FLAME-RETARDANT POLYMER COMPOSITION AND MOLDED ITEM THEREOF

    公开(公告)号:JPH07304959A

    公开(公告)日:1995-11-21

    申请号:JP4458095

    申请日:1995-03-03

    Abstract: PURPOSE:To obtain the compsn. which is suitable for molded items and contains no halogen flame retardant by compounding a thermoplastic resin with a specific hydroquinone-type arom. oligophosphate or an arom. polyphosphate. CONSTITUTION:A flame-retardant polymer compsn. is obtd. by compounding 100 pts.wt. thermoplastic resin (e.g. a polyester, a phenoxy resin, or polyphenylene oxide) with 0.5-100 pts.wt. flame retardant comprising a hydroquinone-type arom. oligophosphate of formula I (wherein R is H or 1-5C alkyl; Ar to Ar are each phenyl, etc.; n is 0. 5 or higher but lower than 40; and k, m, and k+m are each 0-2) or an arom. polyphosphate. In formula 1, k and m pref. are both 1; n, the number average degree of polymn., is pref. 0.8-15; pref. Ar to Ar are each phenyl, tolyl, etc.; and a pref. example of the oligophosphate is a phosphate of formula II. Further addition of a triazine deriv. and a salt of an (iso)cyanuric acid to the compsn. provides a much higher flame retardance.

    BLOW HOLLOW MOLDING
    62.
    发明专利

    公开(公告)号:JPH04185421A

    公开(公告)日:1992-07-02

    申请号:JP31372390

    申请日:1990-11-19

    Abstract: PURPOSE:To manufacture a molded product of superior blow molding properties and superior resistance to heat, resistance to impact and low water absorption properties by using a composition composed of polyamide, maleimide copolymerized resin, and if required, rubber and with the ratio of apparent melt viscosity in a specified range. CONSTITUTION:A material is a resin composition composed of 10-99wt.% of polyamide resin, 1-90wt.% of maleimide copolymerized resin and 0-30wt.% of acid-modified polyolefin resin, and satisfies the condition of 1n mua10>=10.50-0.04 (T-Tm), mua1/mua100>=3.3 in its apparent melt viscosity. mua1 represents the apparent melt viscosity (poise) at the temperature T( deg.C) and shearing speed 1 (sec ), mua10 represents the apparent melt viscosity (poise) at the temperature T( deg.C) and shearing speed, 10(sec ),mu represents the apparent viscosity (poise) at the temperature T( deg.C) and shearing speed 100 (sec ), and Tm represents the melting point ( deg.C) of polyamide.

    MANUFACTURING METHOD OF POLYOXYMETHYLENE RESIN COMPOSITION

    公开(公告)号:JP2003268195A

    公开(公告)日:2003-09-25

    申请号:JP2002072613

    申请日:2002-03-15

    Abstract: PROBLEM TO BE SOLVED: To provide a polyoxymethylene resin composition so excellent in thermal stability that it can stand a high temperature and long time molding. SOLUTION: To the polyoxymethylene resin composition, a metal salt of a saturated fatty acid, 0.001-5 pts.wt. at least a compound selected from the group consisting of an alkali metal inorganic compound, and then an alkaline earth metal inorganic compound is added to 100 pts.wt. polyoxymethylene resin and then, 0.001-5 pts.wt. metal salt of a saturated fatty acid is added. COPYRIGHT: (C)2003,JPO

    POLYAMIDE RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME

    公开(公告)号:JP2003192890A

    公开(公告)日:2003-07-09

    申请号:JP2001395927

    申请日:2001-12-27

    Abstract: PROBLEM TO BE SOLVED: To provide a polyamide resin composition having the surface appearance and toughness comparable to those of non-reinforced polyamide and exhibiting excellent dimensional stability, strength and rigidity and provide a method for producing the composition. SOLUTION: The polyamide resin composition containing a plate-form aluminum compound dispersed in a polyamide resin is produced by heating (A) a polyamide-forming monomer, (B) water and (C) an aluminum source under pressure to proceed the polymerization reaction of the polyamide and the hydrothermal synthetic reaction of the plate-form aluminum compound in the same reactor. The plate-form aluminum compound is present in an arbitrary cross-section of the polyamide resin composition dispersed at an average length of 20-300 nm and an average thickness of 1-10 nm. COPYRIGHT: (C)2003,JPO

