公开(公告)号：US20230420396A1

公开(公告)日：2023-12-28

申请号：US18253954

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Tolga ACIKALIN ,  Arnaud AMADJIKPE ,  Brent R. CARLTON ,  Chia-Pin CHIU ,  Timothy F. COX ,  Kenneth P. FOUST ,  Bryce D. HORINE ,  Telesphor KAMGAING ,  Renzhi LIU ,  Jason A. MIX ,  Sai VADLAMANI ,  Tae Young YANG ,  Zhen ZHOU

IPC: H01L23/66 ,  H01Q9/42 ,  H01Q1/22 ,  H01Q9/36 ,  H01Q21/24 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L23/66 ,  H01Q9/42 ,  H01Q1/2283 ,  H01Q9/36 ,  H01Q21/24 ,  H01L25/0652 ,  H01L2924/1421 ,  H01L24/16 ,  H01L23/5381 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L25/0655

Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.

公开(公告)号：US20230420384A1

公开(公告)日：2023-12-28

申请号：US17848639

申请日：2022-06-24

Applicant: Intel Corporation

Inventor： Kavitha NAGARAJAN ,  Eng Huat GOH ,  Min Suet LIM ,  Telesphor KAMGAING ,  Chee Kheong YOON ,  Jooi Wah WONG ,  Chu Aun LIM

IPC: H01L23/552 ,  H01L23/367 ,  H01L23/16 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/367 ,  H01L23/16 ,  H01L23/562

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a stiffener for a surface of a semiconductor package, where the stiffener includes slots that allow a gasket to go over the stiffener to electrically couple with a ground or a VSS of the semiconductor package. In embodiments, the gasket may include a material that blocks or absorbs EMI or RFI. Other embodiments may be described and/or claimed.

公开(公告)号：US20230344131A1

公开(公告)日：2023-10-26

申请号：US18216282

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L23/31 ,  H01L23/495 ,  H01Q1/24 ,  H01Q19/22 ,  H01Q1/22 ,  H01L23/552 ,  H01L23/66 ,  H01L21/56 ,  H01Q1/52

CPC classification number: H01Q9/0414 ,  H01L23/3107 ,  H01L23/49541 ,  H01Q1/241 ,  H01Q19/22 ,  H01Q1/2283 ,  H01L23/552 ,  H01L23/66 ,  H01L21/565 ,  H01Q1/526 ,  H01L2223/6677 ,  H01L23/3675

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20220408562A1

公开(公告)日：2022-12-22

申请号：US17349700

申请日：2021-06-16

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Neelam PRABHU GAUNKAR ,  Veronica STRONG ,  Aleksandar ALEKSOV

IPC: H05K1/11 ,  H05K1/03

Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a glass core, and a vertically oriented inductor embedded in the glass core. In an embodiment, the inductor comprises vertical vias through the glass core, and where the vertical vias are electrically coupled together by conductive traces over a surface of the glass core to provide a plurality of conductive turns.

公开(公告)号：US20220407216A1

公开(公告)日：2022-12-22

申请号：US17354891

申请日：2021-06-22

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Neelam PRABHU GAUNKAR ,  Aleksandar ALEKSOV ,  Veronica STRONG

IPC: H01Q1/22 ,  H05K1/02 ,  H01Q9/04 ,  H01Q13/02 ,  H01L23/498 ,  H01L21/48

Abstract: Embodiments disclosed herein include package substrates with antennas on the core. In an embodiment, a package substrate comprises a core with a first surface and a second surface. In an embodiment, a first conductive plane is formed into the core, where the first conductive plane is substantially orthogonal to the first surface, and a second conductive plane is formed into the core, where the second conductive plane is substantially orthogonal to the first surface. In an embodiment, an antenna is on the core, where the antenna is between the first conductive plane and the second conductive plane.

公开(公告)号：US20220407205A1

公开(公告)日：2022-12-22

申请号：US17349774

申请日：2021-06-16

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN

IPC: H01P3/16 ,  H01Q9/04 ,  H01Q1/22 ,  H01P11/00 ,  H01L23/14 ,  H01L23/15 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to contactless transmission within a package that combines radiating elements with vertical transitions in the package, in particular to a waveguide within a core of the package that is surrounded by a metal ring. A radiating element on one side of the substrate core and above the waveguide surrounded by the metal ring communicates with another radiating element on the other side of the substrate core and below the waveguide surrounded by the metal ring. Other embodiments may be described and/or claimed.

公开(公告)号：US20220406721A1

公开(公告)日：2022-12-22

申请号：US17350152

申请日：2021-06-17

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Johanna M. SWAN

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/15 ,  H01L23/498 ,  H01L23/48 ,  H01L21/48 ,  H01L23/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to via structures and/or planar structures within a glass core of a substrate to facilitate high-speed signaling with a die coupled with the substrate. In embodiments, the substrate may be coupled with an interposer to enable high-speed signaling between a compute die (or tile) and a storage die (or tile) that may be remote to the substrate. Other embodiments may be described and/or claimed.

公开(公告)号：US20220406617A1

公开(公告)日：2022-12-22

申请号：US17349673

申请日：2021-06-16

Applicant: Intel Corporation

Inventor： Veronica STRONG ,  Neelam PRABHU GAUNKAR ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01L21/48 ,  H01L23/498

Abstract: Embodiments disclosed herein include a package substrate and methods of fabricating such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface, and a via through the core. In an embodiment a first pad is over the via, and the first pad is embedded within the core with a third surface that is substantially coplanar with the first surface of the core. In an embodiment, a second pad is over the via, where the second pad is embedded within the core with a fourth surface that is substantially coplanar with the second surface of the core.

公开(公告)号：US20220406523A1

公开(公告)日：2022-12-22

申请号：US17350164

申请日：2021-06-17

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Veronica STRONG ,  Neelam PRABHU GAUNKAR ,  Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Hiroki TANAKA

IPC: H01G4/002

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to creating capacitors at the interface of a glass substrate. These capacitors may be three-dimensional (3-D) capacitors formed using trenches within the glass core of the substrate using laser-assisted etching techniques. A first electrode may be formed on the glass, including on the surface of trenches or other features etched in the glass, followed by a deposition of a dielectric material or a capacitive material. A second electrode may then be formed on top of the dielectric material. Other embodiments may be described and/or claimed.

公开(公告)号：US20220384560A1

公开(公告)日：2022-12-01

申请号：US17334194

申请日：2021-05-28

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING

IPC: H01L49/02 ,  H01F5/00 ,  H01F5/06

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to inductors located within a substrate. An inductor may be created in a glass core using a laser-assisted etching of glass interconnects techniques to create trenches or vias within the glass substrate, into which conductive material may be plated or filled to create the inductor. In embodiments, the inductors may be low equivalent series resistance (ESR) compact air-core inductors. Other embodiments may be described and/or claimed.