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公开(公告)号：JPH0560920A
公开(公告)日：1993-03-12
申请号：JP24493091
申请日：1991-08-29
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI , FUKUSHIMA YUTAKA
IPC: B29C59/02 , G02B6/00 , G02F1/1335 , G02F1/13357
Abstract: PURPOSE:To obtain a light transmission plate for a surface light source device possible to easily change a design of a light diffusing part. CONSTITUTION:A resist pattern part is formed on one side of a stainless plate so as to make dot area gradually large from small by the photoetching method and the metallic plate 2 is formed by etching so that the resist pattern part becomes a projecting part. Next, the metallic plate is laminated on the plastic plate 1, is held between the metallic mold 3, 4, is heated and is vacuum pressed with suction force to form the recessed part corresponding to the projecting part of the metallic plate on the plastic plate 1.
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公开(公告)号：JPH04355408A
公开(公告)日：1992-12-09
申请号：JP15751991
申请日：1991-05-31
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI , FUKUSHIMA YUTAKA
IPC: G02B5/02 , F21V8/00 , G02B6/00 , G02F1/1335 , G02F1/13357 , G03B21/14
Abstract: PURPOSE:To provide a light conductive plate for a surface emission device capable of obtaining highly bright surface emission. CONSTITUTION:By means of a metal mold 4 provided with a cavity having projection parts 5 of a pattern corresponding to a light diffusion transmitting part pattern being formed on a light conductive plate for a surface emission device, a transparent rectangular plate material light conductive body is formed by injecting acrylic resin. Next, ink containing silica is arranged in a recess part pattern 2 formed on the lower surface of a light conductive body 1 as a light diffusion transmitting material 3, so that the light conductive plate for the surface emission device can be obtained.
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公开(公告)号：JPH02121655A
公开(公告)日：1990-05-09
申请号：JP27516488
申请日：1988-10-31
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI , FUKUSHIMA YUTAKA , IWATA TORAYOSHI , MORI KOJI
Abstract: PURPOSE:To obtain a measuring member for a constricted part detector high in the insulating reliability between terminal take-out parts and excellent in workability by forming the terminal take-up parts to the respective electrode substrates bonded to other electrode substrate in an insulating state. CONSTITUTION:Insulating layers are formed to the surfaces of the first and second electrode substrates A, B excepting the respective terminal take-out parts 1, 2. The first and second electrode substrates A, B are bonded through an adhesive layer 6 in positional relation such that the terminal take-out part 1 of the first electrode substrate A is positioned behind the terminal take-out part 2 of the second electrode substrate B. Lead wires 4 are connected to the terminal take-out part 1, 2 by a soldering system to be drawn out. By the above mentioned constitution, the insulating reliability between the terminal take-out parts 1, 2 becomes high. The terminal treatment of the above mentioned connection part is also simply performed by molding a silicone resin and a holding part becomes fine and workability is excellent.
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公开(公告)号：JPS63301591A
公开(公告)日：1988-12-08
申请号：JP13614687
申请日：1987-05-30
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI , IWATA TORAYOSHI
Abstract: PURPOSE:To make it possible to form a cover-lay with superior closeness by making an insulation coating film to a condition pattern by electrodeposition coating. CONSTITUTION:When a conduction pattern 2 is coated with an insulation coating film by an electrodeposition method, the conduction pattern 2 is uniformly coated with the insulation coating film. After this insulation coating film becomes a cover-lay after the hardening. Thus, this cover-lay 1 adheres only to the conductor, with superior adhesion of coating film on the corner and side surface of the conduction pattern 2. Moreover, it is possible to form the cover-lay 1 with thickness thinner than that of the cover-lay made of a film, and a cover-lay is not formed on a base film 3 so that it is also possible to form a cover-lay 1 with superior flexibility due to the less effect on the flexibleness of the base film 3.
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公开(公告)号：JPS63301428A
公开(公告)日：1988-12-08
申请号：JP13614587
申请日：1987-05-30
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI
Abstract: PURPOSE:To make it possible to execute an insulating treatment securely on the surface of a conductor with corners by spreading an insulating paint in an electrodesposition, and composing to harden the paint on condition that the paint does not make levelling. CONSTITUTION:A paint with the anion type or cation type insulation property is spread on the surface of a conductor 1 in an electrodesposition. As the insulating paint, an acrylic resin type, an urethane resin type paint, or the like is used. When the anion type insulating paint is used, the insulating coating membrane 2 is formed by making the conductor 1 into an anode, and when the cation type paint is used, the conductor 1 is made into a cathode. At the corners of the conductor, the current density is made larger and a thick insulating membrane is obtained. As the requirement of the burning for the treatment, it is preferable to take the temperature 110 to 150 deg.C, and the time 15 to 20 minutes. In this case, when the burning is carried out at a high temperature for a long time, the membrane will flow out to generate a levelling, and the membrane thickness is made thinner by the surface tension at the corners. Therefore, by giving the said condition, a sufficient insulating strength can be given to the conductor with corners.
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Patent Agency Ranking
公开(公告)号：JP2006310758A
公开(公告)日：2006-11-09
申请号：JP2006007397
申请日：2006-01-16
Applicant: Nissha Printing Co Ltd , 日本写真印刷株式会社
Inventor： YAMAMOTO KUNITOSHI , ITO TAKASHI
Abstract: PROBLEM TO BE SOLVED: To provide a circuit wiring board which is densified by forming conductors without clearance on the circuit wiring board and to provide its manufacturing method.
