公开(公告)号：KR100468783B1

公开(公告)日：2005-01-29

申请号：KR1020030008450

申请日：2003-02-11

Applicant: 삼성전자주식회사

Inventor： 임윤혁 ,  백중현 ,  김민하

IPC: H01L23/50

CPC classification number: H01L23/4093 ,  F28F2280/105 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Some embodiments of the invention include two heat exchange members, which are arranged facing each other with a semiconductor module therebetween, the semiconductor module including a plurality of packages; a connection member formed in the middle of each of the heat exchange members to hinge join the heat exchange members such that portions of the heat exchange members protrude above the semiconductor module inserted between the heat exchange members; and an elastic member disposed between the heat exchange members to provide a force pushing portions of the heat exchange members below the connection member toward the packages of the semiconductor module. Other embodiments of the invention are described in the claims.

Abstract translation: 本发明的一些实施例包括两个热交换构件，所述两个热交换构件彼此面对设置，其间具有半导体模块，所述半导体模块包括多个封装; 连接构件，形成在每个热交换构件的中间以铰链连接热交换构件，使得热交换构件的一部分在插入热交换构件之间的半导体模块上方突出; 以及设置在热交换构件之间的弹性构件，以提供力将连接构件下方的热交换构件的部分推向半导体模块的封装。 在权利要求中描述了本发明的其他实施例。

公开(公告)号：KR1020040001019A

公开(公告)日：2004-01-07

申请号：KR1020020036075

申请日：2002-06-26

Applicant: 삼성전자주식회사

Inventor： 백중현 ,  이태구 ,  김민하

IPC: H01L23/36

CPC classification number: H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2225/06558 ,  H01L2924/15311

Abstract: PURPOSE: A multi chip package and its module is provided to improve heat release characteristics of CSP(Chip Scale Package) type MCP(Multi Chip Package). CONSTITUTION: A center pad type chip and an edge pad type chip are mounted in one package. Bonding wires(125,127) provides an electrical connection between the two chips and a printed circuit board(120) of the package. At the opposite side of the printed circuit board(120), micro ball grid array is provided. A metal conductor(142) is mounted on the top surface of the upper chip(108) of the package to enhance heat release characteristics even if power dissipation of the contained chips is increased. The thickness of the metal conductor(142) is ranged from 20μm to 100μm.

Abstract translation: 目的：提供多芯片封装及其模块，以改善CSP（芯片级封装）型MCP（多芯片封装）的散热特性。 构成：中心焊盘式芯片和边缘焊盘式芯片安装在一个封装中。 接合线（125,127）提供两个芯片和封装的印刷电路板（120）之间的电连接。 在印刷电路板（120）的相对侧，提供微球格栅阵列。 即使所包含的芯片的功率消耗增加，金属导体（142）安装在封装的上部芯片（108）的顶表面上，以增强散热特性。 金属导体（142）的厚度范围为20μm至100μm。

公开(公告)号：KR100389920B1

公开(公告)日：2003-07-04

申请号：KR1020000075484

申请日：2000-12-12

Applicant: 삼성전자주식회사

Inventor： 김민하 ,  백중현

IPC: H01L23/40

CPC classification number: H01L23/3677 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2224/0401

Abstract: 솔더볼(solder ball)을 외부연결단자로 사용하는 반도체 소자를 포함하는 반도체 모듈에서, 열팽창 계수의 차이에 기인하여 발생한 솔더 결합 신뢰도(SJR: Solder Joint Reliability) 저하 문제를 개선할 수 있는 반도체 모듈에 관해 개시한다. 본 발명에 의한 메모리 모듈은, 모듈 보오드, 상부 방열판, 하부 방열판 및 체결수단으로 이루어지고, 상기 체결수단은 상부 방열판 및 상기 하부 방열판과, 모듈 보오드의 열팽창계수의 차이에 의해 반도체 모듈 내부에서 발생되는 수축 및 팽창 정도를 흡수할 수 있는 구조이다.

Abstract translation: 提供一种包括使用焊球作为外部连接端子的半导体器件的半导体存储器模块，其减少了由于模块组件的热膨胀系数的差异导致的焊料接合可靠性（SJR）的恶化。 存储器模块包括模块板，上部散热器，下部散热器和连接装置。 由于上部散热器，下部散热器和模块板的不同热膨胀系数，连接装置被形成为具有能够吸收半导体模块内的收缩和膨胀的结构。

公开(公告)号：KR100382726B1

公开(公告)日：2003-05-09

申请号：KR1020000070493

申请日：2000-11-24

Applicant: 삼성전자주식회사

Inventor： 백중현 ,  김민하

IPC: H01L23/42

CPC classification number: H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus for cooling a semiconductor package and preventing heat concentration at the central part of a heat sink includes a heat sink for cooling mounted on a semiconductor package and a fan installed over the heat sink. The heat sink includes a base plate, a support bar installed over the base plate for supporting the fan, a plurality of parallel fins, whose lengths decrease in size from a peripheral part to a central part of the heat sink. The parallel fins extend from the base plate. The heat sink further includes air guide plates for guiding air flow in the heat sink to the central part thereof.