    POLYOXYMETHYLENE RESIN COMPOSITION
    65.
    发明专利

    公开(公告)号:JP2003147162A

    公开(公告)日:2003-05-21

    申请号:JP2001348776

    申请日:2001-11-14

    Abstract: PROBLEM TO BE SOLVED: To provide a polyoxymethylene resin composition having high thermal stability, good moldability and excellent in appearance with little foreign matters. SOLUTION: The polyoxymethylene resin composition contains 100 pts.wt. of a polyoxymethylene resin and 0.01-10 pts.wt. of an alkoxymethylguanamine represented by general formula (I) [wherein R is H, a 1-22C hydrocarbon group, a halo- or nitro-substituted hydrocarbon group, an aryl group, an aralkyl group, or a 3-10C cycloalkyl group; and R1 to R4 are each H or an alkoxymethyl group -CH2 OR' (wherein R' is a 1-8C alkyl group), provided that at least two of R1 to R4 comprise each an alkoxymethyl group].

    POLYAMIDE RESIN COMPOSITION
    67.
    发明专利

    公开(公告)号:JP2001329167A

    公开(公告)日:2001-11-27

    申请号:JP2000153881

    申请日:2000-05-24

    Abstract: PROBLEM TO BE SOLVED: To provide a molded article of a reinforced polyamide resin having excellent specific rigidity and exhibiting higher rigidity by the addition of a small amount of the reinforcing material. SOLUTION: This molded article is produced by the melt-molding of a resin composition composed of (A) 100 pts.wt. of a polycapramide or a copolymerized polyamide containing a capramide component as a main component, (B) 0.1-15 pts.wt. of a swelling lamellar silicate and optionally (C) 10-150 pts.wt. of a non-fibrous reinforcing material. The ratio of α-crystal in the crystal of the polyamide component in the molded article is >=50%.

    POLYAMIDE RESIN COMPOSITION
    68.
    发明专利

    公开(公告)号:JP2001302845A

    公开(公告)日:2001-10-31

    申请号:JP2000120057

    申请日:2000-04-20

    Abstract: PROBLEM TO BE SOLVED: To provide a polyamide resin composition having a feature that the composition and a molded product made thereof are excellent in surface glossiness and also capable of being molded in a short molding cycle in injection molding, and to provide a molded product. SOLUTION: This polyamide resin composition comprising (a) a polyamide and (b) an expansive layered silicate features that (a) the polyamide comprises an amorphous or low crystallinity polyamide and preferably contains hexamethylene isophthalamide unit of 5-30 wt.% and (b) the expansive layered silicate is contained in an amount of 0.1-20 wt.% based on the weight of the polyamide resin composition.

    POLYAMIDE RESIN COMPOSITION AND PREPARATION THEREOF

    公开(公告)号:JP2000212432A

    公开(公告)日:2000-08-02

    申请号:JP1976299

    申请日:1999-01-28

    Abstract: PROBLEM TO BE SOLVED: To obtain a composition exhibiting both high rigidity and tenacity and excellent in flowability in molding by melt-kneading a polyamide resin having its terminal modified with a terminal blocking agent with a swellable phyllosilicate salt. SOLUTION: A polyamide resin is modified with a terminal blocking agent in at least 10% of all the terminal groups. As the terminal blocking agent is preferable a monofunctional compound bearing a 6C or higher hydrocarbyl group. As examples thereof, there can be mentioned palmitic acid, benzoic acid, dodecylamine, benzylamine and the like. As the polyamide resin are preferable, for example, nylon 6, nylon 66, nylon 610 and the like. In a polyamide resin composition, preferably a swellable phyllosilicate salt is uniformly dispersed in a state of single layer or a couple of layers in a polyamide resin matrix. As the swellable phyllosilicate salt, a smectite clay mineral is preferable. Further, the phyllosilicate salt is preferably one having exchangeable cations existing between layers replaced with organic onium ions.

    POLYESTER RESIN COMPOSITION
    70.
    发明专利

    公开(公告)号:JP2000212424A

    公开(公告)日:2000-08-02

    申请号:JP32754199

    申请日:1999-11-17

    Abstract: PROBLEM TO BE SOLVED: To provide a polyester resin composition excellent in rigidity, impact resistance, particularly appearance of its molding by improving insufficient points of a conventional polyester. SOLUTION: A polyester resin composition comprises to (A) 100 pts.wt. of a thermoplastic polyester; (B) 0.1-40 pts.wt. of a phyllosilicate wherein an exchangeable cation existing between layers is exchanged with an organic onium ion; and (C) 0.001-5 pts.wt. of at least one of a montanic acid compound and a lower molecular weight polyolefin. The composition is (A) a polybutylene terephthalate (co)polymer of a thermoplastic polyester wherein the terminal group of COOH is preferably not more than 50 eq/t and the intrinsic viscosity is 0.36-1.60.

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