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    Micro-device on glass
    72.
    发明授权
    Micro-device on glass 有权
    微型玻璃装置

    公开(公告)号：US08911636B2

    公开(公告)日：2014-12-16

    申请号：US14040698

    申请日：2013-09-29

    Applicant: Viswanadam Gautham

    Inventor： Viswanadam Gautham

    IPC: C23F1/00 ,  B44C1/22 ,  B81C1/00 ,  H01L21/00

    CPC classification number: B81C1/00341 ,  B81B2201/051 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C1/00476 ,  B81C2201/0107 ,  B81C2203/036 ,  H01L21/00

    Abstract: A method of fabricating a micro-device having micro-features on glass is presented. The method includes the steps of preparing a first glass substrate, fabricating a metallic pattern on the first glass substrate, preparing a second glass substrate and providing one or more apertures on the second glass substrate, heating the first glass substrate and the second glass substrate with a controlled temperature raise, bonding the first glass substrate and the second glass substrate by applying pressure to form a bonded substrate, wherein the metallic pattern is embedded within the bonded substrate, cooling the bonded substrate with a controlled temperature drop and thereafter maintaining the bonded substrate at a temperature suitable for etching, etching the metallic pattern within the bonded substrate, wherein an etchant has access to the metallic pattern via the apertures, forming a void within the bonded substrate, wherein the void comprises micro-features.

    Abstract translation: 提出了一种在玻璃上制造具有微特征的微器件的方法。 该方法包括以下步骤：制备第一玻璃基板，在第一玻璃基板上制造金属图案，制备第二玻璃基板并在第二玻璃基板上提供一个或多个孔，加热第一玻璃基板和第二玻璃基板， 控制温度升高，通过施加压力来接合第一玻璃基板和第二玻璃基板以形成接合基板，其中金属图案嵌入在接合基板内，以受控的温度下降冷却接合基板，然后保持接合基板 在适于蚀刻的温度下蚀刻所述键合衬底内的所述金属图案，其中所述蚀刻剂经由所述孔进入所述金属图案，在所述键合衬底内形成空隙，其中所述空隙包括微特征。

    METHOD FOR PRODUCING SMALL-SIZED REACTOR AND SMALL-SIZED REACTOR
    78.
    发明申请
    METHOD FOR PRODUCING SMALL-SIZED REACTOR AND SMALL-SIZED REACTOR 审中-公开
    生产小尺寸反应器和小尺寸反应器的方法

    公开(公告)号：US20120224999A1

    公开(公告)日：2012-09-06

    申请号：US13378582

    申请日：2010-06-17

    Applicant: Yuji Kaneko ,  Jumi Kaneko ,  Katsunobu Endo ,  Shigeshi Sakakibara ,  Kazuhiro Shinoda

    Inventor： Yuji Kaneko ,  Jumi Kaneko ,  Katsunobu Endo ,  Shigeshi Sakakibara ,  Kazuhiro Shinoda

    IPC: B32B38/10 ,  B01L3/00

    CPC classification number: B81C3/001 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00831 ,  B81B2201/051 ,  B81C2201/019 ,  B81C2203/036 ,  C03C19/00 ,  C03C23/0085 ,  C03C27/06 ,  C03C2204/08

    Abstract: A small-sized reactor having practical utility in light of a bonding force, ease in observation, exemption from impurities and high resistance against pressure, is provided. In bonding a plural number of inorganic transparent substrates (11) to (13) to form a small-sized reactor, surfaces for bonding (16) to (19) of the inorganic transparent substrates (11) to (13), bonded on contact to one another, are initially polished and planarized. A part of the surface of each of the surfaces for bonding is then machined. The surfaces for bonding (16) to (19) are then hydrophilicity enhanced and washed with pure water. A film of pure water is swung off and removed by a centrifugal force. The resultant product is then heated with the surfaces for bonding in contact with one another. The surfaces for bonding, in contact with one another, may be bonded together by chemical bonding via oxygen to form small-sized reactors (1), (2) in which the inorganic transparent substrates (11) to (13) are bonded together strongly. The reactor is transparent and hence an inner reaction may be observed. Moreover, the reactor is rigid and hence is high in resistance against pressure. Since no adhesive is used, there is no fear of dissolution of impurities.

    Abstract translation: 提供了一种具有粘合力，易于观察，免除杂质和高耐压性的实用性的小型反应器。 在将多个无机透明基板（11）〜（13）接合以形成小型反应器时，在无机透明基板（11）〜（13）的接合（16）〜（19）的接触面 最初抛光和平坦化。 然后对每个用于粘合的表面的一部分表面进行加工。 接合（16）至（19）的表面然后增强亲水性，并用纯水洗涤。 通过离心力将纯净的水膜摆脱并除去。 然后将所得产物与表面加热以进行粘合以彼此接触。 用于接合的表面可以通过氧气的化学键合而结合在一起，以形成小型反应器（1），（2）其中无机透明基板（11）至（13）牢固地结合在一起 。 反应器是透明的，因此可以观察到内部反应。 此外，反应器是刚性的，因此耐压性高。 由于不使用粘合剂，所以不用担心杂质溶解。

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