, Inc.
Inventor： Jeffrey D. Frank , Austin A. Richards , Victoria L. White , Nile E. Fairfield , Arthur Stout , David W. Lee , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar
IPC: B60H1/00 , G06K9/00 , H04N5/33 , B60R21/015
CPC classification number: B60H1/00742 , B60R21/015 , B60R21/01532 , B60R21/0154 , G06K9/00362 , G06K9/00832 , G06K9/00838 , H04N5/2257 , H04N5/32 , H04N5/33 , H04N5/3658
Abstract: Various techniques are disclosed for systems and methods using small form factor infrared imaging modules to monitor occupants in an interior compartment of a vehicle. For example, a vehicle-mounted system may include one or more infrared imaging modules, a processor, a memory, alarm sirens, and a communication module. The vehicle-mounted system may be mounted on, installed in, or otherwise integrated into a vehicle that has an interior compartment. The infrared imaging modules may be configured to capture thermal images of desired portions of the interior compartments. Various thermal image processing and analytics may be performed on the captured thermal images to determine the presence and various attributes of one or more occupants. Based on the determination of the presence and various attributes, occupant detection information and/or control signals may be generated. Occupant detection information may be used to perform various monitoring operations, and control signals may adjust various vehicle components.
Abstract translation: 公开了使用小尺寸红外成像模块来监视车辆内部舱室中的乘客的系统和方法的各种技术。 例如，车载系统可以包括一个或多个红外成像模块，处理器，存储器，报警警报器和通信模块。 车载系统可以安装在，安装在或以其他方式集成到具有内部隔间的车辆中。 红外成像模块可以被配置为捕获内部隔室的期望部分的热图像。 可以对捕获的热图像执行各种热图像处理和分析，以确定一个或多个居住者的存在和各种属性。 基于存在和各种属性的确定，可以生成乘员检测信息和/或控制信号。 乘员检测信息可以用于执行各种监视操作，并且控制信号可以调节各种车辆部件。
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公开(公告)号：US20140092256A1
公开(公告)日：2014-04-03
申请号：US14092794
申请日：2013-11-27
Applicant: FLIR Systems, Inc.
Inventor： Brian Simolon , Eric A. Kurth , Steve Barskey , Mark Nussmeier , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: H04N5/33 , H01L27/146 , H04N5/359
CPC classification number: H04N5/33 , H01L27/1469 , H04N5/359 , H04N5/365
Abstract: Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.
Abstract translation: 提供了使用集成电路实现，操作和制造红外成像装置的各种技术。 在一个示例中，系统包括焦平面阵列（FPA）集成电路，其包括适于对场景进行成像的红外传感器阵列，多个有源电路部件，设置在电路部件上方并连接到电路部件的第一金属层，第二 金属层，设置在第一金属层上方并连接到第一金属层，以及第三金属层，设置在第二金属层的上方和红外传感器的下方。 第三金属层连接到第二金属层和红外传感器。 第一，第二和第三金属层是红外传感器和电路部件之间的FPA的唯一金属层。 第一，第二和第三金属层适于在电路部件和红外传感器之间路由信号。
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Patent Agency Ranking
公开(公告)号：US20130278771A1
公开(公告)日：2013-10-24
申请号：US13892202
申请日：2013-05-10
Applicant: FLIR Systems, Inc.
Inventor： Carleton M. Magoun , Patrick B. Richardson , David M. Risdall , Shawn Jepson , Jay B. James , John H. Distelzweig , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar
IPC: H04N5/33
CPC classification number: H04N5/33 , B60C11/246 , B60C23/068 , H04N5/2254 , H04N5/23245
Abstract: Various techniques are disclosed for systems and methods using small form factor infrared imaging modules to monitor various components of a vehicle wheel assembly. For example, a vehicle-mounted system may include one or more infrared imaging modules, a processor, a memory, a display, a communication module, and a vehicle speed sensor. The vehicle-mounted system may be mounted on, installed in, or otherwise integrated into a vehicle that has one or more wheel assemblies. The one or more infrared imaging modules may be configured to capture thermal images of desired portions of the wheel assemblies. Various thermal image analytics and profiling may be performed on the captured thermal images to determine the operating condition of various components of the wheel assemblies and to detect abnormalities. Monitoring information may be generated based on the detected condition and abnormalities, and presented to a driver or other occupants onboard the vehicle in real time.
Abstract translation: 公开了使用小尺寸红外成像模块来监测车轮组件的各种部件的系统和方法的各种技术。 例如，车载系统可以包括一个或多个红外成像模块，处理器，存储器，显示器，通信模块和车速传感器。 车载系统可以安装在，安装在或以其他方式集成到具有一个或多个车轮组件的车辆中。 一个或多个红外成像模块可以被配置为捕获轮组件的期望部分的热图像。 可以对捕获的热图像执行各种热图像分析和分析，以确定车轮组件的各种部件的操作状况并检测异常。 可以基于检测到的条件和异常生成监视信息，并且实时地向车辆上的驾驶员或其他乘客呈现监视信息。
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公开(公告)号：US10321031B2
公开(公告)日：2019-06-11
申请号：US15932372
申请日：2018-02-16
Applicant: FLIR SYSTEMS, INC.
Inventor： Jeffrey D. Frank , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Andrew C. Teich , Dwight Dumpert , Mark Nussmeier , Eric A. Kurth , Gerald W. Blakeley, III , Michael Fox
Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.
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公开(公告)号：US20180198960A1
公开(公告)日：2018-07-12
申请号：US15932372
申请日：2018-02-16
Applicant: FLIR SYSTEMS, INC.
Inventor： Jeffrey D. Frank , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Andrew C. Teich , Dwight Dumpert , Mark Nussmeier , Eric A. Kurth , Gerald W. Blakeley, III , Michael Fox
CPC classification number: H04N5/2252 , H04M1/0254 , H04M1/0264 , H04N5/23254 , H04N5/33 , H04N5/365 , H04N5/3651
Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.
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公开(公告)号：US09948878B2
公开(公告)日：2018-04-17
申请号：US14961829
申请日：2015-12-07
Applicant: FLIR Systems, Inc.
Inventor： Brian Simolon , Eric A. Kurth , Jim Goodland , Mark Nussmeier , Nicholas Hogasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Naseem Y. Aziz
CPC classification number: H04N5/3765 , G01R23/00 , G06F1/04 , G06F11/0703 , G06F11/076 , H04N5/2257 , H04N5/33 , H04N5/365
Abstract: Various techniques are provided to detect abnormal clock rates in devices such as imaging sensor devices (e.g., infrared and/or visible light imaging devices). In one example, a device may include a clock rate detection circuit that may be readily integrated as part of the device to provide effective detection of an abnormal clock rate. The device may include a ramp generator, a counter, and/or other components which may already be implemented as part of the device. The ramp generator may generate a ramp signal independent of a clock signal provided to the device, while the counter may increment or decrement a count value in response to the clock signal. The device may include a comparator adapted to select a current count value of the counter when the ramp signal reaches a reference signal. A processor of the device may be adapted to determine whether the clock signal is operating in an acceptable frequency range, based on the selected count value.
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公开(公告)号：US09918023B2
公开(公告)日：2018-03-13
申请号：US14106696
申请日：2013-12-13
Applicant: FLIR Systems, Inc.
Inventor： Brian Simolon , Eric A. Kurth , Mark Nussmeier , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: H04N5/33 , H04N5/378 , H01L27/146 , H04N5/225
CPC classification number: H04N5/33 , H01L27/14634 , H01L27/1469 , H04N5/2257 , H04N5/378
Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.
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