公开(公告)号：US11002567B2

公开(公告)日：2021-05-11

申请号：US16816920

申请日：2020-03-12

Applicant: Infineon Technologies AG

Inventor： Dirk Hammerschmidt

IPC: G01D5/16 ,  G01R33/09 ,  G01D5/165 ,  G01D5/14 ,  G01R33/02 ,  G01R33/00

Abstract: An angle sensor may comprise a sensing element including a first half bridge, where magnetic reference directions of resistors of the first half bridge are along a first reference axis. The sensing element may include a second half bridge, where magnetic reference directions of resistors of the second half bridge are along a second reference axis. The sensing element may include a third half bridge, where magnetic reference directions of resistors of the third half bridge are along a third reference axis. At least two of the first reference axis, the second reference axis, or the third reference axis may be non-orthogonal to each other.

公开(公告)号：US10942046B2

公开(公告)日：2021-03-09

申请号：US14494055

申请日：2014-09-23

Applicant: Infineon Technologies AG

Inventor： Wolfgang Granig ,  Dirk Hammerschmidt

IPC: G01D18/00 ,  G01D3/08 ,  H04Q9/00

Abstract: A sensor device using verification includes a sensor component and a verification component. The sensor component is configured to generate first data and second data. The verification component is configured to analyze the first data and the second data and generate verification data based on the first data and the second data.

公开(公告)号：US10911086B2

公开(公告)日：2021-02-02

申请号：US14802439

申请日：2015-07-17

Applicant: Infineon Technologies AG

Inventor： Dirk Hammerschmidt ,  Wolfgang Scherr

IPC: H04B1/16 ,  H04L25/06 ,  H04L25/49 ,  H04B17/21 ,  H04L1/00

Abstract: A receiver according to an embodiment includes a receiver circuit to receive a transition in a first direction, a second transition after the first transition in a second direction, and a third transition after the second transition in the first direction and a fourth transition in the second direction of a signal. The receiver circuit is adapted to determine a first time period between the first and third transitions and to determine a second time period between the second and fourth transitions. The receiver circuit is adapted to determine a datum based on at least one of the first time period and the second time period. Furthermore, the receiver is adapted to indicate an error, if the determined first and second time periods do not fulfil a predetermined verification relationship.

公开(公告)号：US10910283B2

公开(公告)日：2021-02-02

申请号：US16910595

申请日：2020-06-24

Applicant: Infineon Technologies AG

Inventor： Dirk Hammerschmidt

IPC: H01L23/29 ,  H01L21/00 ,  H01L23/053

Abstract: A semiconductor device includes a semiconductor chip including a substrate having a first surface and a second surface arranged opposite to the first surface; and a microelectromechanical systems (MEMS) element, including a sensitive area, disposed at the first surface of the substrate. The semiconductor device further includes at least one electrical interconnect structure electrically connected to the first surface of the substrate, and a flexible carrier electrically connected to the at least one electrical interconnect structure, where the flexible carrier wraps around the semiconductor chip and extends over the second surface of the substrate such that a folded cavity is formed around the semiconductor chip.

公开(公告)号：US10895512B2

公开(公告)日：2021-01-19

申请号：US16213543

申请日：2018-12-07

Applicant: Infineon Technologies AG

Inventor： Dirk Hammerschmidt

IPC: G01L19/00 ,  G01L13/00

Abstract: A pressure measuring arrangement is proposed. The pressure measuring arrangement includes a first MEMS pressure sensor arranged on a carrier, and also a second MEMS pressure sensor arranged on the carrier. Furthermore, the pressure measuring arrangement includes an integrated circuit arranged on the carrier, the integrated circuit being coupled to the first MEMS pressure sensor and the second MEMS pressure sensor.

公开(公告)号：US10649835B2

公开(公告)日：2020-05-12

申请号：US15883169

申请日：2018-01-30

Applicant: Infineon Technologies AG

Inventor： Wolfgang Granig ,  Dirk Hammerschmidt ,  Friedrich Rasbornig ,  Michael Strasser ,  Daniel Valtiner

IPC: G06F11/07 ,  G06F11/10 ,  H04L29/08

Abstract: A method for determining information on an integrity of signal processing components within a signal path includes adding an alive signal to a signal at a first position within the signal path and detecting an added alive signal corresponding to the alive signal at a second position within the signal path. Further, the method includes determining the information on the integrity based on the detected signal.

公开(公告)号：US10547477B2

公开(公告)日：2020-01-28

申请号：US16225556

申请日：2018-12-19

Applicant: Infineon Technologies AG

Inventor： Dinh Quoc Thang Nguyen ,  Dirk Hammerschmidt

IPC: H04L25/49 ,  H04W56/00 ,  H04L12/40 ,  H04W84/20

Abstract: Slave devices, master devices, systems and methods are disclosed for bidirectional edge-based pulse width modulation protocol based communication. In an implementation, receiving a master trigger signal starts a timer having an associated time period in a slave device, and after the timer has elapsed the slave device transmits a response.

公开(公告)号：US20200021002A1

公开(公告)日：2020-01-16

申请号：US16032589

申请日：2018-07-11

Applicant: Infineon Technologies AG

Inventor： Maciej Wojnowski ,  Dirk Hammerschmidt ,  Walter Hartner ,  Johannes Lodermeyer ,  Chiara Mariotti ,  Thorsten Meyer

IPC: H01P3/16 ,  H01L23/66 ,  H01Q3/44

Abstract: A semiconductor device including an Integrated Circuit (IC) package and a plastic waveguide. The IC package includes a semiconductor chip; and an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna. The plastic waveguide is attached to the IC package and configured to transport the RF signal between the embedded antenna and outside of the IC package.

公开(公告)号：US10514410B2

公开(公告)日：2019-12-24

申请号：US16046093

申请日：2018-07-26

Applicant: Infineon Technologies AG

Inventor： Friedrich Rasbornig ,  Mario Motz ,  Dirk Hammerschmidt ,  Ferdinand Gastinger ,  Bernhard Schaffer ,  Wolfgang Granig

IPC: G01R31/00 ,  G01R31/26 ,  G01R31/28 ,  G01D3/08 ,  B60T8/88

Abstract: Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and the systems and/or methods are configured to meet or exceed relevant safety or other industry standards, such as SIL standards. For example, a monolithic integrated circuit sensor system implemented on a single semiconductor ship can include a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.

公开(公告)号：US20190303592A1

公开(公告)日：2019-10-03

申请号：US15941930

申请日：2018-03-30

Applicant: Infineon Technologies AG

Inventor： Dirk Hammerschmidt

IPC: G06F21/60 ,  G06F21/64 ,  H03M13/09 ,  H03M13/00

Abstract: A signal processor including a Pulse Width Modulation (PWM) encoder configured to encode data into a data PWM pattern; and a block encoder coupled to the PWM encoder, and configured to determine a checksum of the data PWM pattern, wherein the PWM encoder is further configured to encode the checksum into a checksum PWM pattern, and append the checksum PWM pattern on the data PWM pattern for transmission as a PWM signal.