公开(公告)号：JPH0786469A

公开(公告)日：1995-03-31

申请号：JP23264393

申请日：1993-09-20

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  SASAKI TOMIYA ,  IWASAKI HIDEO

IPC: H01L23/36

Abstract: PURPOSE:To provide an electronic part capable of avoiding degrading the radiation power by reducing the thermal resistance in a connecting member for connecting a semiconductor chip to a wiring layer. CONSTITUTION:It comprises an Si or ceramic substrate 5, wiring layer 4 composed of an insulator and conductor formed on the substrate, thermal-conductor- made columnar members (thermal via-holes) 7 piercing the layer 4, and semiconductor chip 1 secured through a mounting member 2 to the layer 4. Thermally conductive members 8 are disposed near the ends of the thermal via-holes 7 in the member 2.

公开(公告)号：JPH06216285A

公开(公告)日：1994-08-05

申请号：JP6993892

申请日：1992-02-21

Applicant: TOSHIBA CORP

Inventor： FUJIMORI YOSHINORI ,  SASAKI TOMIYA ,  IWASAKI HIDEO ,  MONMA JUN ,  SHIMOTORI KAZUMI

IPC: H01L23/373

Abstract: PURPOSE:To render superior the heat radiation characteristics of a sheet in the thickness-wise direction thereof by the sole use of a thermally conductive flexible fabric, or by the use of that thermally conductive flexible fabric, on the upper part of which electrical insulation members are provided, as a heat radiation sheet. CONSTITUTION:A heat radiation sheet 1 is composed of a thermally conductive flexible fabric 2 which is made of more than two types of material selected from the group consisting of a high-strength extra thin metal line, chemical fiber and carbon fiber. If necessary, electrical insulation areas 3 are provided on the thermally conductive fabric 2. The heat radiation sheet 1 is sandwiched between electronic and electrical components and a heat sink such as a heat radiating fin, whereby heat produced by the electronic and electrical components is effectively transferred in the thickness-wise direction of the heat radiation sheet 1. This makes it possible to lead to efficient cooling by the heat sink.

公开(公告)号：JPH0685121A

公开(公告)日：1994-03-25

申请号：JP25354892

申请日：1992-08-31

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  OU ROHIN ,  SASAKI TOMIYA ,  IWASAKI HIDEO

IPC: H01L23/36 ,  H01L23/467

Abstract: PURPOSE:To provide a heat sink so constituted that cooling fluid is sufficiently supplied even if it is installed on the downstream side of the cooling fluid flow. CONSTITUTION:This heat sinks are installed directly on semiconductor elements 3 mounted on the surface of a substrate 2, and subjected to forced circulation cooling by a cooling fluid flow in the direction of the arrows 4 in the figure. Individual disk-shaped fins comprising the heat sink is provided with a notch 5 in the downstream part thereof so that the flow of the cooling fluid is varied around the heat sinks as indicated by the arrows 6 in the figure.

公开(公告)号：JPH0613491A

公开(公告)日：1994-01-21

申请号：JP7641093

申请日：1993-03-11

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  SASAKI TOMIYA ,  IWASAKI HIDEO ,  MIYAGI TAKESHI ,  MATSUMOTO KAZUHIRO

IPC: H01L23/12 ,  H01L23/36 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14

Abstract: PURPOSE:To provide excellent electric and thermal characteristic performances even though an ultra-high speed element having a large amount of heat generated, by using columnar thermal vias extended to a ceramic substrate and a heat sink located on the opposite surface of a ceramic substrate surface. CONSTITUTION:A multilayer wiring layer 2 is placed on an organic high polymer formed in one united body on an aluminum nitride ceramic substrate 1 and a ceramic substrate 1, and a die pad 2c is formed for attaching and mounting electronic parts located on the surface of the multilayer wiring layer 2. And the multilayer wiring substrate contains columnar thermal vias 4; one end of each via is connected to the die pad 2c, other end passes through the multilayer wiring layer 2, while being insulated electrically from this layer, and is extended to the ceramic wiring substrate 1; and each thermal via 4 efficiently radiate heat generated from a mounted electronic part 3. By doing this, a wiring layer with a low thermal resistance can be created and heat from the semiconductor element can be transmitted fairly well to the substrate.

公开(公告)号：JPH05235218A

公开(公告)日：1993-09-10

申请号：JP3387692

申请日：1992-02-21

Applicant: TOSHIBA CORP

Inventor： FUJIMORI YOSHINORI ,  SASAKI TOMIYA ,  IWASAKI HIDEO ,  MONMA JUN ,  SHIMOTORI KAZUMI

IPC: B32B3/14 ,  B32B7/02 ,  H01L23/36 ,  H01L23/373

Abstract: PURPOSE:To improve a heat radiation characteristic (a heat conductivity) in the direction of sheet thickness by a method wherein an elastic body is provided at least partially on the front or rear surface of a heat conductivity substrate. CONSTITUTION:A heat radiation sheet 1 comprises a heat conductivity substrate 3 and an elastic body 2 provided at least one a part of the front or rear surface. As this elastic body 2, a material having an elastic modulus of 5X10 Pa or less, such as a high polymer material, is favorable. Also, the elastic body 2 is protruded from the surface of the heat conductivity substrate 3, and it is further favorable that the heat conductivity substrate 3 or the elastic body 2 has dielectric properties. Thus, heat can be effectively conveyed in the thickness direction of the heat radiation sheet to absorb external pressure such as a compression stress, etc.

