公开(公告)号：US20220129521A1

公开(公告)日：2022-04-28

申请号：US17428233

申请日：2020-03-14

Applicant: INTEL CORPORATION

Inventor： Prasoonkumar Surti ,  Subramaniam Maiyuran ,  Valentin Andrei ,  Abhishek Appu ,  Varghese George ,  Altug Koker ,  Mike Macpherson ,  Elmoustapha Ould-Ahmed-Vall ,  Vasanth Ranganathan ,  Joydeep Ray ,  Lakshminarayanan Striramassarma ,  SungYe Kim

IPC: G06F17/16 ,  G06F15/80

Abstract: Embodiments described herein include software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. One embodiment provides techniques to optimize training and inference on a systolic array when using sparse data. One embodiment provides techniques to use decompression information when performing sparse compute operations. One embodiment enables the disaggregation of special function compute arrays via a shared reg file. One embodiment enables packed data compress and expand operations on a GPGPU. One embodiment provides techniques to exploit block sparsity within the cache hierarchy of a GPGPU.

公开(公告)号：US20220107914A1

公开(公告)日：2022-04-07

申请号：US17429873

申请日：2020-03-14

Applicant: Intel Corporation

Inventor： Altug Koker ,  Ben Ashbaugh ,  Scott Janus ,  Aravindh Anantaraman ,  Abhishek R. Appu ,  Niranjan Cooray ,  Varghese George ,  Arthur Hunter ,  Brent E. Insko ,  Elmoustapha Ould-Ahmed-Vall ,  Selvakumar Panneer ,  Vasanth Ranganathan ,  Joydeep Ray ,  Kamal Sinha ,  Lakshminarayanan Striramassarma ,  Surti Prasoonkumar ,  Saurabh Tangri

IPC: G06F15/78

Abstract: Embodiments are generally directed to a multi-tile architecture for graphics operations. An embodiment of an apparatus includes a multi-tile architecture for graphics operations including a multi-tile graphics processor, the multi-tile processor includes one or more dies; multiple processor tiles installed on the one or more dies; and a structure to interconnect the processor tiles on the one or more dies, wherein the structure to enable communications between processor tiles the processor tiles.

公开(公告)号：US11113784B2

公开(公告)日：2021-09-07

申请号：US17064427

申请日：2020-10-06

Applicant: Intel Corporation

Inventor： Joydeep Ray ,  Scott Janus ,  Varghese George ,  Subramaniam Maiyuran ,  Altug Koker ,  Abhishek Appu ,  Prasoonkumar Surti ,  Vasanth Ranganathan ,  Andrei Valentin ,  Ashutosh Garg ,  Yoav Harel ,  Arthur Hunter, Jr. ,  SungYe Kim ,  Mike Macpherson ,  Elmoustapha Ould-Ahmed-Vall ,  William Sadler ,  Lakshminarayanan Striramassarma ,  Vikranth Vemulapalli

IPC: G06T1/20 ,  G06F9/50 ,  G06F15/80 ,  G06F12/0806 ,  G06F17/16 ,  G06N3/04 ,  G06N3/08 ,  G06F7/544

Abstract: Embodiments described herein include, software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. Embodiment described herein provided techniques to skip computational operations for zero filled matrices and sub-matrices. Embodiments additionally provide techniques to maintain data compression through to a processing unit. Embodiments additionally provide an architecture for a sparse aware logic unit.

公开(公告)号：US20210256654A1

公开(公告)日：2021-08-19

申请号：US17161941

申请日：2021-01-29

Applicant: Intel Corporation

Inventor： Altug Koker ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Josh Mastronarde ,  Naveen Matam ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.

公开(公告)号：US10802967B1

公开(公告)日：2020-10-13

申请号：US16457088

申请日：2019-06-28

Applicant: Intel Corporation

Inventor： Joydeep Ray ,  James Valerio ,  Ben Ashbaugh ,  Lakshminarayanan Striramassarma

IPC: G06F12/0815 ,  G06F12/0811 ,  G06F3/06 ,  G06F9/38 ,  G06F9/54

Abstract: Embodiments described herein provide a general purpose graphics processor comprising a plurality of tiles, each tile of the plurality of tiles comprising at least one execution unit, a local cache, and a cache control unit, and a high bandwidth memory communicatively coupled to the plurality of tiles, wherein the high bandwidth memory is shared between the plurality of tiles. The cache control unit is to implement a partial write management protocol to receive a partial write operation directed to a cache line in the local cache, the partial write operation comprising write data, write the data associated with the partial write operation to the local cache when the cache line is in a modified state, and forward the write data associated with the partial write operation to the high bandwidth memory when the partial write operation triggers a cache miss or when the cache line is in an exclusive state or a shared state. Other embodiments may be described and claimed.

公开(公告)号：US20180285278A1

公开(公告)日：2018-10-04

申请号：US15477058

申请日：2017-04-01

Applicant: Intel Corporation

Inventor： Abhishek R. Appu ,  Altug Koker ,  Joydeep Ray ,  David Puffer ,  Prasoonkumar Surti ,  Lakshminarayanan Striramassarma ,  Vasanth Ranganathan ,  Kiran C. Veernapu ,  Balaji Vembu ,  Pattabhiraman K

IPC: G06F12/0877 ,  G06F12/0802 ,  G06T17/20 ,  G06F12/0893 ,  G06F12/0855 ,  G06F12/0806 ,  G06F12/0846 ,  G06F12/0868 ,  G06T1/60 ,  G06T15/80

Abstract: In an example, an apparatus comprises a plurality of execution units, and a cache memory communicatively coupled to the plurality of execution units, wherein the cache memory is structured into a plurality of sectors, wherein each sector in the plurality of sectors comprises at least two cache lines. Other embodiments are also disclosed and claimed.

