公开(公告)号：JP2001057974A

公开(公告)日：2001-03-06

申请号：JP2000174060

申请日：2000-06-09

Applicant: TOSHIBA CORP

Inventor： SASAKI TOMIYA ,  KIMIJIMA SAKAE

IPC: G01T7/00 ,  A61B6/03 ,  G01T1/24

Abstract: PROBLEM TO BE SOLVED: To provide a radiation detector and an X-ray CT apparatus that can make inner temperature more uniform with a relatively simple structure. SOLUTION: The X-ray CT apparatus is equipped with a rotary base 11, an X-ray tube 13 mounted thereon, a radiation detector 15 mounted thereon so as to face the X-ray tube 13 and sandwiching the region to be photographed between the two, and a processor that produces an image based on output of the radiation detector 15. The radiation detector 15 is equipped with a detector panel 25 arraying detecting devices to detect radiation incident from a radiation incidence window 16, an accommodating case 17 that accommodates the detecting panel 25 while mounted on the rotary base 11, and a fluid circulation path 39 formed with the detecting panel 25 and the accommodating case 17.

公开(公告)号：JPH09266391A

公开(公告)日：1997-10-07

申请号：JP7561596

申请日：1996-03-29

Applicant: TOSHIBA CORP

Inventor： SADA YUTAKA ,  SASAKI TOMIYA ,  IWASAKI HIDEO ,  KUNO KATSUMI ,  OMORI AKIMITSU

IPC: F25D1/00 ,  G06F1/20 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To provide a forced air cooling means allowing its mechanism and performance to be freely selected according to the working environment of various electronic apparatus by providing an air blowing means to exhaust a coolant taken into an outer case through an intake hole away from this outer case. SOLUTION: This unit comprises an outer case 1, intake hole 4 at the top of the case 1 so as to communicate with an exhaust hole 3 of an apparatus 2 which needs the forced air cooling, exhaust hole 5 to exhaust a coolant air taken from the apparatus 2 through the hole 4, and air blowing means 6 such as blower fan for guide the air to the exhaust hole 5 from the intake hole 4. When this unit is mounted in the apparatus 2 in the arrow-marked direction B, the hot coolant air is deflected to a direction A, this enabling this air to be wasted through other part than the exhaust hole 3. If this unit having an intake hole 5 located at a different position is connected to the apparatus 2, the hot air can be exhausted at desired position.

公开(公告)号：JPH0951188A

公开(公告)日：1997-02-18

申请号：JP13848896

申请日：1996-05-31

Applicant: TOSHIBA CORP

Inventor： SASAKI TOMIYA ,  IWASAKI HIDEO

IPC: G01R31/26 ,  H01L21/66 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To make it possible to cool a high-density mounting type circuit board uniformly and efficiently by providing nozzle pipes having jet nozzles and supply pipes supplying a cooling material to the nozzle pipes between a plurality of substrates mounting integrated circuits. SOLUTION: Substrates 27 inside a substrate storing portion 16 are arranged radially at predetermined intervals mutually normal to an upper lid of a case 14 so as to surround a microscope cylinder 13. A supply pipe 19 for supplying a cooling material is located on a peripheral surface inside the substrate storing portion 16. A cooling medium supply pipe 36 for supplying a cooling material from the outside of tone substrate storing portion 16 to the supply pipe 19 is connected to the supply pipe 19. A nozzle pipe 22 is connected to the supply pipe 19, and the nozzle pipe 22 is arranged without contact to an IC28. The nozzle pipe 22 has holes 23 (jet holes) for jetting the cooling material on the surface facing the substrate 27, at least one is provided for each IC28 on the substrate 27.

