HEATING IMPLEMENT AND ITS PRODUCTION

    公开(公告)号:JP2000050941A

    公开(公告)日:2000-02-22

    申请号:JP22679598

    申请日:1998-08-11

    Applicant: KAO CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a heating implement which is capable of minimizing the loss of iron powder at the time of production, makes use and manipulation simple and is used for heating the hair and the hair skin. SOLUTION: This implement includes an inner layer cap 20 formed by joining and fixing each other's curvilinear peripheral edges 10a of two sheets of heating element-contg. sheets 10 of approximately the same semi-elliptic shapes. The heating element-contg. sheets 10 consist of water resistant inner layer sheets 2, air permeable sheets 5 which are disposed to cover the entire surface of the front surfaces of the inner layer sheets 2 and the plural heating elements 3 which are held and fixed by the inner layer sheets 2 and the air permeable sheets 5 and generate heat when the elements come into contact with air. The two heating element-contg. sheets 10 are formed by joining and fixing each other's curvilinear peripheral edges 10a in such a manner that the inner layer sheets 2 exist on the inside surfaces.

    HAIR-TREATING AGENT COMPOSITION
    72.
    发明专利

    公开(公告)号:JPH11106319A

    公开(公告)日:1999-04-20

    申请号:JP26609797

    申请日:1997-09-30

    Applicant: KAO CORP

    Abstract: PROBLEM TO BE SOLVED: To obtain a composition excellent in moisture retention, smoothness and flexibility and capable of presenting durable conditioning effects, hair damage-reducing effects, split hair-protecting effects and luster by containing a keratin reducing material and a specific amide compound. SOLUTION: This hair treating agent composition contains 0.1-20.0 wt.% of (A) a keratin-reducing derivative, such as thioglycolic acid, a cysteine derivative such as cysteine, an N-acyl-L-cysteine etc., sulfurous acid, hydrogen sulfite, etc., and 0.001-20 wt.%, of (B) an amide compound having 0-50 deg.C, preferably 10-40 deg.C melting point e.g. a fatty acid amide such as isostearamide, isopalmitamide, isomyristamide, etc., an amide derivative expressed by the formula [R and R are each a 1-40C (hydroxylated) hydrocarbon group; R is a 1-6C alkylene or a single bond; R is H, a 1-12C alkoxy, 2,3- dihydroxypropyloxy]}.

    73.
    发明专利
    失效

    公开(公告)号:JPH05286829A

    公开(公告)日:1993-11-02

    申请号:JP9072192

    申请日:1992-04-10

    Applicant: KAO CORP

    Abstract: PURPOSE:To provide the subject composition capable of imparting adequate firm texture to hair in a short-time treatment, also highly sustainable in its effect. CONSTITUTION:The objective composition essentially containing (A) pref. 0.1-10 (esp. 1-7) wt.% of a reducing agent, esp. thioglycolic acid, ammonium thioglycolate, N-acetyl-L-cysteine or sodium bisulfite and (B) pref. 0.1-10 (esp. 1-5) wt.% of a benzophenonesulfonic acid, e.g. a compound of the formula (A -A are such that at least one is sulfonic acid group or its salt group, the rest being H, halogen, OH, COOH, lower alkyl, lower alkenyl, lower alkoxy or acyl), esp. oxybenzophenonesulfonic acid, dihydroxydimethoxybenzophenonedisulfonic acid or a salt thereof. It may be that these components A and B be prepared separately, i.e., the 1st agent containing the component A at the above concentration and the 2nd agent containing the component B at the above concentration; and the hair be first treated with the 1st agent followed by treatment with the 2nd agent.

    74.
    发明专利
    失效

    公开(公告)号:JPH05286827A

    公开(公告)日:1993-11-02

    申请号:JP8884192

    申请日:1992-04-09

    Applicant: KAO CORP

    Abstract: PURPOSE:To provide the subject composition capable of imparting adequate firm texture to hair by a short-time treatment, also highly sustainable in its effect. CONSTITUTION:The objective composition essentially containing (A) pref. 0.1-10 (esp. 1-7) wt.% of a reducing agent, esp. thioglycolic acid, ammonium thioglycolate, N-acetyl-L-cysteine, or sodium bisulfite and (B) pref. 0.1-10 (esp. 1-5) wt.% of a tetralinsulfonic acid or indanesulfonic acid, e.g. a compound of the formula (A -A are such that at least one is sulfonyl, the rest being H, halogen, OH, lower alkyl, acyl, COOH, NH2 or lower alkoxy; n is 1 or 2) or a salt thereof. The components A and B may be formulated together; or, may be prepared separately in the form of the 1st agent containing the component A at the above concentration and in the form of the 2nd agent containing the component B at the above concentration; in this case, the hair is first treated with the 1st agent followed by treatment with the 2nd agent.

    LITHOGRAPHIC DAMPENING SOLUTION
    75.
    发明专利

    公开(公告)号:JPH03155991A

    公开(公告)日:1991-07-03

    申请号:JP20161790

    申请日:1990-07-30

    Abstract: PURPOSE:To obtain a lithographic dampening solution capable of replacing an isopropyl alcohol dampening solution of using the alkyl ether of a low molecular weight propylene oxide having substantially no surface active power. CONSTITUTION:A compound indicated by Formula (I) in the quantity of 0.1-10wt.% is added to a dampening solution. As the dampening solution at the upper limit temperature of 35-40 deg.C on the printing machine and in the quantity of addition within this density range is weak in the power of micelle formation, it lowers in the dynamic surface tension and the rise of water by the dampening solution feeder of Dahlgren system is satisfactory so that a hydrophilic nonpictorial line part can be dampened uniformly with little foaming. In this case, when the content is less than 0.1wt.%, the diffusion phenomenon of ink to the dampening solution surface occurs so that tinting and scumming appear in the printed material. When the content exceeds 10wt.%, it is unfavorable in respect of cost. Also, it is undsirable that R of the compound is more than a butyl group and (n) is more than 5, because the solubility in water is inferior and the boiling point becomes higher.

    THERMOPLASTIC RESIN MOLDING OF EXCELLENT LIQUID REPELLENCY AND ITS PRODUCTION

    公开(公告)号:JPH0341162A

    公开(公告)日:1991-02-21

    申请号:JP17673789

    申请日:1989-07-07

    Applicant: KAO CORP

    Abstract: PURPOSE:To obtain the title molding excellent in liquid repellency, stain resistance, releasability, etc., by adding a specified amount of a polymer having a specified perfluoroalkyl to a thermoplastic resin, molding the mixture, and heat-treating the molding. CONSTITUTION:A (meth)acrylic ester having a 5-16C perfluoroalkyl (e.g. formula I or II) is homopolymerized or copolymerized with a copolymerizable monomer (e.g. stearyl methacrylate) in the presence of a mercaptan compound of formula III (wherein (n) is 8-18). 0.1-5 pts.wt. obtained perfluoroalkylated polymer is added to 100 pts.wt. thermoplastic resin (e.g. polyethylene), and the mixture is well mixed. The obtained thermoplastic resin composition is molded and heat-treated at 70-130 deg.C to obtain a thermoplastic resin molding of excellent liquid repellency.

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