公开(公告)号：JP2008066850A

公开(公告)日：2008-03-21

申请号：JP2006240300

申请日：2006-09-05

Applicant: Nippon Sheet Glass Co Ltd ,  日本板硝子株式会社

Inventor： SAITO TOMIHISA ,  YOSHIDA HARUNOBU ,  WAKIZAKA MASAHIDE ,  KITAOKA MASAKI

IPC: H04N1/028 ,  G03B27/50 ,  G03B27/54

CPC classification number: H04N1/0318 ,  H04N2201/02412 ,  H04N2201/02429 ,  H04N2201/02441 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02483 ,  H04N2201/03112 ,  H04N2201/03141 ,  H04N2201/03145

Abstract: PROBLEM TO BE SOLVED: To provide a contact image sensor having a structure for facilitating the alignment of a light-receiving element array substrate in order to prevent the occurrence of ghost images.
SOLUTION: The contact image sensor comprises: a light source 20 having a light-emitting element array; a slit 22; a lens 24; a light-receiving element array substrate 26 on which a light-receiving element array 25 is mounted; and a housing 28 for containing them. Four leads 30 for power supply are provided on one end of the light source 20. Four U-shaped depressions 32 are formed on one end of the light-receiving element array substrate 26 so that the leads 30 pass through them. Each of the depressions 32 has a large enough width for the thickness of each of the leads 30.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种接触图像传感器，其具有便于光接收元件阵列基板的对准的结构，以便防止重影图像的发生。 接触式图像传感器包括：具有发光元件阵列的光源20; 狭缝22; 透镜24; 光接收元件阵列基板26，其上安装有光接收元件阵列25; 和用于容纳它们的壳体28。 四个用于供电的引线30设置在光源20的一端。四个U形凹陷32形成在光接收元件阵列基板26的一端，使得引线30穿过它们。 每个凹陷32对于每个引线30的厚度具有足够大的宽度。版权所有（C）2008，JPO和INPIT

公开(公告)号：JP2003283933A

公开(公告)日：2003-10-03

申请号：JP2002081037

申请日：2002-03-22

Applicant: Ricoh Co Ltd ,  株式会社リコー

Inventor： NAKAJIMA MITSURU

IPC: H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/31 ,  H01L23/367 ,  H04N1/00 ,  H04N1/028 ,  H04N1/03 ,  H04N5/335 ,  H04N5/369

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/315 ,  H01L23/367 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H04N1/00885 ,  H04N1/00907 ,  H04N1/00989 ,  H04N1/03 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/02487 ,  H01L2924/00 ,  H01L2924/3512

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device having an airtight functional plane, preventing a contact from breakdown caused by thermal expansion. SOLUTION: A semiconductor device is constituted of a junction member 100 provided with a semiconductor element 2 having a semiconductor element functional plane 2a, and a electric distribution means 5 electrically connected to the semiconductor element functional plane 2a, with the junction member 100 being disposed on a base 1 with the distribution means 5 facing the base 1. In a portion excluding a portion between the base 1 and the distribution means 5, there are provided an adhesive agent 3 in a fixed portion for securing the semiconductor element 2 onto the base 1, and a sealing member 33 for sealing a portion excluding both the fixed portion and the portion between the base 1 and the distribution means 5, in which the sealing member 33 has less elasticity than the adhesive agent 3 provided in the fixed portion. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供具有气密功能平面的半导体器件，防止由热膨胀引起的接触。 解决方案：半导体器件由设置有具有半导体元件功能面2a的半导体元件2的接合部件100和与半导体元件功能面2a电连接的配电部件5构成，连接部件100 设置在底座1上，其中分配装置5面向基座1.在除了基座1和分配装置5之间的部分之外的部分中，设置有用于将半导体元件2固定到固定部分中的粘合剂3 底座1和用于密封除了固定部分和基部1与分配装置5之间的部分以外的部分的密封部件33，其中密封部件33的弹性小于设置在固定部分中的粘合剂3 。 版权所有（C）2004，JPO

公开(公告)号：JP5447783B2

公开(公告)日：2014-03-19

申请号：JP2009057678

申请日：2009-03-11

Applicant: 株式会社リコー

Inventor： 晋 三ヶ尻

IPC: G02F1/13 ,  B41J2/44 ,  G02B26/10 ,  G02F1/133 ,  G02F1/1333 ,  H04N1/113

CPC classification number: B41J2/473 ,  G02B26/124 ,  G02B26/127 ,  G02F1/1313 ,  H04N1/032 ,  H04N1/1135 ,  H04N2201/0241 ,  H04N2201/02412 ,  H04N2201/02414 ,  H04N2201/02425 ,  H04N2201/02427 ,  H04N2201/02449 ,  H04N2201/02458 ,  H04N2201/0247 ,  H04N2201/02485

Abstract: An optical scanning device includes a light source, an optical system, and a housing. The light source projects a light beam. The housing includes a holder and encloses the optical system. The optical system includes a liquid crystal element held by the housing via the holder, to modulate a phase of the light beam projected from the light source against a scanned surface. The liquid crystal element includes a plurality of substantially transparent substrates, a liquid crystal layer, and a sealing member. One of the plurality of the transparent substrates has a size larger than any other transparent substrates and is positioned in the holder. The liquid crystal layer is sandwiched between the plurality of substantially transparent substrates. The sealing member seals the liquid crystal layer between the plurality of substantially transparent substrates.

