公开(公告)号：US07123808B2

公开(公告)日：2006-10-17

申请号：US10993376

申请日：2004-11-19

Applicant: Sam Denovich ,  Bruce Eltringham Barry ,  James Joseph Eberle, Jr. ,  John Carey Hoffer

Inventor： Sam Denovich ,  Bruce Eltringham Barry ,  James Joseph Eberle, Jr. ,  John Carey Hoffer

IPC: G02B6/00

CPC classification number: H04Q1/06 ,  G02B6/4452 ,  H04Q1/035 ,  H04Q1/09 ,  H04Q2201/02 ,  H04Q2201/06

Abstract: A cable management system includes an equipment system, and at least one patch panel having a connectivity interface. The connectivity interface is configured to connect with at least one cable extending from the equipment system. The cable management system also includes a manifold configured to be located between the equipment system and the patch panel. The manifold includes an inlet and an outlet, and the manifold is configured to direct the at least one cable from the equipment system to the connectivity interface.

Abstract translation: 电缆管理系统包括设备系统和至少一个具有连接接口的接线板。 连接接口被配置为与从设备系统延伸的至少一根电缆连接。 电缆管理系统还包括配置成位于设备系统和接线板之间的歧管。 歧管包括入口和出口，并且歧管被配置为将至少一个电缆从设备系统引导到连接接口。

公开(公告)号：US20050128722A1

公开(公告)日：2005-06-16

申请号：US10793619

申请日：2004-03-04

Applicant: William Miller ,  Kelly Johnson

Inventor： William Miller ,  Kelly Johnson

IPC: H04M19/00 ,  H04N7/173 ,  H04Q1/02 ,  H04Q1/06 ,  H05K7/14 ,  H05K7/18

CPC classification number: H04Q1/03 ,  H04M19/00 ,  H04Q1/026 ,  H04Q1/035 ,  H04Q1/06 ,  H04Q1/11 ,  H04Q2201/02 ,  H04Q2201/06 ,  H04Q2201/10 ,  H05K7/183 ,  H05K7/186

Abstract: Remote enclosure systems have now been designed and are described herein that meet the following goals: a) consolidate electrical terminations in one system; b) pre-terminate AC and DC equipment loads before site installation; c) provide multiple access points for facilitating equipment repair and installation; d) are easily configurable and expanded through the use of a modular frame design that accommodates a variety of customized side panels or the attachment of a variety of expansion cabinets; e) are aesthetically functional given the cable entry and routing structure; f) provide exceptional thermal management and g) reduce problems inherent in conventional electronic setups. Remote enclosure systems contemplated generally include: a) a frame system further comprising at least two side panels; b) at least one door coupled to the frame system; c) a cable management top assembly coupled to the frame system; d) at least one removable radio frequency (RF) management system, such as at least one RF port plate, at least one RF port, at least one RF cable or any other suitable system for managing RF signals and a combination thereof, coupled to at least one of the side panels, coupled to and/or located within the cable management top assembly and/or coupled to and/or located within the frame system or a combination thereof and e) a bottom panel coupled to the frame system. The remote enclosure system may also comprise any number of components suitable for electronics, wireless and cable-based data and telecommunications applications, including air conditioner exhaust member, an air conditioner unit, a battery pack, a meter base, a power receptacle box, an alarm system or alarm device, an expansion cabinet, a coupling device or system, a pre-wiring system and/or a demarcation component.

Abstract translation: 本文中已经设计和描述了远程外壳系统，以满足以下目标：a）在一个系统中整合电气终端; b）在现场安装之前预先终止交流和直流设备负载; c）提供多个接入点，便于设备维修和安装; d）通过使用可容纳各种定制侧板或各种扩展柜的附件的模块化框架设计，可以轻松配置和扩展; e）鉴于电缆入口和路由结构，具有美观功能; f）提供卓越的热管理，并且g）减少常规电子设置中固有的问题。 涵盖的远程外壳系统通常包括：a）还包括至少两个侧板的框架系统; b）至少一个联接到所述框架系统的门; c）耦合到所述框架系统的电缆管理顶部组件; d）至少一个可移动射频（RF）管理系统，例如至少一个RF端口板，至少一个RF端口，至少一个RF电缆或用于管理RF信号的任何其它合适的系统及其组合，耦合到 耦合到和/或位于电缆管理顶部组件内和/或耦合到框架系统中和/或位于框架系统内或其组合中的至少一个侧板，以及e）联接到框架系统的底板。 远程外壳系统还可以包括适合于电子，无线和基于电缆的数据和电信应用的任何数量的组件，包括空调排气构件，空调单元，电池组，仪表座，电源插座盒， 报警系统或报警装置，扩展柜，耦合装置或系统，预接线系统和/或分界件。

