公开(公告)号：EP3071002A4

公开(公告)日：2016-12-07

申请号：EP14876888

申请日：2014-12-29

Applicant: KUNSHAN VISIONOX DISPLAY CO LTD

Inventor： AN LEPING ,  WANG LONG ,  GAO MING ,  HONG YAO ,  PU BIN

IPC: H05K1/02

CPC classification number: H05K1/028 ,  G06F3/041 ,  G06F2203/04107 ,  H05K1/0213 ,  H05K1/0215 ,  H05K2201/053 ,  H05K2201/09009

公开(公告)号：EP2898446A4

公开(公告)日：2016-04-27

申请号：EP13838256

申请日：2013-09-23

Applicant: STORA ENSO OYJ

Inventor： MAIJALA JUHA

IPC: G06K7/08 ,  A61J1/03 ,  A61J7/04 ,  B65D75/36 ,  G06K19/07 ,  H04B5/02 ,  H05K3/10

CPC classification number: H01L23/66 ,  A61J1/035 ,  A61J2200/30 ,  A61J2205/60 ,  B65D25/00 ,  B65D2203/10 ,  H01L23/4985 ,  H01L23/564 ,  H01L23/585 ,  H01L23/642 ,  H01L23/645 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/0239 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0292 ,  H05K1/111 ,  H05K1/165 ,  H05K3/0052 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09954 ,  H05K2201/0999 ,  H05K2201/2036 ,  H05K2203/0195 ,  H05K2203/0228 ,  H01L2924/00

Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

公开(公告)号：EP2940786A1

公开(公告)日：2015-11-04

申请号：EP13869042.5

申请日：2013-08-23

Applicant: ZTE Corporation

Inventor： HE, Xiangyu ,  SUN, Weiju ,  MA, Hairong

IPC: H01Q1/22

CPC classification number: H01Q1/2283 ,  H01Q1/38 ,  H05K1/0393 ,  H05K1/165 ,  H05K2201/053 ,  H05K2201/10098

Abstract: In order to solve the problem that connections between a module body and one or more antennas are unstable in an existing LGA module, provided are a Land Grid Array (LGA) module and a device. The LGA module comprises a module body and one or more antennas, wherein the module body and the one or more antennas are of an integrated structure. By the implementation of the present invention, the module body and the one or more antennas in the LGA module are integrated, so that the strength of connections between the module body and the one or more antennas are enhanced, a phenomenon that the module body is separated from the one or more antennas is avoided during use, and the stable running of the device is ensured.

Abstract translation: 为了解决模块体与一个或多个天线之间的连接在现有的LGA模块中不稳定的问题，提供了一种Land Grid Array（LGA）模块和一种设备。 LGA模块包括模块主体和一个或多个天线，其中模块主体和一个或多个天线是一体的结构。 通过实施本发明，将模块主体和LGA模块中的一个或多个天线集成，使得模块主体与一个或多个天线之间的连接强度增强，模块体为 在使用中避免与一个或多个天线分离，并且确保设备的稳定运行。

公开(公告)号：EP2720610A1

公开(公告)日：2014-04-23

申请号：EP12801239.0

申请日：2012-06-18

Applicant: Abbott Diabetes Care, Inc.

Inventor： MOEIN, Mohammad, E. ,  PACE, Louis, G. ,  HOSS, Udo ,  LE, Phu, X. ,  CURRY, Samuel, M.

IPC: A61B5/0245 ,  A61B5/1468 ,  A61B5/1473 ,  G01N27/00 ,  G01N27/416 ,  G06Q50/00 ,  H01L23/498

CPC classification number: A61B5/1486 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/4839 ,  A61B5/6848 ,  A61B2562/227 ,  H01L24/72 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K3/325 ,  H05K3/365 ,  H05K2201/053 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

公开(公告)号：EP2046103B1

公开(公告)日：2011-09-14

申请号：EP07790757.4

申请日：2007-07-13

Applicant: NEC Corporation

Inventor： TOKUYAMA, Mayumi

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K1/118 ,  H05K1/0268 ,  H05K1/189 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/10189 ,  Y10T29/49126

Abstract: The space of a flexible printed wiring board mounting region is saved, and the size of an electronic device mounted with this is reduced. The flexible printed board comprises a terminal board portion having terminals and a wiring board portion having wirings connected to the terminals. A terminal adjacent part of the wiring board portion adjacent along the length direction of the terminal board portion is foldable so that the terminal adjacent part can be laid on the opposite surface to the terminal forming surface of the terminal board portion.

