公开(公告)号：SE9900349L

公开(公告)日：2000-08-03

申请号：SE9900349

申请日：1999-02-02

Applicant: ERICSSON TELEFON AB L M

Inventor： LIGANDER PER ,  BERGSTEDT LEIF ROLAND ,  GEVORGIAN SPARTAK

IPC: H05K1/02 ,  H05K1/16 ,  H05K3/32 ,  H01P3/08

Abstract: Method and arrangements for reducing crosstalk between conductors on a conductor carrier, and methods for manufacturing conductor carriers including these arrangements are presented. Crosstalk between the conductors is prevented by providing a dielectric material in the space between each conductor and an earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductors and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index epsir than the dielectric material.

公开(公告)号：AU6379999A

公开(公告)日：2000-04-10

申请号：AU6379999

申请日：1999-09-21

Applicant: ERICSSON TELEFON AB L M

Inventor： BERGSTEDT LEIF ,  BOUSTEDT KATARINA ,  LIGANDER PER

IPC: H01L23/13 ,  H01L23/24 ,  H05K3/32 ,  H01L21/60 ,  H01L23/12 ,  H01L23/52

公开(公告)号：SE9801528L

公开(公告)日：1999-10-31

申请号：SE9801528

申请日：1998-04-30

Applicant: ERICSSON TELEFON AB L M

Inventor： LIGANDER PER

IPC: H01L23/367 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K3/38 ,  H05K3/46 ,  H05K7/20

公开(公告)号：SE9803043D0

公开(公告)日：1998-09-09

申请号：SE9803043

申请日：1998-09-09

Applicant: ERICSSON TELEFON AB L M

Inventor： BERGSTEDT LEIF ,  LIGANDER PER ,  BOUSTEDT KATARINA

IPC: H01L23/13 ,  H01L

公开(公告)号：SE9703128D0

公开(公告)日：1997-08-29

申请号：SE9703128

申请日：1997-08-29

Applicant: ERICSSON TELEFON AB L M

Inventor： LIGANDER PER ,  BERGSTEDT LEIF

IPC: H01P11/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/38 ,  H05K3/46 ,  H05K

Abstract: The invention relates to a method and an apparatus for making an air gap (L, 1a) over at least one conductor (5, 5a) on a printed circuit board (1), minimizing the losses in the conductor (5, 5a). The well known Sequential Build Up (SBU) technology is used, wherein a carrier (3) with the conductor (5, 5a) is covered by a photosensitive varnish layer (7, 7a). An opening (8, 8a) is made in the varnish layer (7, 7a) above the conductor (5, 5a) by a photographic method. A metal layer (11, 11a) is then fastened to the varnish layer (7, 7a) covering at least said opening 88, 8a) so that an air gap (L, 1a) is formed between the conductor (5, 5a) and the metal layer (11, 11a). The resulting circuit board (1) has an air gap (L, 1a) well adapted to the conductor (5, 5a). According to an alternative inventive method the carrier (3) also comprises a lower conductor (5b) placed opposite to the conductor (5a) described above on the opposite side of the carrier. In the same way as above the lower carrier (5b) is provided with an air gap (1b). A layer (13) of dielectric material can be fixed to the metal layer (11) to obtain a more rigid construction.