公开(公告)号：JPH07181223A

公开(公告)日：1995-07-21

申请号：JP32554793

申请日：1993-12-24

Applicant: TOSHIBA CORP

Inventor： SASAKI TOMIYA ,  IWASAKI HIDEO

IPC: G01R31/26 ,  H01L21/66

Abstract: PURPOSE:To provide an inspection apparatus of a semiconductor device capable of performing a good inspection by lowering the difference of a cooling effect due to the positioning of a circuit board. CONSTITUTION:In an inner section of a circuit board housing body 16 wherein a plurality of circuit boards 27 are radially installed, an outer cooling path 18 and an inner cooling path 20 in which cooling gas flows respectively are provided by being connected to an outer path pipe 19 and an inner path pipe 21, respectively. Between both of the cooling paths 18, 20, cooling branch paths 23 extending to respective gaps of the circuit boards 27 and are provided by being connected to respective branch path pipes 22. Heat contacting elements provided to the branch path pipes 22 are in contact with large scale integrated circuits 28. Thereby, each of the large scale integrated circuit 28 of the respective circuit board 27 is thermally connected to the cooling branch path 23 in the same condition so that the cooling conditions of respective circuit boards are equalized. As a result, difference of a cooling effect due to the different positions of the circuit boards 27 is lowered and the cooling effect is enhanced so that it is possible to perform a good inspection of an integrated circuit device 34.

公开(公告)号：JPH05299545A

公开(公告)日：1993-11-12

申请号：JP3057593

申请日：1993-02-19

Applicant: TOSHIBA CORP

Inventor： SASAKI TOMIYA ,  IWASAKI HIDEO ,  KUNO KATSUMI ,  MONMA JUN ,  FUJIMORI YOSHINORI ,  SHIMOTORI KAZUMI ,  SORI NAOYUKI

IPC: H01L23/373

Abstract: PURPOSE:To provide a heat dissipation body, which is superior in heat dissipation characteristics (heat conductivity) in its thickness direction and has a superior adhesion to a component to be cooled. CONSTITUTION:A heat dissipation body is constituted of an aggregate 3a consisting of heat conductive materials 2a made of at least one kind selected from among a metallic fiber, a thin metal wire, a metal foil and a ceramic fiber. Moreover, the heat dissipation body consists of the aggregate 3a and a matrix resin 4a filled in gap parts in this aggregate 3a. It is better to constitute the heat dissipation body in such a way that at least part of the aggregate 3a is exposed on the surface and rear of the resin 4a. Moreover, it is better to set the ratio of the whole exposed area of the aggregate 3a to the surface area of the heat dissipation body 1a to be 1% or higher.

公开(公告)号：JPH05121607A

公开(公告)日：1993-05-18

申请号：JP28276291

申请日：1991-10-29

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  KAWANO KOICHIRO ,  SASAKI TOMIYA ,  IWASAKI HIDEO

IPC: H01L23/40

Abstract: PURPOSE:To provide a support, which can press a cooling means against a heat generating element without lowering the degree of freedom at the time of designing the wiring of its substrate. CONSTITUTION:At the time of mounting a semiconductor element 3 connected with wiring pins 2 on a substrate, the body 11 of the support connected with pins 12 is also mounted on the substrate 1 by means of a similar mounting means. After mounting the body 11, a bolt 13 fixed to the top of the body 11 is passed through a hole 4b formed through the step section 4a of a cooling system 4 and held in its place with a nut 14. Therefore, the cooling system 4 can be pressed against the semiconductor element 3 without forming holes, etc., through the substrate 1.

公开(公告)号：JPH053272A

公开(公告)日：1993-01-08

申请号：JP20085991

申请日：1991-08-09

Applicant: TOSHIBA CORP

Inventor： MIZUKAMI HIROSHI ,  MAEDA TOSHIO ,  TERAJIMA TOSHINORI ,  SASAKI TOMIYA ,  KUNO KATSUMI ,  IWASAKI HIDEO ,  KAWANO KOICHIRO

IPC: H01L23/36 ,  F28F3/02 ,  H01L23/367 ,  H01L23/427 ,  H05K7/20

Abstract: PURPOSE:To provide a title invention which can be manufactured easily free in shape, size, and array of the fin division. CONSTITUTION:A stacked body 14 is provided with a plurality of heatsink fin elements 12 stacked via spacers 13 spacing out them as predetermined: every element 12 has pin fins 17 constituted with a plurality of slits 16 cut in a thin plate 15 formed of a thermal conductor.

