Abstract:
PURPOSE: A multilayer wafer is to form a porous silicon or a porous oxidized silicon as a sacrifice layer, thereby securing an enough space between a substrate and a depending structure. CONSTITUTION: A method of a multilayer wafer comprises steps of: preparing a doped p¬+ and n¬+ wafer as a substrate wafer(1); forming a porous silicon layer by a predetermined thickness on a surface of the wafer by an anode reaction; making an oxidized a porous silicon layer(3) by oxidizing the porous silicon layer using a thermal oxidation process; depositing a poly silicon seed layer on the porous oxidized silicon layer using a method of chemical vapor deposition; growing an epitaxial poly-silicon layer on the porous oxidized silicon layer using the poly-silicon seed layer. Because a porosity of silicon is varied upon a concentration and a current density of a fluoric acid, if the porosity is set to 55%, the porous oxidized silicon layer can be grown without a transformation of the wafer by a volumetric expansion, thereby solving a problem for an air resistance and sticking.
Abstract:
PURPOSE: A three-dimensional comb structure is provided to increase an electrostatic force through the increase of the number of combs per a unit area by manufacturing combs in vertical directions on a suspension structure and a substrate. CONSTITUTION: A suspension structure(42) is floated while maintaining a certain gap with a substrate to sense inertia movements and to be oscillated on the substrate. At least one or more elastic members(44) are connected to the suspension structure(42) in order to enable the suspension structure(42) to be oscillated. At least one or more supporters(45) are connected to the substrate to support the elastic members(44). A moving comb structure(43) is connected to the suspending structure(42) and has at least one comb formed to be protruded.