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公开(公告)号：JPH04280656A
公开(公告)日：1992-10-06
申请号：JP6763391
申请日：1991-03-08
Applicant: NGK INSULATORS LTD
Inventor： GOTO TOSHIKI , KAWAKAMI TAMOTSU , IBAYASHI GONZO , ASANO MASATAKA
Abstract: PURPOSE:To enable a ceramic board which is formed of cheap alumina material, free from pores on its surface, and excellent in surface roughness to be manufactured. CONSTITUTION:A composite structure composed of an alumina burned board 9 which serves as a surface layer of an alumina burned multilayer board and an alumina surface layer 10 which is smaller than the alumina burned board 9 in average grain diameter and provided onto the surface of the alumina burned board 9 is provided through such a manner that an alumina burned multilayer board is prepared, a high purity easily sinterable alumina paste 8 whose average grain diameter is smaller than that of the alumina burned board 9 which serves as a surface layer of the alumina burned multilayer board concerned is applied onto the surface of the alumina burned board 9 and then burned.
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公开(公告)号：JPS63233087A
公开(公告)日：1988-09-28
申请号：JP6739587
申请日：1987-03-20
Applicant: NGK INSULATORS LTD
Inventor： ASANO MASATAKA , ASAI MICHIO
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Patent Agency Ranking
公开(公告)号：JPH05218647A
公开(公告)日：1993-08-27
申请号：JP2293892
申请日：1992-02-07
Applicant: NGK INSULATORS LTD
Inventor： NAKABASHI MITSUO , ASANO MASATAKA
IPC: H05K3/46
Abstract: PURPOSE:To lower manufacture cost by reducing photolithography processes when manufacturing a multilayer wiring substrate where film wiring layers and insulating layers are stacked alternately, and these film wiring layers are connected electrically by a via. CONSTITUTION:The film wiring layer 2 at the first layer is made on an alumina board 1, and then a via is made, which has a height capable of protruding the film wiring layer 7 at the second layer on the film wiring layer 2 at the first layer. Then, the insulating layer 6 at the first layer and the film wiring layer 7 at the second layer are made in order, and the film wiring layer 2 at the first layer and the film wiring layer at the second layer are connected by the via 11, and also the film wiring layer 7 at the second layer is protruded on the via 11, and next, the insulating layer 9 at the second layer and the film wiring layer 10 at the third layer are formed in order, and the film wiring layer 7 at the second layer and the film wiring layer 10 at the third layer are connected directly.
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公开(公告)号：JPH04280657A
公开(公告)日：1992-10-06
申请号：JP6763991
申请日：1991-03-08
Applicant: NGK INSULATORS LTD
Inventor： GOTO TOSHIKI , KAWAKAMI TAMOTSU , IBAYASHI GONZO , ASANO MASATAKA
Abstract: PURPOSE:To obtain a ceramic board which is free from pores on its surface and excellent in surface roughness by a method wherein the ceramic board is formed in a composite structure composed of an alumina burned multilayer board provided with a conductive via exposed part and an alumina surface layer which is smaller than the alumina burned multilayer board in average grain diameter. CONSTITUTION:After the surface of an alumina burned board 20 where an inner wiring layer 18 is provided inside and the conductive via exposed part 19a of a conductive via 19 is provided is polished, metal paste is printed on the conductive via exposed part 19a and burned at a temperature of 1300 deg.C or so for the formation of a metal pad 21. Then, the prescribed high purity easily sinterable alumina paste is applied onto an alumina burned board 9 which serves as the surface layer of the alumina burned board 20 and burned at a temperature of 1200 to 1300 deg.C to form a high purity easily sinterable alumina layer 10. Lastly, the high purity easily sinterable alumina layer 10 formed on the metal pad 21 is polished to make the metal pad 21 exposed at the surface of the board 20, and thus a ceramic board of composite structure can be obtained.
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公开(公告)号：JPH0434808A
公开(公告)日：1992-02-05
申请号：JP14102590
申请日：1990-05-30
Applicant: NGK INSULATORS LTD
Inventor： ASANO MASATAKA , KUMA KENGO
Abstract: PURPOSE:To get paste for forming fine wiring by a method wherein inorganic mixed powder composed of Cu powder at 90 - 30 wt. % and Ti powder at 10 - 70 wt. % and photosensitive resin are the principal ingradients and said the photosensitive resin is contained at 20 - 40 wt. % to the said inorganic mixed powder. CONSTITUTION:Powder of metal copper, copper oxide, copper suboxide and other copper inorganic compound, or mixtures of those powders, powders of metal titanium, titanium hydride and other titanium inorganic compound, or mixtures of those powders are used. 90 - 30 wt. % of Cu power and 10 - 70 wt. % of Ti powder are values converted into Cu and Ti. The percentage by weight of photosensitive resin to inorganic mixed power is a value obtained when the value obtained by converting inorganic mixed powder into Cu and Ti is assumed as 100. this composition is kneaded with an organic binder and an organic solvent to be prepared in a desired viscosity. The wiring-width wiring space formed by patterning becomes 100mum or less.
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公开(公告)号：JPH0238552B2
公开(公告)日：1990-08-30
申请号：JP6739587
申请日：1987-03-20
Applicant: NGK INSULATORS LTD
Inventor： ASANO MASATAKA , ASAI MICHIO
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公开(公告)号：JPH04280694A
公开(公告)日：1992-10-06
申请号：JP6763291
申请日：1991-03-08
Applicant: NGK INSULATORS LTD
Inventor： GOTO TOSHIKI , KAWAKAMI TAMOTSU , IBAYASHI GONZO , ASANO MASATAKA
Abstract: PURPOSE:To enable a ceramic board which is formed of cheap alumina material, free from pores on its surface, and excellent in surface roughness to be manufactured. CONSTITUTION:A ceramic board of composite structure composed of an alumina sinter board 9 and an alumina surface layer 10 which is smaller than the alumina sinter board 9 in average grain diameter and provided onto the sinter board 9 is obtained through such a manner that the alumina sinter board 9 is prepared, and high purity easily sinterable alumina paste 8 whose average grain diameter is smaller than that of the alumina sinter board 9 is applied onto the surface of the sinter board 9.
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