公开(公告)号：JPH04139754A

公开(公告)日：1992-05-13

申请号：JP26209490

申请日：1990-09-29

Applicant: TOSHIBA CORP

Inventor： ISHIZUKA MASARU ,  SASAKI TOMIYA ,  IWASAKI HIDEO ,  KUNO KATSUMI ,  FUKUOKA YOSHITAKA

IPC: H01L23/373

Abstract: PURPOSE:To reduce a thermal resistance by transferring heat generated from a heat generating element to a heat transfer block through a board, dissipating it by cooling means provided integrally with the block, and also transferring it to a cap through substance having high thermal conductivity sealed in the cap. CONSTITUTION:When heat is generated from a semiconductor chip 1, the heat is transferred from the bottom 3b to the side 3d of a heat transfer block 3 through a board 2, and dissipated from upper fins 3c. Part of the heat generated from the chip 1 is transferred to a cap 7 through helium gas. One type of heat pipe is formed with the cap 7 as a heat source and with the fins 3c as a cool source, and the heat of the cap 7 is dissipated to the fins 3c through substitute chlorofluorocarbon. Thus, even if many wiring pins for electric connection are provided on the back of the board 2, the heat generated from the chip 1 can be effectively transferred to the fins 3c of cooling means by reducing thermal resistance.

公开(公告)号：JPH04139752A

公开(公告)日：1992-05-13

申请号：JP25885090

申请日：1990-09-29

Applicant: TOSHIBA CORP

Inventor： SASAKI TOMIYA ,  KUNO KATSUMI ,  IWASAKI HIDEO ,  ISHIZUKA MASARU ,  MAEDA TOSHIO

IPC: H01L23/36

Abstract: PURPOSE:To efficiently transfer heat generated from a heat generator to a package through fine wirings and to improve a cooling efficiency by arranging the thin wires having high thermal conductivity to be arranged so that the generator is brought into contact with the inner surface of the enclosure. CONSTITUTION:When heat is generated form a semiconductor chip 1, the heat is transferred to a heat transfer block 3 through fine metallic thin wires 6. The heat of the chip 1 transferred to the block 2 is externally dissipated via fins 7 connected to the block 3. Part of the heat generated from the chip 1 is also transferred to a board 2 through a bump 4. Since the thin wires 6 in contact with the chip 1 have elasticity, even if the chip 1 has irregular height, a gradient, they absorb it to effectively bring into contact with the chip 1, thereby satisfactorily transferring the heat of the chip 1 to the block 3. Since the thin wires 6 are secured to the entire inner surface of the block 3, the ends of the wirings 6 are brought into contact with the chip 1 irrespective of the array of the chips 1 to transfer the heat to the block 3.

公开(公告)号：JPH04139751A

公开(公告)日：1992-05-13

申请号：JP25884990

申请日：1990-09-29

Applicant: TOSHIBA CORP

Inventor： IWASAKI HIDEO ,  SASAKI TOMIYA ,  KUNO KATSUMI ,  ISHIZUKA MASARU

IPC: H01L23/36

Abstract: PURPOSE:To bring the end of a cooling stud into close contact with a heat generator without irregularity by elastic operation of sealing means and to reduce thermal resistance by elastically sealing the side of the stud to be thermally connected to the generator elastically from a passage in which cooling medium flows, by the sealing means. CONSTITUTION:Since a cooling stud 5 is elastically supported by bellows 9, a force for moving the stud 5 is produced by the bellows 9 so that the end of the stud 5 is brought into close contact with a semiconductor chip 1, and the stud 5 is pressed to the chip 1 in a close contact state by the elastic force of a spring 10. Thus, since an irregular contact state is corrected by the force exerted by the bellows 9, the stud 5 is not irregularly brought into contact, but brought into close contact with the chip 1, and brought into direct contact with cooling medium 7 to reduce its thermal resistance.