Head actuator and disk device using the head actuator
    71.
    发明专利
    Head actuator and disk device using the head actuator 有权
    头部执行器和使用头执行器的盘装置

    公开(公告)号:JP2005310367A

    公开(公告)日:2005-11-04

    申请号:JP2005150067

    申请日:2005-05-23

    Abstract: PROBLEM TO BE SOLVED: To provide a head actuator in which follow-up ability of a head is made superior.
    SOLUTION: The head actuator is provided with a rotating arm 6 which rotates around a pivot shaft 5 as a center, a floating slider 12 which has a magnetic head at the tip section of the rotating arm 6 through a suspension 2, a first driving section 4 which is provided on the pivot shaft side of the rotating arm to rotate the rotating arm and a second driving section 13 which is arranged on the bending type actuator side. The second driving section is mounted in the vicinity of the tip section of the rotating arm. The first and the second driving sections are constituted as voice coil motors. Highly precise tracking servo can be conducted by the second driving section.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:提供一种头部致动器,其中头部的后续能力被提高。 解决方案:头致动器设置有以枢轴5为中心旋转的旋转臂6,浮动滑块12,其通过悬架2在旋转臂6的尖端部分具有磁头, 第一驱动部4设置在旋转臂的枢轴侧以使旋转臂旋转;以及第二驱动部13,其布置在弯曲型致动器侧。 第二驱动部安装在旋转臂的前端部附近。 第一驱动部和第二驱动部构成为音圈马达。 可以通过第二驱动部进行高精度跟踪伺服。 版权所有(C)2006,JPO&NCIPI

    BENDING TYPE HEAD ACTUATOR AND DISK MEMORY DEVICE

    公开(公告)号:JP2002352541A

    公开(公告)日:2002-12-06

    申请号:JP2001124702

    申请日:2001-04-23

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To install a wiring member to a floating head slider at the shortest wiring length. SOLUTION: The bending type head actuator is so constituted that the wiring of a flexible printed circuit board 95 to the floating head slider 16 of the bending type head actuator 13 is extracted to the outer side of a head arm 14 through the inner side of the bending part 13a of the bending type head actuator 13.

    HEAD ACTUATOR AND DISK STORAGE DEVICE

    公开(公告)号:JP2002352538A

    公开(公告)日:2002-12-06

    申请号:JP2001124701

    申请日:2001-04-23

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To increase driving torque in an initial range during loading while a bent type head actuator and a VCM are miniaturized. SOLUTION: In order to miniaturized a bent type head actuator 13 and a VCM 18, and increase driving torque in an initial range during the loading of bent type head actuator 13 by the VCM 18, a projected part 82d is formed in one end of the outer periphery of a magnet 82, and an outer corner part continuous from the radial direction part of a magnet 82 is overlapped on the projected part of the magnet in the bent type head actuator.

    HEAD ACTUATOR AND DISK STORAGE DEVICE
    75.
    发明专利

    公开(公告)号:JP2002352533A

    公开(公告)日:2002-12-06

    申请号:JP2001221974

    申请日:2001-07-23

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To increase driving torque in an initial range during loading while a bent type head actuator and a VCM are miniaturized. SOLUTION: A projected part 82d projected to the outside or the like of a radial direction is formed in the end side of an unloading direction on the outer periphery of a magnet 82, and an outer R part continuous from the radial direction part of a coil 81 is overlapped on the projected part of the magnet, so that during the loading/unloading of the bent type head actuator 13 on the disk by a VCM 18, the bent type head actuator 13 easily goes over a dynamic loading/unloading lamp while the bent type head actuator 13 and the VCM 18 are miniaturized.

    FIXING METAL FOR CHIP SCALE PACKAGE

    公开(公告)号:JP2002246723A

    公开(公告)日:2002-08-30

    申请号:JP2001035062

    申请日:2001-02-13

    Applicant: SONY CORP

    Inventor: YAMADA TAKASHI

    Abstract: PROBLEM TO BE SOLVED: To protect the solder joint of a chip scale package(CSP) against breakage and to prevent breakdown of the CSP. SOLUTION: A fixing metal 10 for a CSP comprises a member 11 for retaining the upper surface of the CSP mounted on a printed board, a guide part 12 having a screw hole 12a for screwing the retaining member 11 and guiding the retaining member 11, and a part 13 for fixing the guide part 12 to the printed board and touching the ground line thereof to discharge the static electricity. The retaining member 11 retains the upper surface of the CSP fixedly, to reduce thermal expansion and contraction thereof mechanically thus protecting the joint of the CSP against breakage; and furthermore, the fixing part 13 makes contact with the ground line of the printed board and discharges the static electricity generated in the CSP and prevents breakdown of the CSP.

    DISK DRIVE
    78.
    发明专利

    公开(公告)号:JP2001057014A

    公开(公告)日:2001-02-27

    申请号:JP22763999

    申请日:1999-08-11

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To realize low load torque and high rigidity by controlling the temperature of a fluid bearing, which supports a spindle motor, in a proper range against change in ambient temperatures in use. SOLUTION: While a spindle motor 2 or a magnetic head arm mechanism 3 among others are assembled in a base 1, a magnetic disk 5 mounted on a cassette case 4 is rotatably driven by the spindle motor 2, with various pieces of information recorded and reproduced by a magnetic head 6. The spindle motor 2 is provided with a fluid bearing 22, in proximity to which a Peltier 10 element and a temperature sensor are installed. Then, by discriminating temperature in the fluid bearing 22 with the temperature sensor and comparing it with a prescribed set value, the polarity and level of an applied voltage are controlled for the Peltier element 10, so that the temperature of the fluid bearing 22 is controllably maintained in a specific range.

    INTERPOSER BOARD
    79.
    发明专利

    公开(公告)号:JP2000243862A

    公开(公告)日:2000-09-08

    申请号:JP3895099

    申请日:1999-02-17

    Applicant: SONY CORP

    Inventor: YAMADA TAKASHI

    Abstract: PROBLEM TO BE SOLVED: To enhance an interposer board in bonding strength to a circuit board. SOLUTION: A semiconductor chip 30 is mounted on one surface 10a of an interposer board, and lands which are bonded to a circuit board are formed on the other surface 10b. In this case, the lands are composed of electrode lands 11a electrically connected to the circuit board and dummy lands 11b which are each larger in area than the electrode land 11a and formed only on the regions of the interposer board that correspond to the four corners of the semiconductor chip 30 mounted on the interposer board.

    MANUFACTURE OF SINGLE-SIDED FLEXIBLE PRINTED WIRING BOARD

    公开(公告)号:JP2000124580A

    公开(公告)日:2000-04-28

    申请号:JP29115298

    申请日:1998-10-13

    Applicant: SONY CORP

    Inventor: YAMADA TAKASHI

    Abstract: PROBLEM TO BE SOLVED: To enable a wiring of a fine pattern to be formed on a single-sided printed board without producing an undercut phenomenon. SOLUTION: A resist pattern 2 corresponding to a wiring pattern is formed on the base of a polyimide-based film forming vessel 1 (a), polyamic acid varnish 3 is uniformly poured into the polyimide-based film forming vessel 1 and turned into imide for the formation of a polyimide-based film 4 (b), the polyimide-based film 4 is taken out of the polyimide-based film forming vessel 1 (c), the resist pattern 2 is removed from the polyimide-based film 4, and a wiring pattern groove 7 is formed (d), conductor is provided inside the wiring pattern groove 7 for the formation of a wiring pattern 10, and a single-sided flexible printed wiring board is formed (e).

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