公开(公告)号：JPH06283862A

公开(公告)日：1994-10-07

申请号：JP7205493

申请日：1993-03-30

Applicant: NGK INSULATORS LTD ,  N G K ELECTRON KK

Inventor： ASAI MICHIO ,  HASEGAWA ISAMU

IPC: H05K3/46

Abstract: PURPOSE:To provide a ceramic multilayer circuit board in which no poor continuity occurs at a part in which an Ag via is brought into contact with an Ag-Pd interconnection layer. CONSTITUTION:A ceramic multilayer circuit board comprises multilayer interconnection layers 2-1-2-3 provided in a ceramic body 1 and vias 3-1, 3-2 for electrically connecting the layers therebetween, wherein a thickness of the layers 2-2, 2-3 in contact with the via 3-2 is set to 10mum or less.

公开(公告)号：JPH0685418A

公开(公告)日：1994-03-25

申请号：JP15045492

申请日：1992-06-10

Applicant: NGK INSULATORS LTD

Inventor： MORIMOTO TADAHIKO ,  ASAI MICHIO

IPC: C04B35/111 ,  C04B35/10 ,  H05K1/03 ,  H05K1/09

Abstract: PURPOSE:To accomplish a ceramic wiring substrate having excellent temperature cycle resistance. CONSTITUTION:The ceramic wiring substrate is provided with a ceramic substrate, which is mainly composed of Al2O3 of 87 to 94wt.% and flux of 6 to 13wt.%, and a wiring layer which is provided on the ceramic substrate and mainly composed of Ag-Pd alloy of 83 to 90wt.% and a glass component of 10 to 17wt.%. It is desirable that the flux is composed of SiO2 of 3 to 8wt.%, CaO of 0.4 to 2wt.% and MgO of 0.4 to 2wt.%. Also it is desirable that the ceramic substrate contains ZrO2 of 2wt.% or smaller against the total weight of Al2O3 and the flux. Desirably, the glass component is composed of Bi2O3 of 6 to 13wt.%, PbO of 1 to 2.5wt.%, SiO2 of 0.1 to 3wt.%, Al2O3 of 0.01 to 1wt.%, and CaO of 0.01 to 0.4wt.%.

公开(公告)号：JPH04334094A

公开(公告)日：1992-11-20

申请号：JP13224191

申请日：1991-05-09

Applicant: NGK INSULATORS LTD

Inventor： MORIMOTO TADAHIKO ,  ASAI MICHIO

IPC: H05K1/16 ,  H05K3/46

Abstract: PURPOSE:To obtain the manufacturing method of a ceramic multilayered wiring substrate which has a high precision resistance part and a copper circuit wiring part excellent in conducting characteristics which are formed by binary baking, and a solder land part excellent in solder wettabiity. CONSTITUTION:After noble metal paste is printed on the surface of a ceramic multilayered wiring substrate 1, a solder land part 3 is formed by baking in an oxidizing atmosphere. After gold paste and resistance paste are printed, and then a gold pad part 9 and a resistance part 7 are formed by simultaneous or individual baking in an oxidizing atmosphere, copper paste is printed and a circuit wiring part 6 is formed by baking in a non-oxidizing atmosphere.

公开(公告)号：JPH04127496A

公开(公告)日：1992-04-28

申请号：JP24948090

申请日：1990-09-18

Applicant: NGK INSULATORS LTD

Inventor： MIYATA KEIZO ,  ASAI MICHIO

IPC: H05K3/46

Abstract: PURPOSE:To always cover a conductor exposed part with a connecting conductor even if the part is positionally deviated by forming the conductor by previously considering the contraction variation of a ceramic board on the part. CONSTITUTION:An insulating layer 10 made of a ceramic green sheet is prepared, insulating layers 12, 14 made of insulating paste containing the same components as those of the sheet as main materials, and conductor layers 16, 18, 20 made of conductive paste containing high melting point metal such as tungsten, molybdenum, etc., as main ingredients are alternately printed to form a laminate 24 having a conductor exposed part 22, simultaneously baked to form a ceramic board 26 having conductor exposed parts 22a-22f. Further, nickel plated layer and antioxidation barrier layers 27a-27f made of melted noble metal are formed on the parts 22a-22f. Then, pastelike noble metal conductor, connecting conductors 28a-28f made of glass, etc., are so printed to be formed by using a squeegee as to cover the parts 22a-22f (the layers 27a-27f are formed in the same size), and further baked.

公开(公告)号：JPH04127495A

公开(公告)日：1992-04-28

申请号：JP24947990

申请日：1990-09-18

Applicant: NGK INSULATORS LTD

Inventor： MIYATA KEIZO ,  ASAI MICHIO

IPC: H05K1/03 ,  H05K3/46

Abstract: PURPOSE:To extremely reduce possibility of a short-circuit by so forming a thick film conductor as to be partly superposed on a connecting conductor when the conductor is formed through a connecting conductor layer formed after an antioxidation barrier layer is provided to be superposed on the conductor exposed part CONSTITUTION:An insulating layer 10 made of a ceramic green sheet is prepared, insulating layers 12, 14 made of insulating paste containing the same components as those of the sheet as main materials, and conductor layers 16, 18, 20 made of conductive paste containing high melting point metal such as tungsten, molybdenum, etc., as main ingredients are alternately printed and laminated, simultaneously baked to form a ceramic board 24 having a conductor exposed part 22. After antioxidation barrier layer 25 made of a nickel-plated layer and melted noble metal is formed on the part 22 of the board 24, a connecting conductor 28 made of noble metal thick film conductor, etc., is, for example, screen-printed, and further baked. A thick film conductor 30 is so formed as to partly superpose it on the part of the conductor 28.

