公开(公告)号：US07192529B2

公开(公告)日：2007-03-20

申请号：US10628275

申请日：2003-07-29

Applicant: Mitsuru Hasegawa ,  Akihiro Miyauchi

Inventor： Mitsuru Hasegawa ,  Akihiro Miyauchi

IPC: B44C1/22 ,  C25F3/00 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

CPC classification number: B82Y10/00 ,  B29C33/424 ,  B29C43/36 ,  B81C99/009 ,  B81C2201/036 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017 ,  H01L21/76817

Abstract: A stamper includes a substrate and a plurality of protrusions of different heights formed on one of the surfaces of the substrate, the protrusions of larger height having a stack structure formed of at least two layers of at least two types of materials, thereby transferring a plurality of patterns at the same time.

Abstract translation: 压模包括基板和形成在基板的一个表面上的不同高度的多个突起，较大高度的突起具有由至少两层至少两种类型的材料形成的堆叠结构，从而传输多个 的模式在同一时间。

公开(公告)号：US07007709B2

公开(公告)日：2006-03-07

申请号：US10843949

申请日：2004-05-12

Applicant: Guillaume Guzman ,  Jean-Pierre Themont

Inventor： Guillaume Guzman ,  Jean-Pierre Themont

IPC: F17D1/16 ,  F15C1/06

CPC classification number: B81C1/00119 ,  B01L3/5027 ,  B33Y70/00 ,  B33Y80/00 ,  B81B2201/058 ,  B81B2203/0353 ,  B81C1/00071 ,  B81C2201/019 ,  B81C2201/036 ,  C03B19/063 ,  C03B23/20 ,  Y10T137/0391 ,  Y10T137/0402 ,  Y10T137/2224 ,  Y10T137/6416

Abstract: The present invention relates to microfluidic devices and to their method of manufacture. The microfluidic devices are original by their specific structure (of sandwich type) and by the materials from which they are made (mainly glasses, glass ceramics, ceramics), and also by their specific method of manufacture, which is based on a vacuum-forming operation. The microfluidic device includes a first assembly including a microstructure and a first substrate, wherein the microstructure is constructed and arranged on the substrate under vacuum. A second assembly includes a second substrate positioned on the microstructure after the first assembly is presintered and adhered thereto by heat treatment to form a one-piece microstructure defining at least one recess between the first and second substrates.

公开(公告)号：US06974549B2

公开(公告)日：2005-12-13

申请号：US10320683

申请日：2002-12-17

Applicant: Masaru Ohgaki

Inventor： Masaru Ohgaki

IPC: G11B7/26 ,  B81C1/00 ,  C03C17/22 ,  C03C17/34 ,  G02B6/12 ,  G02B6/124 ,  G02B6/13 ,  C23F1/00

CPC classification number: G02B6/13 ,  B81C1/0046 ,  B81C2201/036 ,  C03C17/225 ,  C03C17/3435 ,  C03C17/3482 ,  C03C2218/33 ,  C03C2218/34 ,  G02B6/124 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12107 ,  G02B2006/12173 ,  G02B2006/12176

Abstract: A method for forming fine grooves including forming a first silicon-nitride layer on a substrate, forming a first poly-silicon layer on the first silicon-nitride layer, forming a second silicon-nitride layer on the first poly-silicon layer, patterning the second silicon-nitride layer, etching the first poly-silicon layer using the patterned second silicon-nitride layer as a mask, forming at least one patterned oxidized portion of the first poly-silicon layer by oxidizing the substrate, first silicon-nitride layer, etched first poly-silicon layer, and patterned second silicon-nitride layer, removing the patterned second silicon-nitride layer and etched first poly-silicon layer such that the first silicon-nitride layer and at least one patterned oxidized portion of the first poly-silicon layer remain on the substrate, and forming a plurality of fine grooves over the substrate by plasma etching the first silicon-nitride layer using the at least one patterned oxidized portion of the first poly-silicon layer as a mask.