公开(公告)号：US20250103546A1

公开(公告)日：2025-03-27

申请号：US18906428

申请日：2024-10-04

Applicant: Intel Corporation

Inventor： Altug Koker ,  Lakshminarayanan Striramassarma ,  Aravindh Anantaraman ,  Valentin Andrei ,  Abhishek R. Appu ,  Sean Coleman ,  Varghese George ,  Pattabhiraman K ,  Mike MacPherson ,  Subramaniam Maiyuran ,  ElMoustapha Ould-Ahmed-Vall ,  Vasanth Ranganathan ,  Joydeep Ray ,  Jayakrishna P S ,  Prasoonkumar Surti

IPC: G06F15/78 ,  G06F7/544 ,  G06F7/575 ,  G06F7/58 ,  G06F9/30 ,  G06F9/38 ,  G06F9/50 ,  G06F12/02 ,  G06F12/06 ,  G06F12/0802 ,  G06F12/0804 ,  G06F12/0811 ,  G06F12/0862 ,  G06F12/0866 ,  G06F12/0871 ,  G06F12/0875 ,  G06F12/0882 ,  G06F12/0888 ,  G06F12/0891 ,  G06F12/0893 ,  G06F12/0895 ,  G06F12/0897 ,  G06F12/1009 ,  G06F12/128 ,  G06F15/80 ,  G06F17/16 ,  G06F17/18 ,  G06N3/08 ,  G06T1/20 ,  G06T1/60 ,  H03M7/46

Abstract: Embodiments are generally directed to cache structure and utilization. An embodiment of an apparatus includes one or more processors including a graphics processor; a memory for storage of data for processing by the one or more processors; and a cache to cache data from the memory; wherein the apparatus is to provide for dynamic overfetching of cache lines for the cache, including receiving a read request and accessing the cache for the requested data, and upon a miss in the cache, overfetching data from memory or a higher level cache in addition to fetching the requested data, wherein the overfetching of data is based at least in part on a current overfetch boundary, and provides for data is to be prefetched extending to the current overfetch boundary.

公开(公告)号：US20250061535A1

公开(公告)日：2025-02-20

申请号：US18820907

申请日：2024-08-30

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US20250046001A1

公开(公告)日：2025-02-06

申请号：US18800406

申请日：2024-08-12

Applicant: Intel Corporation

Inventor： Prasoonkumar Surti ,  Arthur Hunter ,  Kamal Sinha ,  Scott Janus ,  Brent Insko ,  Vasanth Ranganathan ,  Lakshminarayanan Striramassarma

IPC: G06T15/00 ,  G06T1/20 ,  G06T1/60 ,  G06T17/20

Abstract: Embodiments are generally directed to multi-tile graphics processor rendering. An embodiment of an apparatus includes a memory for storage of data; and one or more processors including a graphics processing unit (GPU) to process data, wherein the GPU includes a plurality of GPU tiles, wherein, upon geometric data being assigned to each of a plurality of screen tiles, the apparatus is to transfer the geometric data to the plurality of GPU tiles.

公开(公告)号：US12210477B2

公开(公告)日：2025-01-28

申请号：US17428530

申请日：2020-03-14

Applicant: Intel Corporation

Inventor： Altug Koker ,  Joydeep Ray ,  Ben Ashbaugh ,  Jonathan Pearce ,  Abhishek Appu ,  Vasanth Ranganathan ,  Lakshminarayanan Striramassarma ,  Elmoustapha Ould-Ahmed-Vall ,  Aravindh Anantaraman ,  Valentin Andrei ,  Nicolas Galoppo Von Borries ,  Varghese George ,  Yoav Harel ,  Arthur Hunter, Jr. ,  Brent Insko ,  Scott Janus ,  Pattabhiraman K ,  Mike Macpherson ,  Subramaniam Maiyuran ,  Marian Alin Petre ,  Murali Ramadoss ,  Shailesh Shah ,  Kamal Sinha ,  Prasoonkumar Surti ,  Vikranth Vemulapalli

IPC: G06F15/78 ,  G06F7/544 ,  G06F7/575 ,  G06F7/58 ,  G06F9/30 ,  G06F9/38 ,  G06F9/50 ,  G06F12/02 ,  G06F12/06 ,  G06F12/0802 ,  G06F12/0804 ,  G06F12/0811 ,  G06F12/0862 ,  G06F12/0866 ,  G06F12/0871 ,  G06F12/0875 ,  G06F12/0882 ,  G06F12/0888 ,  G06F12/0891 ,  G06F12/0893 ,  G06F12/0895 ,  G06F12/0897 ,  G06F12/1009 ,  G06F12/128 ,  G06F15/80 ,  G06F17/16 ,  G06F17/18 ,  G06T1/20 ,  G06T1/60 ,  H03M7/46 ,  G06N3/08 ,  G06T15/06

Abstract: Systems and methods for improving cache efficiency and utilization are disclosed. In one embodiment, a graphics processor includes processing resources to perform graphics operations and a cache controller of a cache coupled to the processing resources. The cache controller is configured to control cache priority by determining whether default settings or an instruction will control cache operations for the cache.