公开(公告)号：US20050071689A1

公开(公告)日：2005-03-31

申请号：US10671432

申请日：2003-09-26

Applicant: Michael Coward ,  Alan Signorelli ,  Jeffrey Schafer ,  David French ,  Bryan Gurganus

Inventor： Michael Coward ,  Alan Signorelli ,  Jeffrey Schafer ,  David French ,  Bryan Gurganus

IPC: G06F1/18 ,  H04M3/10 ,  H04Q1/02 ,  H05K7/14 ,  G06F1/26

CPC classification number: H04Q1/06 ,  G06F1/189 ,  H04M3/10 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q2201/02 ,  H04Q2201/06 ,  H04Q2201/12 ,  H05K7/1457

Abstract: An independently powered slots architecture for use in telecom/datacom systems, the architecture including the capability to support at least one power module, and may include a manager module, a storage module, an alarm module, a console module, and a cooling module. Method for using same also disclosed.

Abstract translation: 一种用于电信/数据通信系统的独立供电的插槽架构，该架构包括支持至少一个电源模块的能力，并且可以包括管理器模块，存储模块，报警模块，控制台模块和冷却模块。 使用方法也公开。

公开(公告)号：US06570762B2

公开(公告)日：2003-05-27

申请号：US09935586

申请日：2001-08-24

Applicant: Douglas B. Cross ,  John C. Atkinson ,  Marko Nicolici ,  Kalvin W. Korpela ,  Roger D. Carroll

Inventor： Douglas B. Cross ,  John C. Atkinson ,  Marko Nicolici ,  Kalvin W. Korpela ,  Roger D. Carroll

IPC: H05K720

CPC classification number: H04Q1/09 ,  H04Q1/035 ,  H04Q1/06 ,  H04Q2201/02 ,  H04Q2201/04 ,  H04Q2201/06 ,  H04Q2201/14

Abstract: The invention refers to a telecommunications system comprising a module rack that defines a core bay, a service plane and a rack interface plane where the service plane is transverse to the rack interface plane. The core bay is in part bounded by the service plane and the rack interface plane. The telecommunications system also comprises a series of electronics modules each defining an electronics orientation plane where each of the modules includes two opposed cooling surfaces oriented substantially parallel to the electronics orientation plane. Each of the electronics modules is removably secured within the core bay. The series of the electronics modules forms an array such that their electronics orientation planes are substantially perpendicular to both the rack interface plane and the service plane. The array also defines at least one coolant stream passage across each cooling surface. Further the telecommunications system includes a coolant movement means for moving a coolant through the coolant stream passages and across the rack interface plane. As such, the coolant convects heat away from the cooling surfaces of electronics modules more efficiently and effectively than found in the prior art as it, amongst other things, shortens the distance over which the inlet coolant is required to travel to cool the same functional density and provides a coolant to the passage at approximately a uniform temperature for each module.

公开(公告)号：US20030011988A1

公开(公告)日：2003-01-16

申请号：US10203910

申请日：2002-08-15

Inventor： Gunter Irmer

IPC: H05K005/00

CPC classification number: H04Q1/14 ,  H02B1/013 ,  H02B1/50 ,  H02B1/565 ,  H04Q1/025 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10

Abstract: A distribution cabinet (1) for accommodating weak-current distribution installations, in particular for arranging outdoors, having a base box (2), an outer cabinet body (3) with at least one door (4), a cabinet cover (5), and an inner installation frame (6), the installation frame (6) being made up of profile sections (50), of which the cross-sectional shapes has two insertion pockets (51a,b), of which the insertion directions (52a,b) run at right angles to one another.

Abstract translation: 一种用于容纳弱电流分配装置的配电柜（1），特别用于布置在户外，具有底盒（2），具有至少一个门（4）的外柜主体（3），柜盖（5） 和安装框架（6），所述安装框架（6）由轮廓部分（50）构成，其横截面形状具有两个插入口（51a，b），其中插入方向（52a） ，b）彼此直角运行。

公开(公告)号：US20020118525A1

公开(公告)日：2002-08-29

申请号：US09825163

申请日：2001-04-03

Inventor： Gregory J. Fritz ,  Alejandra Anderson ,  Robin Berg ,  Todd Husom ,  Eric Sit