Abstract translation: 一种用于形成细槽的方法，包括在基板上形成第一氮化硅层，在第一氮化硅层上形成第一多晶硅层，在第一多晶硅层上形成第二氮化硅层， 使用所述图案化的第二氮化硅层作为掩模蚀刻所述第一多晶硅层，通过氧化所述衬底，形成所述第一多晶硅层的至少一个图案化氧化部分，第一氮化硅层， 蚀刻的第一多晶硅层和图案化的第二氮化硅层，去除图案化的第二氮化硅层和蚀刻的第一多晶硅层，使得第一氮化硅层和第一多晶硅层的至少一个图案化氧化部分， 硅层保留在衬底上，并且通过使用第一氮化硅层的至少一个图案化氧化部分等离子体蚀刻第一氮化硅层来在衬底上形成多个细槽 多晶硅层作为掩模。

公开(公告)号：US06893966B2

公开(公告)日：2005-05-17

申请号：US10307069

申请日：2002-11-27

Applicant: Emmanuel Delamarche ,  Matthias Geissler ,  Heiko Wolf

Inventor： Emmanuel Delamarche ,  Matthias Geissler ,  Heiko Wolf

IPC: B81C1/00 ,  G01Q60/00 ,  G01Q70/00 ,  G03F7/00 ,  H01L21/302 ,  H01L21/461

CPC classification number: G03F7/0002 ,  B81C1/0046 ,  B81C2201/036 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C23F1/02

Abstract: There is disclosed a method of patterning an article (10) including a layer (12) of copper formed onto an insulating substrate (11) using a positive microcontact printing (MCP) process. In a preferred embodiment where the metal is copper (Cu) and the substrate is a silicon wafer, the method includes removing the native oxide presents on the Cu in a solution of HCl. Then, a stamp (13′) having a patterned polydimethylsiloxane (PDMS) body (14) is linked with a 0.2 mM solution of pentaerythritol-tetrakis(3-mercaptopropionate) (PTMP) in ethanol for 1 min, to form the inking layer (15′). The stamp is applied on the Cu layer to print a first self-assembled monolayer (SAM) (16′) according to a desired pattern. The article is dipped in a solution of ECT which is then adsorbed only in the non printed regions, forming a second SAM (18) in a configuration that is complementary to the desired pattern. Finally, the printed areas of the Cu layer are removed using a peroxodisulfate etch bath.

Abstract translation: 公开了一种使用正微接触印刷（MCP）工艺将包含形成在绝缘基板（11）上的铜层（12）的物品（10）图案化的方法。 在金属是铜（Cu）并且衬底是硅晶片的优选实施方案中，该方法包括在HCl溶液中除去存在于Cu上的天然氧化物。 然后，将具有图案化聚二甲基硅氧烷（PDMS）体（14）的印模（13'）与0.2mM季戊四醇四（3-巯基丙酸酯）（PTMP）在乙醇中的溶液连接1分钟，形成着墨层 15'）。 将印模施加在Cu层上以根据期望的图案印刷第一自组装单层（SAM）（16'）。 将物品浸入ECT溶液中，然后将其吸附在非印刷区域上，形成与期望图案互补的构型的第二SAM（18）。 最后，使用过氧化二硫酸盐蚀刻浴去除Cu层的印刷区域。

公开(公告)号：US20040164454A1

公开(公告)日：2004-08-26

申请号：US10373251

申请日：2003-02-24

Applicant: The Procter & Gamble Company

Inventor： Vladimir Gartstein ,  Faiz Feisal Sherman

IPC: B29C043/22

CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B26F1/24 ,  B26F1/26 ,  B81B2201/055 ,  B81C2201/034 ,  B81C2201/036

Abstract: A method is provided for manufacturing microstructures of the type which contain a substrate and an array of protruding microelements with through-holes, which are used in penetrating layers of skin. The microelements are embossed or pressed into an initial substrate structure, which in some embodiments is formed from extruded polymeric material, and in some cases from two layers of polymer that are co-extruded. The through-holes are formed from filled through-cylinders of a second material that is removed after the embossing or pressing step; in other instances, the through-holes are left hollow during the embossing or pressing step.

