公开(公告)号：DE69207934T2

公开(公告)日：1996-09-05

申请号：DE69207934

申请日：1992-03-27

Applicant: NISSHA PRINTING

Inventor： YAMAMOTO KUNITOSHI ,  FUKUSHIMA HIROSHI

IPC: F21V7/00 ,  F21V8/00 ,  G02F1/13357 ,  G02F1/1335 ,  G09F13/18

公开(公告)号：DE69207934D1

公开(公告)日：1996-03-14

申请号：DE69207934

申请日：1992-03-27

Applicant: NISSHA PRINTING

Inventor： YAMAMOTO KUNITOSHI ,  FUKUSHIMA HIROSHI

IPC: F21V7/00 ,  F21V8/00 ,  G02F1/13357 ,  G02F1/1335 ,  G09F13/18

公开(公告)号：EP1063699A4

公开(公告)日：2007-07-25

申请号：EP99903905

申请日：1999-02-10

Applicant: NISSHA PRINTING

Inventor： YAMAMOTO KUNITOSHI ,  TSUJI KOICHIRO

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/12 ,  H01L23/13 ,  H01L23/31 ,  H01L23/50 ,  H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01L23/13 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/141 ,  H05K3/0052 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/108 ,  H05K3/184 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2203/1407 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Through holes 3 are formed at four peripheral edges of a plurality of semiconductor chip placement regions 2 of an insulating substrate 1, except for coupling portions 4 partially arranged thereat. A substrate sheet 8 for semiconductor module is used in which connecting portions 7 between inner lead portions 5 and outer lead portions 6 arranged on both surfaces of the substrate 1 are formed in pattern on the side wall surface of the through hole 3. The semiconductor chip is mounted on each region, electrode terminals thereof and the inner lead portions are electrically connected to each other, the chip is sealed, and then the coupling portions are cut.

公开(公告)号：EP0185770A4

公开(公告)日：1986-11-26

申请号：EP85903041

申请日：1985-06-13

Applicant: NISSHA PRINTING

Inventor： YAMAMOTO KUNITOSHI ,  MORI YASUJI ,  IWATA TORAYOSHI

IPC: B32B3/14 ,  B32B15/08 ,  H01F5/00 ,  H01F41/04

CPC classification number: H01F41/042 ,  H01F5/003 ,  Y10T29/4902 ,  Y10T29/49155

公开(公告)号：EP1001439A4

公开(公告)日：2001-12-12

申请号：EP99922533

申请日：1999-05-28

Applicant: NISSHA PRINTING

Inventor： YAMAMOTO KUNITOSHI

IPC: H01F17/00 ,  H02K3/26 ,  H05K1/16 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H01F41/04 ,  H01F5/00 ,  H02K15/04

CPC classification number: H05K1/165 ,  H01F17/0006 ,  H01F17/0033 ,  H02K3/26 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/403 ,  H05K2201/09063 ,  H05K2201/097 ,  Y10T29/49018 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: Rings (4) are each formed between an annular opening (2) and a center hole (3) in an insulating sheet (1). Conductor film (6) is helically deposited on each ring (4) so that the insulating sheet may include a plurality of printed annular coils. Rings (4) are cut from the sheet (1) to provide a plurality of separate, printed annular coils (P).

公开(公告)号：JPH11261235A

公开(公告)日：1999-09-24

申请号：JP7313498

申请日：1998-03-06

Applicant: NISSHA PRINTING

Inventor： YAMAMOTO KUNITOSHI ,  NISHIMURA MASAHITO

IPC: H05K1/11 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To protect a plated part against cracking by constituting the inner circumferential part of the land of a plated through hole partially as a cut part of a unplated land thereby lessening stress of the through hole due to expansion/contraction of a multilayer printed wiring board in the thickness direction. SOLUTION: A plated layer of copper, or the like, is formed on the opposite sides of a laminated article and on the inner wall face of a through hole. An etching resist layer is then provided at parts required no etching on the opposite sides of the laminated article other than the land cut part 3, e.g. a plated through hole part 4 and a conductor 6 part. Subsequently, plated layer is removed from the part not covered with the etching resist layer and then the etching resist layer is stripped off. Consequently, the land cut part 3 composed of an unplated part can be formed on the land 2 of the plated through hole part 4. Preferably, the land cut part 3 is provided from the inner circumferential part toward the outer circumferential part of the land 2.

