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公开(公告)号：JP2001084957A
公开(公告)日：2001-03-30
申请号：JP25945399
申请日：1999-09-13
Applicant: NGK INSULATORS LTD
Inventor： MIYAZAWA SUGIO , ASAI MICHIO
IPC: H01J61/30
Abstract: PROBLEM TO BE SOLVED: To extend service life of a lamp by raising a temperature of the coolest point, without raising the temperature of the center part of a vessel by providing multiple projections on the surface of a shell part forming a discharge space of the vessel integrally formed by the shell part and a terminal part where an electrode part is inserted. SOLUTION: This emission vessel 1 consists of a bulging shell part 2 and terminal parts formed at both ends opposing to each other to insert an electrode member, and the whole body is formed integrally from aluminum of a translucent ceramics material. Multiple projections 4, having a tip part of a hemispherical shape, are approximately equally formed on a surface of the shell part 2. Surface area of the shell part 2 is increased by forming the projection 4 thereon, and heat release can be increased. The temperature on a pipe wall near the center part of the emission vessel 1 is decreased, and the difference in temperature between the part near the center part and the coolest point is decreased. The temperature of the overall arc tube can be thereby raised, and the temperature on the coolest point can be raised.
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公开(公告)号：JPH11354017A
公开(公告)日：1999-12-24
申请号：JP15972498
申请日：1998-06-08
Applicant: NGK INSULATORS LTD
Inventor： NIIMI TOKUICHI , ASAI MICHIO
Abstract: PROBLEM TO BE SOLVED: To realize integration and small size of an electron tube at the same time, and brightly display the transmission of information. SOLUTION: This light-emitting element is constituted with a housing 34 formed by press fusion bonding a square upper housing member 12 made of a glass material, having a recess in the central part on one main surface, and a square lower housing member 14 made of glass material, having a recess in the central part on one main surface, a cavity 16 formed by the recesses 30, 32 within the housing 34, and in which at least one of gas and a light- emitting substance is sealed, and two lead wires 18, 20 facing each other through the cavity 16.
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公开(公告)号：JPH11283567A
公开(公告)日：1999-10-15
申请号：JP8118298
申请日：1998-03-27
Applicant: NGK INSULATORS LTD
Inventor： MIYAZAWA SUGIO , ASAI MICHIO
Abstract: PROBLEM TO BE SOLVED: To conduct high accurate positioning, when an electrode member is inserted into the trunk of a discharge container of a high-pressure discharge lamp. SOLUTION: Electrode member inserting parts 12a, 12b have inserting parts 13a, 13b, exposed parts 14a, 14b, and flange parts 15a, 15b arranged between the inserting parts 13a, 13b and the exposed parts 14a, 14b respectively, and positioning of the electrode member inserting parts 12a, 12b is conducted with the flange parts 15a, 15b arranged between the inserting parts 13a, 13b and the exposed parts 14a, 14b.
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公开(公告)号：JPH10264135A
公开(公告)日：1998-10-06
申请号：JP7532797
申请日：1997-03-27
Applicant: NGK INSULATORS LTD
Inventor： OHASHI TOSHIO , ASAI MICHIO
IPC: B28B21/92 , C04B35/64 , C04B37/00 , H01L21/205 , H01L21/302 , H01L21/3065 , H05H1/24
Abstract: PROBLEM TO BE SOLVED: To make a flange part vertical to a passing pipe main body on the occasion of manufacturing a passing pipe having the passing pipe main body and the flange part which are made of ceramic and thereby to prevent gas for producing plasma from leaking from the joining interface of the passing pipe main body and the flange part. SOLUTION: A passing pipe having a passing pipe main body made of ceramic and provided for passing through gas for producing plasma and for casting ultraviolet rays on the passing gas from outside and a flange part made of ceramic and joined on the outside surface of the passing pipe main body, is manufactured. A molded body of the passing pipe main body is calcined and the outside surface of a calcined body thus obtained is machined so that a first part 24 and a second part 25 having an outside diameter larger than the one of the first part 24 be formed. A stepped part 26 is provided between the outside surface 24a of the first part 24 and the outside surface 25a of the second part 25. The calcined body 23 of the passing pipe main body is fired and also the flange part 30 is joined to the stepped part 26.
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公开(公告)号：JPH0758832B2
公开(公告)日：1995-06-21
申请号：JP13224191
申请日：1991-05-09
Applicant: NGK INSULATORS LTD
Inventor： MORIMOTO TADAHIKO , ASAI MICHIO
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Patent Agency Ranking
公开(公告)号：JPH06291464A
公开(公告)日：1994-10-18
申请号：JP7307893
申请日：1993-03-31
Applicant: NGK INSULATORS LTD
Inventor： MORIMOTO TADAHIKO , ASAI MICHIO
Abstract: PURPOSE:To provide a ceramic wiring board wherein it is possible to restrain a conductor from being oxidized and a wiring pattern can be formed at high density. CONSTITUTION:A land 42 which is connected to a molybdenum conductor 38 and which is made of tungsten is formed on an opening part 40 in a ceramic layer 42 as the outermost layer of a ceramic wiring board, and a nickel-plated layer 46 and a gold-silver alloy layer 48 which are oxidation-resistant are formed at its upper part. A ring-shaped insulating glass 52 is installed so as to cover the edge part 50 of the gold-silver alloy layer 48. As a result, when 3 thick-film conductor pattern 56 or the like is fired arm the aluminum ceramic layer 42 in the air, the land 44 is not oxidized. In addition, since the top part 49a of the gold-silver alloy layer 49 is exposed through the insulating glass 52, the degree of wiring freedom and the wiring density of the thick-film conductor pattern 56 are increased.