Abstract translation: 提供了一种用于制造包含基底的微结构的方法和具有通孔的突出微元件阵列，其用于穿透皮肤层。 微元件被压花或压制成初始的基底结构，其在一些实施方案中由挤出的聚合物材料形成，并且在一些情况下由共挤出的两层聚合物形成。 通孔由在压花或压制步骤之后被去除的第二材料的填充的通孔形成; 在其他情况下，在压花或压制步骤期间，通孔留空。

公开(公告)号：US20030127429A1

公开(公告)日：2003-07-10

申请号：US10320683

申请日：2002-12-17

Inventor： Masaru Ohgaki

IPC: C03C015/00 ,  C03C025/68

CPC classification number: G02B6/13 ,  B81C1/0046 ,  B81C2201/036 ,  C03C17/225 ,  C03C17/3435 ,  C03C17/3482 ,  C03C2218/33 ,  C03C2218/34 ,  G02B6/124 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12107 ,  G02B2006/12173 ,  G02B2006/12176

Abstract: Disclosed is a method for forming fine grooves capable of forming stably a pattern in order of null without requiring an expensive device and accomplishing high density of disc land & grooves. The method comprises a first process for forming a first silicon-nitride layer on a substrate; a second process for forming a first poly-silicon layer on the first silicon-nitride layer; a third process for forming a second silicon-nitride layer on the first poly-silicon layer; a fourth process for patterning the second silicon-nitride layer; a fifth process for etching the first poly-silicon layer using a mask of the patterned second silicon-nitride layer; a sixth process for forming a pattern of oxidized layer on a portion of said first poly-silicon layer by oxidizing the entire substrate formed through the first to fifth processes; and a seventh process for etching a portion of the poly-silicon layer except for the second silicon-nitride layer and the pattern of oxidized layer.

Abstract translation: 公开了一种用于形成能够以不需要昂贵的装置并且实现高密度盘片和凹槽的顺序稳定地形成图案的细槽的方法。 该方法包括在衬底上形成第一氮化硅层的第一工艺; 用于在第一氮化硅层上形成第一多晶硅层的第二工艺; 用于在所述第一多晶硅层上形成第二氮化硅层的第三工艺; 用于图案化第二氮化硅层的第四工艺; 使用所述图案化的第二氮化硅层的掩模蚀刻所述第一多晶硅层的第五工艺; 通过氧化通过第一至第五工艺形成的整个基板，在所述第一多晶硅层的一部分上形成氧化层图案的第六工艺; 以及用于蚀刻除了第二氮化硅层之外的多晶硅层的一部分和氧化层的图案的第七工艺

公开(公告)号：US20030062089A1

公开(公告)日：2003-04-03

申请号：US10163215

申请日：2002-06-04

Inventor： Guillaume Guzman ,  Jean-Pierre Themont

IPC: F15C001/06

CPC classification number: B81C1/00119 ,  B01L3/5027 ,  B33Y70/00 ,  B33Y80/00 ,  B81B2201/058 ,  B81B2203/0353 ,  B81C1/00071 ,  B81C2201/019 ,  B81C2201/036 ,  C03B19/063 ,  C03B23/20 ,  Y10T137/0391 ,  Y10T137/0402 ,  Y10T137/2224 ,  Y10T137/6416

Abstract: The present invention relates to microfluidic devices and to their method of manufacture. The microfluidic devices are original by their specific structure (of sandwich type) and by the materials from which they are made (mainly glasses, glass ceramics, ceramics), and also by their specific method of manufacture, which is based on a vacuum-forming operation. The microfluidic device includes a first assembly including a microstructure and a first substrate, wherein the microstructure is constructed and arranged on the substrate under vacuum. A second assembly includes a second substrate positioned on the microstructure after the first assembly is presintered and adhered thereto by heat treatment to form a one-piece microstructure defining at least one recess between the first and second substrates.

Abstract translation: 本发明涉及微流体装置及其制造方法。 微流体装置通过它们的具体结构（夹心型）和它们制备的材料（主要是玻璃，玻璃陶瓷，陶瓷）以及它们的具体制造方法是原始的，其基于真空成形 操作。 微流体装置包括包括微结构和第一基底的第一组件，其中微结构在真空下构造和布置在基底上。 第二组件包括位于微结构体上的第二衬底，该第一衬底经预热烧结并通过热处理粘附在微结构上，以形成限定第一和第二衬底之间的至少一个凹部的一体式微结构。