公开(公告)号：JPH11219820A

公开(公告)日：1999-08-10

申请号：JP3361298

申请日：1998-01-30

Applicant: NISSHA PRINTING

Inventor： YAMAMOTO KUNITOSHI ,  ITO TAKASHI ,  FUKUI AKIRA

IPC: H05K1/16 ,  H01F17/00 ,  H01F41/04

Abstract: PROBLEM TO BE SOLVED: To attain the small exclusive area and impedance stabilization by a method wherein a printed-coil spirally formed of conductor pattern layers and the other circuit are provided between truneated chevron shaped linear holes. SOLUTION: Opposing linear holes 2 describing truneated chevron shape are provided on a substrate 1. Conductor pattern layers 3 in equiwidth are spirally formed on upper and lower sides and both sides on the axes of the parts held between the linear holes 2a at the required intervals for avoiding the shortcircuiting with mutually adjacent conductor pattern layers 3. In a printed-coil 4, the conductor pattern layers 3 are spirally formed on upper and lower sides and both sides on the axes of the parts held between the linear holes 2 so that the interline distances of the conductor pattern layers 3 may not be notably restricted. Resultantly, the exclusive area is narrowed as well as the flux dentisy is increased. Besides, the printed-coil 4 together with the other circuit 5 are provided on a printed-wiring board. In such a constitution, the printed-coil together with the other circuit 5 are provided on one sheet of the printed- wiring board thereby making feasible of cutting down the packaging manhours for thinning the printed-wiring board.

公开(公告)号：JPH0854626A

公开(公告)日：1996-02-27

申请号：JP21046594

申请日：1994-08-10

Applicant: NISSHA PRINTING

Inventor： YAMAMOTO KUNITOSHI ,  FUKUSHIMA YUTAKA

IPC: G02B6/00 ,  F21V8/00 ,  G02B5/10 ,  G02F1/1335 ,  G02F1/13357

Abstract: PURPOSE:To provide a sheet for reflectors capable of efficiently making the light of the curved tube part of an L-shaped linear light source or U-shaped linear light source incident on a light transmission plate by curving the sheet and a surface light emitting device formed by using this sheet. CONSTITUTION:This sheet 5 for reflectors is obtd. by cutting a film deposited with silver by evaporation in such a manner that the sheet consists of a base reflection part 11 having a plane L shape, band-shaped side face reflection parts 21, 22 respectively continuously disposed on the outer side of the L-shaped longitudinal side and the outer side of the L-shaped transverse side of the base reflection part 11, a band-shaped front surface reflection part 31 disposed continuously on the outer side of the respective side face reflection parts 21, 22 and a tongue piece 41 disposed continuously from the one end edge of the other side face reflection part in a direction orthogonal with the extension line of the one side face reflection part. Then, the side face reflection parts 21, 22 of the sheet 5 for reflectors of the surface light emitting device on which the L-shaped light linear light source is arranged, are curved and the ends of the light transmission plate are held by the base reflection part 11 and front surface reflection part 32 of the sheet 5 for reflectors. The respective straight tube parts of the L-shaped wire light source is covered with the side face reflection parts 21, 22. The curved tube part of the L-shaped linear light source is covered by bending the tongue piece 41.

公开(公告)号：JPH07141907A

公开(公告)日：1995-06-02

申请号：JP31458193

申请日：1993-11-18

Applicant: NISSHA PRINTING

Inventor： KIRIMURA HIROSHI ,  FUKUSHIMA YUTAKA ,  YAMAMOTO KUNITOSHI

IPC: G02B6/00 ,  F21V3/04 ,  G02F1/1335 ,  G02F1/13357

Abstract: PURPOSE:To provide a downward face emitter with high brightness and high efficiency. CONSTITUTION:A plane fluorescent lamp in which three fluorescent discharge passage are formed is used as a light source 1 and a light diffusing plate 2 is arranged in front of the light source 1. A condensed light transmitting part 3 is provided opposite to the light source 1 for the light diffusing plate 2 so that the portion of the light diffusing plate 2 to which brighter light is illuminated may have a smaller area.

公开(公告)号：JPH0784258A

公开(公告)日：1995-03-31

申请号：JP25492693

申请日：1993-09-16

Applicant: NISSHA PRINTING

Inventor： FUKUSHIMA YUTAKA ,  YAMAMOTO KUNITOSHI

IPC: F21V8/00 ,  G02F1/1335 ,  G02F1/13357

Abstract: PURPOSE:To provide a high-luminance surface light emission device which does not cause a partially dark line or light irregularities. CONSTITUTION:In the surface light emission device constituted so that plural straight linear light sources 1 are arranged in parallel with the back surface of a diffusion plate, a reflecting plate 2 is arranged on the rear surface of the light sources 1, the reflecting plate 2 is provided with a chevron reflection part 3 projecting in parallel with the light sources 1 between the light sources 1 and the peak of the reflection part 3 satisfies the relation of h1>H>h2 (provided that H shows height to the peak of the chevron reflection part from the bottom part of the reflecting plate, (h1) shows height to the upper end of a linear light source tube from the bottom part of the reflecting plate and (h2) shows height to the lower end of the linear light source tube from the bottom part of the reflecting plate), the inclined surface of the reflection part 3 is formed of the plural surfaces and the change of the inclination satisfies the relation of (theta1)>(theta2)>(theta3)>...>(thetan) (provided that (thetan) shows the angle of an interval between the (n)th inclined surface from side near to the bottom of the reflecting plate and the perpendicular of the diffusion plate).