公开(公告)号：JPH05190715A

公开(公告)日：1993-07-30

申请号：JP692192

申请日：1992-01-17

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  SASAKI TOMIYA ,  IWASAKI HIDEO

IPC: H01L23/44

Abstract: PURPOSE:To provide such a boiling cooler as can suppress the overshoot of the temperature of a heater before the refrigerant starting to boil by the heating of the heater. CONSTITUTION:A semiconductor chip 3 mounted vertically on a board 2 is arranged inside a vessel 1 filled with a refrigerant 4, and also a heat exchanger 5 is arranged above inside the vessel 1, and a refrigerant heater 7 is arranged below inside the vessel 1. And, time bubbles 6 of the refrigerant 4 heated by the heating of the refrigerant heater 7 adhere to the surface of the semiconductor chip 3, and a boiling nucleus is made, whereby the start of the bubbling of the refrigerant 4 at the surface of the semiconductor chip 3 is accelerated, and the overshoot of the temperature of the semiconductor chip 3 before the refrigerant 4 starting to boil by the heating of the semiconductor chip 3 can be suppressed.

公开(公告)号：JPH0529514A

公开(公告)日：1993-02-05

申请号：JP18109091

申请日：1991-07-22

Applicant: TOSHIBA CORP

Inventor： KAWANO KOICHIRO ,  MIZUKAMI HIROSHI ,  IWASAKI HIDEO ,  SASAKI TOMIYA ,  KUNO KATSUMI

IPC: H01L23/467

Abstract: PURPOSE:To obtain a cooling equipment capable of effectively cooling a radiator in a cabinet, and prevent the rapid temperature rise inside a cabinet. CONSTITUTION:A cooling equipment 21 is characterized by installing fans 23 on the side of a feeding inlet 11 of cooling liquid for heating elements, which fans concentrate cooling liquid on the respective heating elements supplied in a caninet 3. The heating elements are on a substrate 5 and thermally connected with radiators 9.

公开(公告)号：JPH04294570A

公开(公告)日：1992-10-19

申请号：JP6001491

申请日：1991-03-25

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  MIZUKAMI HIROSHI ,  KAWANO KOICHIRO ,  SASAKI TOMIYA ,  IWASAKI HIDEO

IPC: H01L23/36

Abstract: PURPOSE:To enhance heat radiating effect by increasing fin efficiency. CONSTITUTION:A pin type fin 4 is connected to heat radiating member connecting surfaces 3a, 3b formed almost perpendicular to the upper surface (heat conducting surface) 2a of a semiconductor element 2 of the heat conducting member 3 connected to the upper surface (heat conducting surface) 2a of a semiconductor element 2. The heat generated from the semiconductor element 2 is transferred to each fin 4 through the heat conducting member 3 and is then radiated effectively from the surface of fin 4.

公开(公告)号：JPH04293260A

公开(公告)日：1992-10-16

申请号：JP8316691

申请日：1991-03-22

Applicant: TOSHIBA CORP

Inventor： SASAKI TOMIYA ,  KUNO KATSUMI ,  IWASAKI HIDEO

IPC: H01L23/473

Abstract: PURPOSE:To improve the space utilization efficiency by a method wherein semiconductor chips as the elements to be cooled down are arranged so that the thickness of a cooling down plate and the pitch of the semiconductor chips thermally connected to one another are specified. CONSTITUTION:Multiple semiconductor chips 7 as the elements to be cooled down are evenly arranged with their sides opposite to those of adjacent semiconductor chips in the positions corresponding to respective points of intersection after the lattice pattern at the pitch of Pmm on the surface of a wiring substrate 6. Besides, a cooling down plate as the cooling means for absorbing the heat generated by the semiconductor chips 7 is formed on the rear surface of the substrate 6. Next, the relations between the hydraulic diameter d(mm) of the semiconductor chips 7, the pitch P(mm) between adjacent semiconductor chips 7 and the thickness t(mm) of the semiconductor chips 7 are specified to be P . Through these procedures, said semiconductor chips 7 can be arranged pertinently for improving the space utilization efficiency.

公开(公告)号：JPH04287350A

公开(公告)日：1992-10-12

申请号：JP5229491

申请日：1991-03-18

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  SASAKI TOMIYA ,  IWASAKI HIDEO

IPC: H01L23/427 ,  H05K7/20

Abstract: PURPOSE:To obtain a cooling equipment excellent in cooling efficiency, as a cooling equipment for a heating element of large heating value, e.g. a semicon ductor element and the like. CONSTITUTION:The following are installed: a hollow vessel 3 wherein at least a part of the vessel is thermally fixed to a semiconductor element 1 (heating element), and a heat pipe main body encapsulating refrigerant 4 is constituted, and a fin tube type thermal exchanger 10 constituted of a hollow tube 9 which is linked with said vessel 3 and constitutes a part of a heat pipe, and fins 5 which are thermally connected with said tube 9. The title cooling equipment is constituted by applying the fin tube type heat exchanger 10 to the heat dissipating part of the heat pipe.