公开(公告)号：US11931225B2

公开(公告)日：2024-03-19

申请号：US17132358

申请日：2020-12-23

Applicant: International Business Machines Corporation

Inventor： Huan Hu ,  Minhua Lu ,  Vince Siu ,  Gustavo Alejandro Stolovitzky

IPC: A61F13/00 ,  A61F13/02 ,  B29C35/02 ,  B29C39/26 ,  B29C59/02 ,  B29C65/48 ,  B29L31/00 ,  B81C99/00

CPC classification number: A61F13/00063 ,  A61F13/01021 ,  A61F13/0246 ,  A61F13/0289 ,  B29C35/02 ,  B29C39/26 ,  B29C65/48 ,  B81C99/0085 ,  A61F2013/00327 ,  B29C2059/023 ,  B29L2031/753 ,  B81C2201/036

Abstract: One or more embodiments include antimicrobial bandages with nanostructures, formation thereof, and usage thereof to facilitate wound healing. In one embodiment, a bandage apparatus that facilitates healing a wound is provided. The bandage apparatus includes a substrate having an attachment mechanism that facilitates removably attaching the substrate to a part of a body having the wound. The bandage apparatus also includes a nanostructure film provided on a surface of the substrate and configured to contact the wound when the substrate is attached to the part of the body having the wound, wherein the nanostructure film includes a plurality of nanostructures.

公开(公告)号：US08409488B2

公开(公告)日：2013-04-02

申请号：US10562014

申请日：2004-06-22

Applicant: Tormen Massimo

Inventor： Tormen Massimo

IPC: B29C55/00

CPC classification number: G03F7/0002 ,  B29C33/02 ,  B81C99/0085 ,  B81C2201/0153 ,  B81C2201/036 ,  B82Y10/00 ,  B82Y40/00

Abstract: A lithographic process for forming a pattern in relief (20) on a mass (10) of polymeric material comprises the steps of: preparing the mass (10) of polymeric material and a die (12) having a surface region (14) facing towards the mass (10) of polymeric material and which reproduces in negative the pattern in relief (20); heating the die (12) and putting the mass (10) of polymeric material into contact with the die (12) in any temporal sequence, in such a way that the part of the mass (10) of polymeric material in contact with the surface zone (14) is subject to softening; and separating the die (12) from the mass (10) of polymeric material on the surface of which the pattern in relief (20) has been formed. The heating of at least one part of the die (12) is obtained by generation of thermal energy upon dissipation of another form of energy in at least one region (16) of the die (12).

Abstract translation: 用于在聚合物材料（10）上形成浮雕（20）中的图案的平版印刷工艺包括以下步骤：制备聚合物材料块（10）和模具（12），所述模具（12）具有面向 聚合物材料的质量（10）并且以凹凸（20）的形式呈现为负值; 加热模具（12）并将聚合材料的质量块（10）以任何时间顺序与模具（12）接触，使得聚合材料质量（10）的与表面接触的部分 区域（14）容易软化; 以及将模具（12）与形成有凹凸图案（20）的表面上的聚合材料块（10）分离。 模具（12）的至少一部分的加热通过在模具（12）的至少一个区域（16）中消散另一形式的能量时产生热能而获得。

公开(公告)号：US08252189B2

公开(公告)日：2012-08-28

申请号：US12468300

申请日：2009-05-19

Applicant: Kwangyeol Lee

Inventor： Kwangyeol Lee

IPC: B44C1/22 ,  C25F3/00 ,  H01L21/311 ,  B05D1/32

CPC classification number: B29C33/3857 ,  B81C1/00031 ,  B81C2201/036

Abstract: A method for manufacturing a nano structure includes forming a stamp having a line pattern on a surface thereof, positioning the stamp upon a substrate, forming at least one protruded portion in the substrate substantially corresponding to the line pattern of the stamp, forming a protective coating layer on at least a portion of the at least one protruded portion, and removing a portion of the substrate by etching at least another portion of the at least one protruded portion not covered with the protective coating layer.

Abstract translation: 制造纳米结构的方法包括在其表面上形成具有线图案的印模，将印模定位在基板上，基本上对应于印模的线图案在基板上形成至少一个突出部分，形成保护涂层 在所述至少一个突出部分的至少一部分上，并且通过蚀刻所述至少一个未被所述保护涂层覆盖的突出部分的另一部分来移除所述基板的一部分。