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公开(公告)号：JPH06209149A
公开(公告)日：1994-07-26
申请号：JP6527592
申请日：1992-03-23
Applicant: NGK INSULATORS LTD , N G K ELECTRON KK
Inventor： ASAI MICHIO , HASEGAWA ISAMU
Abstract: PURPOSE:To manufacture a ceramic wiring board having a correctly breakable snap line by a method wherein the snap line is formed on the ceramic wiring board subsequent to a firing using a rolling cutter made of sintered diamond. CONSTITUTION:The moved distances in the (y) and (d) directions of a table 14 are calculated in an image processing part 36 with the position of a through hole in a ceramic wiring board placed on the table 14 as a reference and the ceramic wiring board is moved to the position of the table by (y) and (theta) direction driving devices 11 and 12. In this state, a rolling cutter 24 made of sintered diamond in a cutter head 23 is pushed in the ceramic wiring board by a prescribed amount, and is moved in an X direction by (x) and (z) direction driving devices 21 and 22 and a snap line is formed on the ceramic wiring board. The rolling cutter 24 made of sintered diamond is rotatably mounted to the cutter head 23.
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公开(公告)号：JPH04334083A
公开(公告)日：1992-11-20
申请号：JP13224091
申请日：1991-05-09
Applicant: NGK INSULATORS LTD
Inventor： OHASHI TAKASHI , ASAI MICHIO
Abstract: PURPOSE:To obtain a thick film circuit board and its manufacturing method which board has a high precision resistance part and a copper circuit wiring part excellent in conducting characteristics which are formed by binary baking, and a solder land part excellent in solder wettability. CONSTITUTION:After noble metal paste is printed on the surface of a ceramic substrate 1, a solder land part 2 is formed by baking in an oxidizing atmosphere. After gold paste and resistance paste are printed, and then a gold pad part 8 and a resistance part 6 are formed by simultaneous or individual baking in an oxidizing atmosphere, copper paste is printed and a circuit wiring part 5 is formed by baking in a non-oxidizing atmosphere, thus forming a thick film circuit board.
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公开(公告)号：JPH03116799A
公开(公告)日：1991-05-17
申请号：JP25440989
申请日：1989-09-28
Applicant: NGK INSULATORS LTD
Inventor： MORIMOTO TADAHIKO , ASAI MICHIO
Abstract: PURPOSE:To prevent enlargement of an allowable amount of print deviation and enlargement of a connecting conductor area by applying conductor paste inside an opening part through a through-hole whose value of an opening area is smaller than that of an opening part formed in a metal mask. CONSTITUTION:A W-based conductor paste Ps which is prepared by adding resin binder, solvent, etc., thereto is applied to a recessed part divided by a lower layer part 19a and insulating layers 18b, 18c through a through-hole (t) of a metal mask Ms of 50mum thickness, for example by movement of a squeegee S to form an upper layer part 19b of a connecting conductor layer. In this case, a diameter O2 of the through-hole (t) formed in the metal mask Ms is smaller than a diameter O1. The conductor paste Ps which is applied by being dropped into an opening part P through the through-hole (t) in movement of the squeegee S is charged under the control of a peripheral surface of the opening part P because of its self-flow property. Therefore, it is possible to absorb position deviation even if there is position deviation of the through- hole (t) from the opening part P is within a range of + or -1/2(O1-O2).
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公开(公告)号：JPH02252291A
公开(公告)日：1990-10-11
申请号：JP7198389
申请日：1989-03-27
Applicant: NGK INSULATORS LTD
Inventor： MIYATA KEIZO , ASAI MICHIO
IPC: H05K3/46
Abstract: PURPOSE:To obtain a high-reliability and high-density multilayer wiring board having the superior adhesive strength of a conductor pattern by a method wherein a copper-plated layer and a resistor, which can be fired in inert gas after a photolitho etching is performed, are provided on the surface of a ceramic multilayer wiring board. CONSTITUTION:A conductor pattern (an internal layer wiring) 3 and an insulating layer 2 are laminated on an alumina ceramic green sheet and are fired at 1600 deg.C in a reducing atmosphere to form a multilayer wiring board. According to the need, an electroless Ni plating is applied to the exposed parts, which are located on through holes (via holes) 4, of the wiring 3 and moreover, a connecting layer 5 containing one of copper, Ni and Co as its main component is provided, a copper plating is applied to the whole surface of the board, a resist mask is provided on a prescribed part and an etching is performed to form a conductor pattern (a copper-plated conductor) 6. A resistor paste (a resistor) 7 which can be fired in inert gas is printed on a prescribed position of the pattern 6. The paste 7 is fired in inert gas and if necessary, a resistor protective film (an overcoat film) 8 is adhered on the resistor 7 subsequent to the firing to complete the multilayer wiring board.
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