SOLUTION: The circuit wiring board has several first conductors 103 which are formed with clearances 108 one another on a conductor forming surface 102a of an insulating substrate 102, and first insulators 104 which are formed respectively on first exposed surfaces 103a of the first conductors 103. In this case, second conductors 105 are formed in the clearances 108 and second insulators 106 are formed on second exposed surfaces 105a of the second conductors 105 with fusing with the first insulators 104.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：提供一种电路布线板，其通过在电路布线板上形成导体而没有间隙而致密化并提供其制造方法。 解决方案：电路布线板具有在绝缘基板102的导体形成表面102a上彼此形成有间隙108的多个第一导体103和分别形成在第一绝缘基板102的第一裸露表面103a上的第一绝缘体104。 在这种情况下，第二导体105形成在间隙108中，第二绝缘体106通过与第一绝缘体104熔合而形成在第二导体105的第二暴露表面105a上。（C）2007， JPO＆INPIT
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公开(公告)号：JPH11251702A
公开(公告)日：1999-09-17
申请号：JP6443698
申请日：1998-02-27
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI
IPC: H05K1/11
Abstract: PROBLEM TO BE SOLVED: To reduce the space factor of through holes in a printed wiring board, by connecting a plurality of wiring pattern sections formed on the front and the rear face of a substrate through conductor sections in one and the same through hole. SOLUTION: After forming a through hole 2 in a substrate 1, a metal layer such as a copper layer is formed on both faces of the substrate and on a wall face of the through hole 2 by electroless deposition, evaporation or the like. Nextly, a plurality of wiring pattern sections 3 are formed on both faces of the substrate 1 and a plurality of conductor sections 4 as wide as the wiring pattern sections 3 are formed in the through hole 2. Through the conductor sections 4, the wiring patterns 3 formed on the surface of the substrate 1 and those formed on the rear face of the substrate 1 are connected. By this method, the occupation rate of the through holes 2 in a printed wiring board can be reduced, thereby increasing the density of the printed wiring board.
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公开(公告)号：JPH11150365A
公开(公告)日：1999-06-02
申请号：JP33629997
申请日：1997-11-19
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI
IPC: H05K3/42
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board provided with a through-hole, wherein a through-hole split conductor can be formed through a less number of processes. SOLUTION: A photocuring photosensitive resist film 4 is formed on all conductor films 3 each provided to the surfaces of an insulating board 1 and the inner wall of a through-hole 2 provided to the board 1, a mask film 5 provided with a wiring pattern 6 and a split through-hole opening pattern 7 which are both permeable to light and a light control sheet 8 which projects incident light from its opposite surface scattering or refracting it are placed on the one side of the board 1, the photosensitive resist film 4 is exposed to light, another mask film 5 provided with a wiring pattern 6 and a split through-hole opening pattern 7 which are both permeable to fight and another light control sheet 8 are placed on the other side of the board 1, and the photosensitive resist film 4 is exposed to light, whereby etching resist films are formed by developing, and a part of the conductor film 3 to covered with the etching resist film is removed by etching for the formation of a wiring and a through- hole split conductor.
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公开(公告)号：JPH08146230A
公开(公告)日：1996-06-07
申请号：JP30831894
申请日：1994-11-16
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI , FUKUSHIMA YUTAKA
IPC: G02B6/00 , F21V8/00 , G02F1/1335 , G02F1/13357
Abstract: PURPOSE: To obtain high-luminance light emission by chamfering an angular part between the surface of a light transmission plate and a side surface where a linear light source is arranged so that light made incident on the light transmission plate once may be reflected and guided to the inner part of the light transmission plate. CONSTITUTION: In this surface light emitting device, the linear light source 2 is arranged on the side surface of the transparent light transmission plate 1 having outside dimension larger than a display area 9. A rectangular plate material is used as the light transmission plate 1, a chamfer part 7 is formed by chamfering the angular part between the surface of the plate 1 and the side surface where the light source 2 is arranged so that the light made incident on the plate 1 once may be reflected and guided to the inner part of the plate 1. The shape of the chamfer part 7 is a flat surface or a crosssection curved surface (projected surface or recessed surface), and the angle and dimension are properly set in accordance with the thickness of the plate 1, the size of the light source 2, a distance between the plate 1 and the light source 2 and other conditions. Acrylic, polycarbonate, polystyrene or acrylic styrene is used as the material of the plate 1.
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公开(公告)号：JPH08114800A
公开(公告)日：1996-05-07
申请号：JP27559494
申请日：1994-10-13
Applicant: NISSHA PRINTING
Inventor： YAMAMOTO KUNITOSHI , FUKUSHIMA YUTAKA
IPC: G02F1/1335 , G02F1/13357
Abstract: PURPOSE: To provide a surface light emission device constituted so that luminance unevenness is eliminated and a pressing spring is easily arranged. CONSTITUTION: The surface light emission device is constituted so that a linear light source 2 is arranged on the side surface of a transparent light transmission plate 1, a light source reflection film 4 is arranged so as to cover the light source 2 and the front and the back surfaces of the end part of the plate 1 and the pressing spring 5 provided with a holding part 51 holding the light source 2 inside through the film 4 and a pair of pressing parts 52 interposing the end part of the plate 1 through the film 4 is arranged so as to be freely attached and detached. Then, one pressing spring 5 being slender along the side surface of the plate 1 is arranged per one side surface of the plate 1 where the light source 2 is arranged and a pair of pressing part 52 of the spring 5 is shaped to be surface-like. Besides, an overhang part 54 is provided so that either edge of the spring on the slide of the front or the back surface of the plate 1 may be positioned nearer to the center of the plate 1 than the other edge.
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