Abstract:
The present invention relates to an electro-optic probe, which includes the following components: a laser diode for emitting a modulating laser light according to control signals generated in a main body of the electro-optic sampling oscilloscope; a first lens for converting the modulating laser light to a parallel beam; a second lens for focusing the parallel beam; an opto-electronic element having a reflection film at a reflection-end; an isolator device disposed between the first lens and the second lens for transmitting the modulating laser light and separating a reflected beam produced at the reflection film into signal beams; and photo-diodes for converting optical energies of the signal beams separated by the isolator device into respective electrical signals; wherein, the signal beams to enter the photo-diodes are directed to propagate towards the laser diode, and the photo-diodes are disposed in a longitudinal direction of a probe casing.
Abstract:
In a detection section using a fiber grating (FBG), both ends of the FBG are protected with resin coating and a coated part is adhered or mechanically clamped to fixed parts. A spring or a lever or both of these are connected to one end of this fixed part. This is used as a detection section to convert a variation of a physical quantity such as displacement, weight, pressure or acceleration applied to between the fixed parts to a variation of a reflected wavelength or a transmitted wavelength from a fiber grating and to output the variation of the reflected wavelength and transmitted wavelength.
Abstract:
To provide a method and equipment for measuring a radiation temperature both capable of measuring temperatures of a substrate more accurately and stably than ever and equipment for manufacturing semiconductors therein such a radiation temperature measuring method can be applied. A reflectometer 21 irradiates, on a wafer W having Si and SiO2 layers, light of a wavelength that transmits the Si layer and is reflected from the SiO2 layer (an interface between Si and SiO2) to measure reflectance. With the reflectance and radiation energy at the wavelength of the wafer W measured by a radiation thermometer, a temperature of the wafer W is calculated. Thereby, even when a thin film is formed on a rear face of the substrate to blot and to result in a change of a state thereof, by the use of a stable interface in the substrate, temperatures can be measured with precision and stability.