公开(公告)号：JPH02252289A

公开(公告)日：1990-10-11

申请号：JP7197789

申请日：1989-03-27

Applicant: NGK INSULATORS LTD

Inventor： KONDO YOSHIHIRO ,  ASAI MICHIO

IPC: H05K3/46

Abstract: PURPOSE:To obtain a ceramic multilayer wiring board, which has little unduration of the surfaces and is highly reliable, by a method wherein a plurality of sheets of boards formed with a printed layer formed by printing alternately a conductor layer and an insulating layer on a green sheet are laminated in a prescribed constitution. CONSTITUTION:A through hole 2-1 and a via hole 5-1 are provided by a prescribed method and printed layers are respectively formed of a conductor layer 3-1 and an insulating layer 4-1 and a conductor layer 3-2 and an insulating layer 4-2. Then, a conductor paste for forming a conductor layer 7 is printed on the surface of either of the printed layers and a green sheet 1-1 is superposed on a green sheet 1-2 in such a way that the two printed layers face each other. After insulating layers 12-1 and 12-2 are respectively provided on both surfaces on the outside, thick-film layers 11-1 and 11-2, which consist of conductor layers 9-1 and 9-2, resistor layers 8-1 and 8-2 and overcoat glass layers 10-1 and 10-2, are formed by firing. Thereby, this board becomes a multilayer wiring board, which has little undulation of the surfaces and is highly reliable.

公开(公告)号：JPH02250391A

公开(公告)日：1990-10-08

申请号：JP7042489

申请日：1989-03-24

Applicant: NGK INSULATORS LTD

Inventor： MIYAMURA KIKUJI ,  ASAI MICHIO

IPC: H05K3/00

Abstract: PURPOSE:To acquire a good shape of an edge face by forming a fine wiring pattern by a thin film on a low-temperature-sintered glass ceramic board, then by dividing it through laser scribe and by polishing the edge face. CONSTITUTION:After a fine wiring 2 pattern is formed by a thin film on a low-temperature-sintered glass ceramics board 1, the wiring substrate is divided into a plurality of pieces through laser scribe and edge faces 3-1, and 3-2 are polished. Thereby, a shape of the edge face which is deformed due to heat during laser scribe and a peeled wiring pattern can be removed. It is accordingly possible to acquire a ceramic board for feeding with good mass-producibility which has a good edge face shape and a good wiring pattern at the edge face of the board, and is good especially as a head of an electrical thermal transfer printer.

公开(公告)号：JPS63233087A

公开(公告)日：1988-09-28

申请号：JP6739587

申请日：1987-03-20

Applicant: NGK INSULATORS LTD

Inventor： ASANO MASATAKA ,  ASAI MICHIO

IPC: F27B17/00 ,  C04B41/80

公开(公告)号：JPS5521154A

公开(公告)日：1980-02-15

申请号：JP9412478

申请日：1978-08-03

Applicant: NGK INSULATORS LTD

Inventor： SUZUKI TAKESHI ,  ASAI MICHIO

IPC: H01L23/12 ,  H01L23/08 ,  H01L23/48

Abstract: PURPOSE:To obtain a small ceramic package capable of accommodating an electronic parts of a high integration rate having a multi-terminal in a cavity by providing a slot in the side of a conductive metallic layer connected to a conduction on a circuit substrate of a leadless ceramic package. CONSTITUTION:A conductive metal layer 4 is derived from a cavity 2 on the opening end face 3 of a ceramic made leadless package body 1 to be used for an external electrode pad 4a and a slot 6 is provided in the pad 4a. A lead 8 is connected from an electronic part element 7 mounted on a conductive metal layer 5 in the inner face of the cavity 2 to a corresponding conductive metal layer 4 and the cavity upper face is sealed with a ceramic made cover 9. Whereby a corresponding pattern of the circuit substrate is connected to the external electrode pad 4a directly by a solder and others while directing the opening end face 3 downward, therefore, when the electronic parts of a high integration rate having a multi-terminal are accommodated, the package can be miniaturized without lowering its characteristic.

公开(公告)号：JP2002184353A

公开(公告)日：2002-06-28

申请号：JP2001156066

申请日：2001-05-24

Applicant: NGK INSULATORS LTD

Inventor： KURASHINA MITSURU ,  ASAI MICHIO

IPC: H01J9/24 ,  H01J61/30

Abstract: PROBLEM TO BE SOLVED: To provide a polycrystalline ceramics light-emitting tube for high luminance discharge lamp that is provided with a necessary property at the capillary part without going through a complicated process and without deteriorating the property at the body part, and its manufacturing method. SOLUTION: The water absorption ratio of the formed product is controlled at 20-30 wt.% in the first temporary firing process (S5), and the frit-deposition part of the capillary top end is steeped (S6) in the water solution of magnesium nitric acid of 0.06-0.9 mol/l and fired in the second temporary firing process (S7), and then it is fired (S8) in the hydrogen atmosphere at 1,750-1,900 deg.C, and the average particle size at the frit sealing portion is made smaller than the average particle size of the other portion.