Electro-optic probe
    71.
    发明申请
    Electro-optic probe 失效
    电光探头

    公开(公告)号:US20020092975A1

    公开(公告)日:2002-07-18

    申请号:US10080768

    申请日:2002-02-22

    CPC classification number: G01R1/071

    Abstract: The present invention relates to an electro-optic probe, which includes the following components: a laser diode for emitting a modulating laser light according to control signals generated in a main body of the electro-optic sampling oscilloscope; a first lens for converting the modulating laser light to a parallel beam; a second lens for focusing the parallel beam; an opto-electronic element having a reflection film at a reflection-end; an isolator device disposed between the first lens and the second lens for transmitting the modulating laser light and separating a reflected beam produced at the reflection film into signal beams; and photo-diodes for converting optical energies of the signal beams separated by the isolator device into respective electrical signals; wherein, the signal beams to enter the photo-diodes are directed to propagate towards the laser diode, and the photo-diodes are disposed in a longitudinal direction of a probe casing.

    Abstract translation: 本发明涉及一种电光探针,其包括以下部件:激光二极管,用于根据在电光采样示波器的主体中产生的控制信号发射调制激光; 用于将调制激光转换成平行光束的第一透镜; 用于聚焦平行光束的第二透镜; 在反射端具有反射膜的光电元件; 隔离器装置,设置在所述第一透镜和所述第二透镜之间,用于透射所述调制激光并将在所述反射膜处产生的反射光束分离成信号光束; 以及用于将由隔离器装置分离的信号光束的光能转换成各自的电信号的光电二极管; 其中,进入光电二极管的信号光束被引导朝向激光二极管传播,并且光电二极管沿探针壳体的纵向方向设置。

    Optical fiber sensor
    72.
    发明申请
    Optical fiber sensor 审中-公开
    光纤传感器

    公开(公告)号:US20010019103A1

    公开(公告)日:2001-09-06

    申请号:US09779005

    申请日:2001-02-07

    CPC classification number: G01L1/246 G01D5/35316

    Abstract: In a detection section using a fiber grating (FBG), both ends of the FBG are protected with resin coating and a coated part is adhered or mechanically clamped to fixed parts. A spring or a lever or both of these are connected to one end of this fixed part. This is used as a detection section to convert a variation of a physical quantity such as displacement, weight, pressure or acceleration applied to between the fixed parts to a variation of a reflected wavelength or a transmitted wavelength from a fiber grating and to output the variation of the reflected wavelength and transmitted wavelength.

    Abstract translation: 在使用光纤光栅(FBG)的检测部中,FBG的两端被树脂涂层保护,并且涂覆部件被粘合或机械地夹紧到固定部件。 弹簧或杠杆或这两者都连接到该固定部分的一端。 这被用作检测部分,以将施加到固定部件之间的位移,重量,压力或加速度的物理量的变化转换成来自光纤光栅的反射波长或透射波长的变化,并输出变化 的反射波长和透射波长。

    Method for measuring radiation temperature, equipment for measuring radiation temperature and equipment for manufacturing semiconductor device
    73.
    发明申请
    Method for measuring radiation temperature, equipment for measuring radiation temperature and equipment for manufacturing semiconductor device 审中-公开
    测量辐射温度的方法,测量辐射温度的设备和用于制造半导体器件的设备

    公开(公告)号:US20010014111A1

    公开(公告)日:2001-08-16

    申请号:US09784011

    申请日:2001-02-16

    Inventor: Masahiro Shimizu

    CPC classification number: C23C16/46 C23C16/52 G01J5/0003

    Abstract: To provide a method and equipment for measuring a radiation temperature both capable of measuring temperatures of a substrate more accurately and stably than ever and equipment for manufacturing semiconductors therein such a radiation temperature measuring method can be applied. A reflectometer 21 irradiates, on a wafer W having Si and SiO2 layers, light of a wavelength that transmits the Si layer and is reflected from the SiO2 layer (an interface between Si and SiO2) to measure reflectance. With the reflectance and radiation energy at the wavelength of the wafer W measured by a radiation thermometer, a temperature of the wafer W is calculated. Thereby, even when a thin film is formed on a rear face of the substrate to blot and to result in a change of a state thereof, by the use of a stable interface in the substrate, temperatures can be measured with precision and stability.

    Abstract translation: 为了提供一种用于测量辐射温度的方法和设备,其能够比以前更准确和稳定地测量衬底的温度,并且可以应用其中制造半导体的设备。 反射计21在具有Si和SiO 2层的晶片W上照射透射Si层并从SiO 2层(Si和SiO 2之间的界面)反射的波长的光以测量反射率。 利用由辐射温度计测量的晶片W的波长处的反射率和辐射能,计算晶片W的温度。 因此,即使在基板的背面上形成薄膜以进行印迹并导致其状态的变化,通过在基板中使用稳定的界面,也可以精确且稳定地测量温度。

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