公开(公告)号：EP2334157A2

公开(公告)日：2011-06-15

申请号：EP10015380.8

申请日：2010-12-07

Applicant: Hosiden Corporation

Inventor： Shinoda, Koji ,  Nakagawa, Hiroshi

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/118 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2203/0195 ,  H05K2203/1572 ,  H05K2203/166 ,  H05K2203/167

Abstract: A plurality of protruding substrate portions (12) is extended from positions placed at an interval from each other along a peripheral edge of a wiring substrate (10). Each of the protruding substrate portions (12) is provided with wiring terminals (15), (16) electrically connected to each of a plurality of electrode terminals provided to an electrical instrument substrate. A cut-out part (18) is formed in a peripheral edge (13a) between the protruding substrate portions (12) in the wiring substrate (10).

Abstract translation: 多个突出基板部分（12）从沿着布线基板（10）的周缘彼此间隔开的位置延伸。 每个突出基板部分（12）设置有电连接到设置在电气仪器基板上的多个电极端子中的布线端子（15），（16）。 在布线基板（10）中的突出基板部分（12）之间的周边边缘（13a）中形成切口部分（18）。

公开(公告)号：EP2188013A2

公开(公告)日：2010-05-26

申请号：EP09733999.8

申请日：2009-04-22

Applicant: Medtronic, Inc.

Inventor： ENGMARK, David, B. ,  GROSE, Gary, M. ,  SCHAEFER, Todd, H. ,  CEBALLOS, Thomas, I. ,  RIES, Andrew, J.

IPC: A61N1/375 ,  H05K1/14 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/189 ,  A61N1/375 ,  A61N1/3758 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/053 ,  H05K2201/10083 ,  H05K2201/10363 ,  Y10T29/49126

Abstract: An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.

公开(公告)号：EP2046103A4

公开(公告)日：2010-02-24

申请号：EP07790757

申请日：2007-07-13

Applicant: NEC CORP

Inventor： TOKUYAMA MAYUMI

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K1/118 ,  H05K1/0268 ,  H05K1/189 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/10189 ,  Y10T29/49126

公开(公告)号：EP1945011A3

公开(公告)日：2009-07-01

申请号：EP08000231.4

申请日：2008-01-08

Applicant: Funai Electric Co., Ltd.

Inventor： Nishidate, Tetsuo

IPC: H05K1/14

CPC classification number: H05K1/147 ,  H05K3/363 ,  H05K2201/053 ,  Y10T428/12

Abstract: In the case of connecting a flexible substrate to a counterpart substrate by soldering, the area of a dead space on the counterpart substrate due to being covered with the flexible substrate is reduced to reduce the outside dimension of the counterpart substrate. Solder lands 61 and 62 on the flexible substrate 5 are soldered to solder lands 21 and 22 on the counterpart substrate 1. The flexible substrate 5 is divided into two branching pieces 71 and 72 by an incision 7 or a slit 8 formed in such a manner as to extend from an intermediate part in the arrangement direction R of circuit patterns to the leading end of the flexible substrate. The space between the solder lands 61 and 62 on the respective pieces 71 and 72 is made equal to the space between the two spaced-apart solder lands 21 and 22 on the counterpart substrate 1 by placing the pieces 71 and 72 formed by dividing the flexible substrate 5 on one another.

公开(公告)号：EP1682386A1

公开(公告)日：2006-07-26

申请号：EP04797519.8

申请日：2004-11-02

Applicant: PEGUFORM GMBH ,  Carl Freudenberg KG ,  Conti Temic microelectronic GmbH

Inventor： HARTMANN, Ulrich ,  JOHANN, Rudolf ,  TROGISCH, Günther ,  KÖNIG, Sibyll

IPC: B60R16/02 ,  B60R13/02 ,  H05K13/06

CPC classification number: B60R16/0215 ,  B60R2013/0287 ,  H05K1/118 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/053

Abstract: The invention relates to a method for mounting sub-assemblies (17) on components, in particular on vehicle doors (1). Once the elements of the sub-assembly (17) have been pre-assembled on a support element (13), the entire electric or electronic circuit that is contained in the sub-assembly is fixed in one step to the component (1). The almost exclusive use of flexible printed circuits for the connection between individual elements (14), such as switching, control or signal elements and the resultant weight savings, in addition to the automation of the mounting process permit a significant reduction in costs for the mass production of medium to large quantities.