公开(公告)号：JP2013251633A

公开(公告)日：2013-12-12

申请号：JP2012123494

申请日：2012-05-30

Applicant: Canon Inc ,  キヤノン株式会社

Inventor： TAKAHASHI TOSHIO

IPC: H04N1/028

CPC classification number: H04N1/0249 ,  B23K1/0008 ,  B23K31/02 ,  B32B37/12 ,  B32B37/18 ,  B32B2457/00 ,  H04N1/0303 ,  H04N1/195 ,  H04N2201/02454 ,  H04N2201/02458 ,  H04N2201/02466 ,  H04N2201/0247 ,  H04N2201/02479 ,  H04N2201/02485

Abstract: PROBLEM TO BE SOLVED: To provide an image reading device that reduces focus deviation caused by a change in volume of an adhesive during curing to read a document in a high-quality manner.SOLUTION: An image reading device includes an image forming unit that forms light from a document into an image, a solid state imaging element that receives light from the document through the image forming unit, an image forming unit holding member to which the image forming unit is fixed, and a solid state imaging element holding member to which the solid state imaging element is fixed. The image forming unit holding member and the solid state imaging element holding member are fixed with an adhesive or solder.

Abstract translation: 要解决的问题：提供一种图像读取装置，其减少由固化期间的粘合剂体积变化引起的聚焦偏差，从而以高质量的方式读取文件。解决方案：图像读取装置包括：图像形成单元，其形成 从文档到图像的光，通过图像形成单元从文档接收光的固态成像元件，固定有图像形成单元的图像形成单元保持构件，以及固态成像元件保持构件， 固态成像元件是固定的。 图像形成单元保持构件和固态成像元件保持构件用粘合剂或焊料固定。

公开(公告)号：JP4152826B2

公开(公告)日：2008-09-17

申请号：JP2003198593

申请日：2003-07-17

Applicant: 株式会社リコー

Inventor： 重勇 小林

IPC: G02B7/02 ,  G02B7/04 ,  G02B27/62 ,  G03B17/00 ,  H01J3/14 ,  H04N1/028 ,  H04N1/03 ,  H04N1/19

CPC classification number: G02B27/62 ,  G02B7/025 ,  H04N1/03 ,  H04N2201/02431 ,  H04N2201/02449 ,  H04N2201/02456 ,  H04N2201/02458 ,  H04N2201/0247 ,  H04N2201/02485

Abstract: An image scanning unit includes at least two lens groups for imaging a reflected image of a manuscript on a lined photoelectric conversion element ( 12 ), lens barrels ( 14, 15 ) for holding the lenses, respectively, and constituting an imaging lens system ( 16 ), a base member ( 10 ) on which the lined photoelectric conversion element ( 12 ) and the lens barrels ( 14, 15 ) are disposed, and intermediate holding members ( 13, 19 ) for mounting at least one of the lens barrels ( 14 ) and the lined photoelectric conversion element ( 12 ) on the base member ( 10 ).

公开(公告)号：JP4012751B2

公开(公告)日：2007-11-21

申请号：JP2002081037

申请日：2002-03-22

Applicant: 株式会社リコー

Inventor： 充 中嶋

IPC: H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/31 ,  H01L23/367 ,  H04N1/00 ,  H04N1/028 ,  H04N1/03 ,  H04N5/335 ,  H04N5/369

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/315 ,  H01L23/367 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H04N1/00885 ,  H04N1/00907 ,  H04N1/00989 ,  H04N1/03 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/02487 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface, a power supplying device electrically connected to a part of the functional surface of the semiconductor chip and separated by a slight gap from the substrate, a fixing member that fixes the semiconductor chip to the substrate, and a sealing member that seals the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member and other than the gap formed between the power supplying device and the substrate. The sealing member has greater elasticity than the fixing member.