Abstract translation: 一种用于冷却半导体封装并防止散热器的中心部分处的热量集中的装置包括安装在半导体封装上的用于冷却的散热器和安装在散热器上的风扇。 散热器包括基板，安装在基板上用于支撑风扇的支撑杆，多个平行鳍片，其长度从散热器的外围部分到中心部分的尺寸减小。 平行翅片从底板延伸。 散热器还包括用于将散热器中的空气流动引导至其中心部分的空气引导板。

公开(公告)号：KR1020020046003A

公开(公告)日：2002-06-20

申请号：KR1020000075484

申请日：2000-12-12

Applicant: 삼성전자주식회사

Inventor： 김민하 ,  백중현

IPC: H01L23/40

CPC classification number: H01L23/3677 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2224/0401

Abstract: PURPOSE: A semiconductor module capable of improving a decrease of reliability caused by thermal expansion is provided to improve solder joint reliability, by making a coupling unit absorb contraction and expansion caused by a thermal expansion coefficient difference generated from respective parts constituting the semiconductor memory module. CONSTITUTION: A plurality of semiconductor devices are stacked on the upper and lower portions of a printed circuit board(PCB) having a module board(100). A pin connector unit is formed in the module board to be connected to another substrate. An upper heat spreader(102) caps the upper portion of the module board except the pin connector unit, in contact with the upper surface of the semiconductor devices stacked on the module board. A lower heat spreader(104) caps the lower portion of the module board except the pin connector unit, in contact with the lower surface of the semiconductor devices stacked under the module board. The coupling unit(106) fixes the upper and lower heat spreaders wherein the module board is positioned between the upper and lower heat spreaders.

Abstract translation: 目的：通过使耦合单元吸收由构成半导体存储器模块的各个部件产生的热膨胀系数差导致的收缩和膨胀，提供能够改善由热膨胀引起的可靠性降低的半导体模块，以提高焊点可靠性。 构成：在具有模块板（100）的印刷电路板（PCB）的上部和下部堆叠多个半导体器件。 一个针连接器单元形成在模块板中，以连接到另一个基板。 上部散热器（102）盖住除了插头连接器单元之外的模块板的上部，与堆叠在模块板上的半导体器件的上表面接触。 下部散热器（104）覆盖模块板的除了针连接器单元的下部，与堆叠在模块板下方的半导体器件的下表面接触。 联接单元（106）固定上部和下部散热器，其中模块板位于上部和下部散热器之间。

公开(公告)号：KR1020020040447A

公开(公告)日：2002-05-30

申请号：KR1020000070493

申请日：2000-11-24

Applicant: 삼성전자주식회사

Inventor： 백중현 ,  김민하

IPC: H01L23/42

CPC classification number: H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PURPOSE: A cooling apparatus of a semiconductor device is provided to prevent the phenomenon of a thermal-concentration on a center of a heat sink by effectively guiding an injected air to the center of the heat sink through improving the structure of the cooling apparatus. CONSTITUTION: A cooling apparatus comprises a heat sink(113) for thermal-radiation formed on a semiconductor package(105), and a fan(118) formed on the heat sink(113). The heat sink(113) further includes a supporting plate(106), supporting pipes(108) for supporting the fan(118) located on the supporting plate(106), a plurality of parallel pins(110) having different length. The length of the pins(110) is getting smaller to the center direction so as to guide air to the center of the heat sink(113), and an air guide plate(112) is connected to the supporting pipes(108).

Abstract translation: 目的：提供一种半导体装置的冷却装置，通过改善冷却装置的结构，有效地将注入的空气引导到散热器的中心，以防止散热器中心的热浓缩现象。 构成：冷却装置包括形成在半导体封装（105）上的用于热辐射的散热器（113）和形成在散热器（113）上的风扇（118）。 散热器（113）还包括支撑板（106），用于支撑位于支撑板（106）上的风扇（118）的支撑管（108），具有不同长度的多个平行销（110）。 销110的长度越来越小于中心方向，将空气引导到散热器113的中心，导气板112与支撑管108连接。