公开(公告)号：US20220326045A1

公开(公告)日：2022-10-13

申请号：US17825856

申请日：2022-05-26

Applicant: InvenSense, Inc.

Inventor： Doruk Senkal ,  Houri Johari-Galle ,  Joseph Seeger

IPC: G01C25/00 ,  B81B7/00 ,  G01C19/5776 ,  G01R29/02 ,  G01R19/00 ,  G01R23/00 ,  G01R25/00 ,  G01C19/5719 ,  G01C19/5726

Abstract: A MEMS device may output a signal during operation that may include an in-phase component and a quadrature component. An external signal having a phase that corresponds to the quadrature component may be applied to the MEMS device, such that the MEMS device outputs a signal having a modified in-phase component and a modified quadrature component. A phase error for the MEMS device may be determined based on the modified in-phase component and the modified quadrature component.

公开(公告)号：US11428702B2

公开(公告)日：2022-08-30

申请号：US16460901

申请日：2019-07-02

Applicant: INVENSENSE, INC.

Inventor： Joseph Seeger ,  Pradeep Shettigar

IPC: G01P1/00 ,  G01P15/00 ,  H03F3/45 ,  G01P15/125

Abstract: Reducing a sensitivity of an electromechanical sensor is presented herein. The electromechanical sensor comprises a sensitivity with respect to a variation of a mechanical-to-electrical gain of a sense element of the electromechanical sensor; and a voltage-to-voltage converter component that minimizes the sensitivity by coupling, via a defined feedback capacitance, a positive feedback voltage to a sense electrode of the sense element—the sense element electrically coupled to an input of the voltage-to-voltage converter component. In one example, the voltage-to-voltage converter component minimizes the sensitivity by maintaining, via the defined feedback capacitance, a constant charge at the sense electrode. In another example, the electromechanical sensor comprises a capacitive sense element comprising a first node comprising the sense electrode. Further, a bias voltage component can apply a bias voltage to a second node of the electromechanical sensor. In yet another example, the electromechanical sensor comprises a piezoelectric sense element.

公开(公告)号：US20220098030A1

公开(公告)日：2022-03-31

申请号：US17549207

申请日：2021-12-13

Applicant: InvenSense, Inc.

Inventor： Pei-Wen Yen ,  Ting-Yuan Liu ,  Jye Ren ,  Chung-Hsien Lin ,  Joseph Seeger ,  Calin Miclaus

IPC: B81B7/00

Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.

公开(公告)号：US11085770B2

公开(公告)日：2021-08-10

申请号：US16540852

申请日：2019-08-14

Applicant: INVENSENSE, INC.

Inventor： Joseph Seeger

IPC: G01C19/5776

Abstract: Reducing, at a common sense electrode of a group of sensors of a system, a common charge flow due to a common motion of the group of sensors is presented herein. The group of electromechanical sensors generates a common charge flow as a result of a common motion of the group of electromechanical sensors and a differential charge flow as a result of a differential motion of the group of electromechanical sensors—respective sense elements of the group of electromechanical sensors being electrically connected at the common sense electrode. The system further comprises a voltage-to-voltage converter component that generates, via an output of the voltage-to-voltage converter component, a positive feedback voltage, and minimizes the common charge flow by coupling, via a defined feedback capacitance, the positive feedback voltage to the common sense electrode—the common sense electrode being electrically coupled to an input of the voltage-to-voltage converter component.

公开(公告)号：US11040871B2

公开(公告)日：2021-06-22

申请号：US16206861

申请日：2018-11-30

Applicant: INVENSENSE, INC.

