Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin film silicon solar cell capable of easily manufacturing the thin film silicon solar cell in an application method while suppressing an increase in dangling bonds of a silicon layer.SOLUTION: A manufacturing method of a thin film silicon solar cell 11A includes: a step of forming a first electrode 3 on a substrate; a step of forming a silicon layer 5A by laminating an n-type silicon layer 5An, an i-type silicon layer 5Ai, and a p-type silicon layer 5Ap on the first electrode 3 using a technique for pattern-applying and drying a solution including polysilane in an inert gas atmosphere; and a step of forming a second electrode 8 on the silicon layer 5A. The step of forming the silicon layer 5A performs dangling bond reduction processing for at least one layer of the n-type silicon layer 5An, i-type silicon layer 5Ai, and p-type silicon layer 5Ap.
Abstract:
PROBLEM TO BE SOLVED: To provide a simple method for producing a crystalline platinum particle with a large size. SOLUTION: The method is characterized in that a platinum complex compound, acid, 2C-12C primary alcohol and aliphatic primary amine are contacted with each other in an organic solvent. The crystalline platinum particle produced by the method has a large size, and, preferably, is a single crystal platinum cube to which a specific face is substantially exclusively exposed. Thus, the platinum particle can be suitably used for an electrode material, a catalyst in chemical reaction, the electrocatalyst of a fuel cell or the like. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing porous platinum particles with a large particle size having a significantly higher activity than conventional platinum catalysts in various reactions and excellent dispersion stability in a dispersion medium. SOLUTION: The porous platinum particles are manufactured by bringing crystalline platinum particles into contact with a complex of an amine compound and hydrogenated aluminum at 50-300°C to form composite particles composed of at least platinum and aluminum, and bringing the composite particles into contact with an acid or a base to elute the aluminum contained in the composite particles. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a new compound having a high relative dielectric constant and a method for producing the same, a new polymer having a structural unit derived from the compound and a method for producing the same, and an electrolyte containing the compound or the polymer. SOLUTION: The polymer has a structural unit represented by formula (1) and the compound is represented by formula (2), wherein R 1 is a direct bond, a 1-12C divalent hydrocarbon group or a 1-12C divalent halogenated hydrocarbon group; R 2 and R 3 are each independently H, a 1-12C monovalent hydrocarbon group, a 1-12C organyloxy group or a 1-12C monovalent halogenated hydrocarbon group; m and n are each independently an integer of 0-2, provided that m+n equals 1 or 2; and p and q are each independently an integer of 0-3, provided that p+q equals an integer of 1-3. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern formation method including: a first step of arranging at least one silane compound selected from the group consisting of silicon hydride compounds and silicon halide compounds in a gap formed between a substrate and a pattern-shaped mold; and a second step of applying at least one treatment selected from a heat treatment and an ultraviolet ray radiation treatment to the arranged silane compound. SOLUTION: When the second step is carried out under an inert atmosphere or a reductive atmosphere, a pattern comprising silicon can be formed. When at least a portion of the second step is carried out under an oxygen-containing atmosphere, a pattern comprising a silicon oxide can be formed. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a film-forming composition that is favorably useful in a semiconductor element required for high integration and multilayering and can have a desired relative dielectric constant with ease, in forming an insulating film. SOLUTION: The film-forming composition comprises a silicone resin that has a rational formula represented by formula (1) (H 2 SiO) n (HSiO 1.5 ) m (SiO 2 ) k (wherein n, m and k are each a number; and when n+m+k is 1, n is ≥0.05, m is >0 and ≤0.95 and k is 0-0.2) and is solid at 120°C, a hydrolysis-condensation product obtained by hydrolysis-condensation of a specific silane compound and (D) an organic solvent. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a material for forming a copper thin film, which has excellent conductivity and allows a copper thin film to be formed by an application method to be used for many electronic devices easily and inexpensively; and a method of forming a copper thin film by using the material. SOLUTION: A material for forming a copper thin film contains a compound expressed by a formula shown below and a solvent. In the formula, each of R 1 through R 5 represents any of a hydrogen atom, a halogen atom, a hydrocarbon group having a carbon number of 1 to 15, a halogenated hydrocarbon group having a carbon number of 1 to 10, and an ether group having a carbon number of 1 to 10. R 1 through R 5 may be the same or different from each other. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a silicon dioxide precursor and a silicon dioxide precursor composition useful to form a silicon dioxide film of high purity without containing an organic component. SOLUTION: This silicon dioxide precursor is represented by following rational formula (1): (H 2 SiO) n (HSiO 1.5 ) m (SiO 2 ) k (1) (wherein n, m and k are numbers respectively, and when n+m+k=1, n is ≥0.5, m is >0 and ≤0.3, and k is 0 to 0.2), and is a silicone resin of a solid state at 120°C. The silicon dioxide precursor composition comprises the silicone resin and an organic solvent. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation:要解决的问题:提供二氧化硅前体和二氧化硅前体组合物,其用于形成高纯度的二氧化硅膜而不含有机组分。 解决方案:该二氧化硅前体由以下合理的式(1)表示:(H 2 SB> SiO) SB>(HSiO 1.5 SB>) (1)(其中n,m和k分别是数字,当n + m + k = 1时, ,n≥0.5,m> 0且≤0.3,k为0〜0.2),是120℃下的固态硅酮树脂。 二氧化硅前体组合物包含有机硅树脂和有机溶剂。 版权所有(C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a uniform germanium-doped silicon conductive film on a substrate by a coating method under ordinary pressure, and to provide a method for producing a phosphorus atom-containing higher order silane compound therefor. SOLUTION: A method for producing a germanium atom-containing higher order silane compound comprises irradiating a solution containing a photopolymerizable silane compound and a germanium compound with a ray having a longer wavelength than 400 nm to form the germanium atom-containing higher order silane compound. A method for forming a germanium-containing silicon film comprises coating the solution containing the germanium atom-containing higher order silane compound obtained by the above method on a substrate and heat-treating the coated substrate. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a film-forming method for forming a germanium film by a coating method, and to provide a germanium polymer and a process for producing the germanium polymer for use in forming the germanium film. SOLUTION: The germanium polymer is produced by a process comprising the first step of reacting a tetrahalogenated germanium, an organometallic halide represented by the formula: RQX n (wherein R is a monovalent organic group; Q denotes a germanium atom or a magnesium atom; X denotes a halogen atom; and n is 1 or 3) and lithium and/or magnesium and the second step of subjecting the reaction product produced in the first step to treatment with LiAlH 4 . The germanium film is formed by applying a solution of the germanium polymer onto a substrate surface, heating and then subjecting the coating film to treatment with heat and/or light. COPYRIGHT: (C)2008,JPO&INPIT