公开(公告)号：JP3746806B2

公开(公告)日：2006-02-15

申请号：JP6516495

申请日：1995-02-28

Applicant: ペンタックス株式会社

Inventor： 政博 大野 ,  伊広 山崎

IPC: G03B27/54 ,  H04N1/00 ,  H04N1/03 ,  H04N1/10 ,  H04N1/19 ,  H04N1/193

CPC classification number: H04N1/0303 ,  H04N1/03 ,  H04N1/0305 ,  H04N1/1017 ,  H04N1/193 ,  H04N2201/02464 ,  H04N2201/0247 ,  H04N2201/02477 ,  H04N2201/02483 ,  H04N2201/0428

Abstract: A housing includes a first portion and second portion. Each of the first and second portions supports a mirror and are connected and prevented from independent movement through a cover glass plate. The connection between the portions of the housing reduces the amount of angular change of mirrors within the housing resulting from a change in temperature, and thereby reduces the amount of displacement of a reading point of an image receiving element during the temperature change. The reading point is projected along an optical path including multiple reflections from the mirrors. A first connection device tightly fits the cover glass plate between the first and second portions of the housing, and a second connection device adheres the cover glass plate to the first and second portions of the housing.

公开(公告)号：TW200721797A

公开(公告)日：2007-06-01

申请号：TW095133051

申请日：2006-09-07

Applicant: 日本板硝子股份有限公司 NIPPON SHEET GLASS COMPANY, LIMITED

Inventor： 齊藤富久 SAITO TOMIHISA ,  吉田治信 YOSHIDA HARUNOBU ,  政英 WAKISAKA MASAHIDE ,  北岡正樹 MASAKI KITAOKA

IPC: H04N

CPC classification number: H04N1/0318 ,  H04N2201/02412 ,  H04N2201/02429 ,  H04N2201/02441 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02483 ,  H04N2201/03112 ,  H04N2201/03141 ,  H04N2201/03145

Abstract: 本發明之目的在於為了防止疊像(ghost image)之發生而提供具有容易對受光元件陣列基板進行位置調整之構造的接觸式影像感測器。本發明之接觸式影像感測器係由以下所構成:具有發光元件陣列之光源20;狹縫22;透鏡24;安裝有受光元件陣列25之受光元件陣列基板26;以及將該等收容之外罩(housing)28。於光源20之一端設有電源供給用之4條引線30。受光元件陣列基板26之一端形成有4個讓引線30通過之U字狀凹部32。該凹部32相對於引線30之粗細係具有充足的大小。

Abstract in simplified Chinese: 本发明之目的在于为了防止叠像(ghost image)之发生而提供具有容易对受光组件数组基板进行位置调整之构造的接触式影像传感器。本发明之接触式影像传感器系由以下所构成:具有发光组件数组之光源20;狭缝22;透镜24;安装有受光组件数组25之受光组件数组基板26;以及将该等收容之外罩(housing)28。于光源20之一端设有电源供给用之4条引线30。受光组件数组基板26之一端形成有4个让引线30通过之U字状凹部32。该凹部32相对于引线30之粗细系具有充足的大小。

公开(公告)号：TW201127009A

公开(公告)日：2011-08-01

申请号：TW099103970

申请日：2010-02-09

Applicant: 佳能組件股份有限公司

Inventor： 齋藤直人

IPC: H04N

CPC classification number: H04N1/02815 ,  H04N1/02835 ,  H04N1/0311 ,  H04N1/0312 ,  H04N1/1017 ,  H04N2201/02458 ,  H04N2201/0247 ,  H04N2201/02474 ,  H04N2201/02481

Abstract: 排列複數個光電轉換元件(6k)，而予以實際安裝的感測器基板(7)，在保持使來自原稿的反射光成像在感測器基板(7)的成像元件(5)的框(8)中，成像元件(5)是至少使切斷長邊方向一方的端部的複數個柱狀透鏡陣列(5)的切斷部彼此連接，且形成為預定的讀取寬幅，框(8)具有保持柱狀透鏡陣列(5)的保持部(13)，保持部(13)是將柱狀透鏡陣列(5)的切斷部及/或連接部的位置的底面(13B)做寬。

Abstract in simplified Chinese: 排列复数个光电转换组件(6k)，而予以实际安装的传感器基板(7)，在保持使来自原稿的反射光成像在传感器基板(7)的成像组件(5)的框(8)中，成像组件(5)是至少使切断长边方向一方的端部的复数个柱状透镜数组(5)的切断部彼此连接，且形成为预定的读取宽幅，框(8)具有保持柱状透镜数组(5)的保持部(13)，保持部(13)是将柱状透镜数组(5)的切断部及/或连接部的位置的底面(13B)做宽。

公开(公告)号：TWI437871B

公开(公告)日：2014-05-11

申请号：TW099103970

申请日：2010-02-09

Applicant: 佳能組件股份有限公司 ,  CANON COMPONENTS, INC.

Inventor： 齋藤直人 ,  SAITO, NAOTO

IPC: H04N1/028

CPC classification number: H04N1/02815 ,  H04N1/02835 ,  H04N1/0311 ,  H04N1/0312 ,  H04N1/1017 ,  H04N2201/02458 ,  H04N2201/0247 ,  H04N2201/02474 ,  H04N2201/02481