Inventor： Jongwoo Shin ,  Houri Johari-Galle ,  Bongsang Kim ,  Joseph Seeger ,  Dongyang Kang

IPC: B81B7/00 ,  B81B3/00 ,  B81C1/00

Abstract: A device comprising a micro-electro-mechanical system (MEMS) substrate with protrusions of different heights that has been integrated with a complementary metal-oxide-semiconductor (CMOS) substrate is presented herein. The MEMS substrate comprises defined protrusions of respective distinct heights from a surface of the MEMS substrate, and the MEMS substrate is bonded to the CMOS substrate. In an aspect, the defined protrusions can be formed from the MEMS substrate. In another aspect, the defined protrusions can be deposited on, or attached to, the MEMS substrate. In yet another aspect, the MEMS substrate comprises monocrystalline silicon and/or polysilicon. In yet even another aspect, the defined protrusions comprise respective electrodes of sensors of the device.

公开(公告)号：US10914584B2

公开(公告)日：2021-02-09

申请号：US15940810

申请日：2018-03-29

Applicant: INVENSENSE, INC.

Inventor： Doruk Senkal ,  Robert Hennessy ,  Houri Johari-Galle ,  Joseph Seeger

IPC: G01C19/5712 ,  G01C19/5747 ,  G01C19/5762

Abstract: In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; a first transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode; and a second transducer to sense the motion of the sensor during a drive mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements. In further embodiments, a dynamically balanced 3-axis gyroscope architecture is provided. Various embodiments described herein can facilitate providing linear and angular momentum balanced 3-axis gyroscope architectures for better offset stability, vibration rejection, and lower part-to-part coupling.

公开(公告)号：US10766764B2

公开(公告)日：2020-09-08

申请号：US16538166

申请日：2019-08-12

Applicant: INVENSENSE, INC.

Inventor： Ilya Gurin ,  Joseph Seeger ,  Matthew Thompson

IPC: B81B3/00 ,  G01P21/00 ,  G01P15/125 ,  G01C19/5719 ,  G01P15/08 ,  G01P15/13 ,  B81C99/00

Abstract: A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.

公开(公告)号：US10692761B2

公开(公告)日：2020-06-23

申请号：US16387469

申请日：2019-04-17

Applicant: INVENSENSE, INC.

Inventor： Bongsang Kim ,  Joseph Seeger

IPC: B81B3/00 ,  H01L21/768 ,  H01L21/02 ,  H01L21/8238 ,  B81C1/00 ,  B81B7/02

Abstract: Selectively controlling application of a self-assembled monolayer (SAM) coating on a substrate of a device is presented herein. A method comprises: forming a material on a first substrate; removing a selected portion of the material from a defined contact area of the first substrate; forming a SAM coating on the material and the defined contact area—the SAM coating comprising a first adhesion force with respect to the material and a second adhesion force with respect to the defined contact area, and the first adhesion force being less than the second adhesion force; removing the SAM coating that has been formed on the material; and attaching the first substrate to the second substrate—the first substrate being positioned across from the second substrate, and the SAM coating that has been formed on the defined contact area being positioned across from a bump stop of the second substrate.

公开(公告)号：US20200087142A1

公开(公告)日：2020-03-19

申请号：US16574037

申请日：2019-09-17

Applicant: InvenSense, Inc.

Inventor： Pei-Wen Yen ,  Ting-Yuan Liu ,  Jye Ren ,  Chung-Hsien Lin ,  Joseph Seeger ,  Calin Miclaus

IPC: B81B7/00

Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.

公开(公告)号：US10551193B2

公开(公告)日：2020-02-04

申请号：US15866140

申请日：2018-01-09

Applicant: INVENSENSE, INC.

Inventor： Joseph Seeger ,  Ozan Anac

IPC: G01C19/5755 ,  G01C19/5733

Abstract: A system and method in accordance with an embodiment reduces the cross-axis sensitivity of a gyroscope. This is achieved by building a gyroscope using a mechanical transducer that comprises a spring system that is less sensitive to fabrication imperfection and optimized to minimize the response to the rotations other than the intended input rotation axis. The longitudinal axes of the first and second flexible elements are parallel to each other and parallel to the first direction.