IPC: H05K007/14

CPC classification number: H05K7/1425 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q1/155 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K7/186 ,  H05K2201/093 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract translation: 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一边缘上的翅片。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。

公开(公告)号：US06396691B1

公开(公告)日：2002-05-28

申请号：US09550619

申请日：2000-04-17

Applicant: Ernest Pagnozzi

Inventor： Ernest Pagnozzi

IPC: H05K720

CPC classification number: H05K7/20445 ,  H04Q1/035 ,  H04Q2201/06

Abstract: A repeater case capable of housing HDSL telecommunications modules without an excessive buildup of heat. The repeater case has a base, an open-topped housing, and a closure member that closes the housing. The closure member is provided in the form of a pair of thermal covers that share a common construction, including heat-radiating fins formed on their respective top walls and heat transferring structures positioned on the respective interior sides of their top walls. The housing includes multiple printed circuit boards to further enhance internal air flow, each of which is protected from short circuits by an acrylic plastic barrier mounted in vertically spaced apart relation from it. The spacing between each printed circuit board and its barrier provides ample space for the connection of individual conductors from a stub cable that enters the repeater case through an opening formed in the base. The spacing also enhances the air flow within the repeater case.

Abstract translation: 一种能够容纳HDSL电信模块而不会过多积聚热量的中继器。 中继器壳体具有底座，敞开的外壳以及关闭壳体的封闭构件。 封闭构件以一对热罩的形式提供，共享共同的结构，包括形成在其各自顶壁上的散热翅片和位于其顶壁的相应内侧上的热传递结构。 壳体包括多个印刷电路板，以进一步增强内部空气流动，其中的每一个通过与其垂直间隔开的关系安装的丙烯酸塑料屏障而被短路保护。 每个印刷电路板与其屏障之间的间隔为通过形成在基座中的开口进入中继器外壳的短路电缆连接各个导体提供了充足的空间。 间距也增强了中继器外壳内的气流。

公开(公告)号：US20020054481A1

公开(公告)日：2002-05-09

申请号：US09804129

申请日：2001-03-12

Applicant: ADC Telecommunications, Inc.

Inventor： Gary Gustine ,  Charles G. Ham ,  Michael Sawyer ,  Fredrick Daniels ,  Michelle Bishop ,  Lane King ,  Matthew Kusz

IPC: H05K007/20

CPC classification number: H05K7/20409 ,  H04Q1/035 ,  H04Q1/09 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K7/20418 ,  H05K7/20445

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract translation: 用于容纳诸如电子电路卡的物体的装置及其制造方法，该装置具有壳体; 设置在所述壳体内的至少一个壳体，所述壳体适于将所述物体限制在所述壳体内的不同位置并且包括框架，所述框架内的所述区域由第一分区分成两个区域，所述两个区域中的每一个被划分为多个 通过多个第二分区，每个第二分区热耦合到框架和第一分区，每个部分被划分成多个狭槽，每个狭槽具有设置在其中的物体，用于在第一分隔件之间进行热接触， 第二分区，以及第二分区和所述帧中的一个; 以及至少一个适于从壳体吸收热量的散热器，所述散热器热耦合到壳体和壳体。

公开(公告)号：WO2002096124A2

公开(公告)日：2002-11-28

申请号：PCT/US2002/012982

申请日：2002-04-23

Applicant: ADC TELECOMMUNICATIONS, INC.

Inventor： FRITZ, Gregory, J. ,  ANDERSON, Alejandra ,  BERG, Robin, Jr. ,  HUSOM, Todd ,  SIT, Eric, K.

IPC: H04Q

CPC classification number: H05K7/1425 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/10 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/18 ,  H05K7/186 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract translation: 公开了一种底盘（100）和相关联的电信电路卡（110）。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间设置气隙（103）。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一个边缘上的翅片。 电路卡（110）包括诸如具有配对和分离的导体的多个板层的导体结构。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。

公开(公告)号：WO2002082877A2

公开(公告)日：2002-10-17

申请号：PCT/US2002/009557

申请日：2002-03-26

Applicant: ADC TELECOMMUNICATIONS, INC.

Inventor： FRITZ, Gregory, J. ,  ANDERSON, Alejandra ,  BERG, Robin, JR. ,  HUSOM, Todd ,  SIT, Eric, K.

IPC: H05K7/00

CPC classification number: H05K7/1425 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q1/155 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K7/186 ,  H05K2201/093 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract translation: 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一个边缘上的翅片。 电路卡包括诸如具有配对和分离的导体的多个板层的导体结构。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。