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公开(公告)号：US20220216357A1
公开(公告)日：2022-07-07
申请号：US17595690
申请日：2020-05-22
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Narahari PUJARI , Siuli SARKAR , Carl BILGRIEN
IPC: H01L31/05
Abstract: A method of fabricating a solar module by interconnection of a plurality of photovoltaic (PV) cells in which at least a first PV cell is interconnected to a second PV cell using an electrically-conductive adherent comprising or consisting of a solder paste. The solder paste comprises particles of solder alloy dispersed in a solder flux. The solder alloy comprises a Sn-containing solder alloy having a liquidus temperature of less than 225° C.
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公开(公告)号：US20220064466A1
公开(公告)日：2022-03-03
申请号：US17524891
申请日：2021-11-12
Applicant: Alpha Assembly Solutions Inc.
Inventor： Narahari PUJARI , Jayaprakash SUNDARAMURTHY , Siuli SARKAR , Ravindra M. BHATKAL
IPC: C09D11/322 , B41F15/40 , B41M5/00 , C09D11/037 , C09D11/101 , C09D11/102 , C09D11/104 , C09D11/107 , C09D11/38 , H05K1/03 , H05K3/00
Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuity and devices.
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公开(公告)号：US11193031B2
公开(公告)日：2021-12-07
申请号：US16613344
申请日：2018-05-14
Applicant: Alpha Assembly Solutions Inc.
Inventor： Narahari Pujari , Jayaprakash Sundaramurthy , Siuli Sarkar , Ravindra M. Bhatkal
IPC: C09D11/322 , B41F15/40 , B41M5/00 , C09D11/037 , C09D11/101 , C09D11/102 , C09D11/104 , C09D11/107 , C09D11/38 , H05K1/03 , H05K3/00 , C09D11/30
Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.
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公开(公告)号：US20210350949A1
公开(公告)日：2021-11-11
申请号：US17382980
申请日：2021-07-22
Applicant: Alpha Assembly Solutions Inc.
Inventor： Narahari PUJARI , Bawa SINGH , Ravi BHATKAL , Siuli SARKAR , Anubhav RUSTOGI
IPC: H01B1/22 , H05K1/09 , B22F1/00 , B22F1/02 , B23K35/02 , B23K35/30 , B23K35/36 , B23K35/362 , H05K3/12
Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
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公开(公告)号：US11090768B2
公开(公告)日：2021-08-17
申请号：US14698450
申请日：2015-04-28
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Anil Kumar , Siuli Sarkar , Ranjit Pandher , Ravi Bhatkal , Bawa Singh
IPC: B23K1/00 , B23K1/19 , C22C13/00 , C22C13/02 , B23K35/26 , H05K3/34 , B23K35/02 , B23K1/012 , B23K1/08 , B23K1/002 , B23K1/005 , B23K1/20 , B23K103/12
Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.
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Patent Agency Ranking
公开(公告)号：US20190389012A1
公开(公告)日：2019-12-26
申请号：US16098367
申请日：2017-05-02
Applicant: Alpha Assembly Solutions Inc.
Inventor： Morgana De Avila Ribas , Suresh Telu , Pritha Choudhury , Anil K.N. Kumar , Siuli Sarkar
Abstract: Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.
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公开(公告)号：US20190262951A1
公开(公告)日：2019-08-29
申请号：US16404909
申请日：2019-05-07
Applicant: ALPHA ASSEMBLY SOLUTIONS, INC.
Inventor： Ranjit Pandher , Bawa Singh , Siuli Sarkar , Sujatha Chegudi , Anil K. N. Kumar , Kamanio Chattopadhyay , Dominic Lodge , Morgana de Avila Ribas
Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0 to 1 wt % Cu; from 0 to 0.5 wt % Co; from 0.0001 to 1.0% Sb; and the balance Sn, together with any unavoidable impurities.
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公开(公告)号：US10259980B2
公开(公告)日：2019-04-16
申请号：US14438888
申请日：2013-10-29
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US10130995B2
公开(公告)日：2018-11-20
申请号：US15302712
申请日：2015-04-10
Applicant: Alpha Assembly Solutions Inc.
Inventor： Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Sutapa Mukherjee
IPC: B22F9/24 , B22F1/00 , B22F1/02 , C09C1/62 , B22F9/04 , C09J1/00 , C09J9/02 , C09J11/04 , H01L23/00
Abstract: A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.
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公开(公告)号：US10059827B2
公开(公告)日：2018-08-28
申请号：US15148320
申请日：2016-05-06
Applicant: Alpha Assembly Solutions Inc.
Inventor： Rajan Hariharan , James Hurley , Senthil Kanagavel , Jose Quinones , Martin Sobczak , Deborah Makita
IPC: C08K5/09 , B23K35/36 , H01B1/22 , H01L23/498 , H01L23/492 , H05K7/02 , C08K3/08 , H01L23/04 , H01L23/31 , H01L23/00 , B23K101/36
CPC classification number: C08K5/09 , B23K35/3612 , B23K2101/36 , C08K3/08 , C08K2003/0806 , C08K2003/0837 , C08K2003/085 , H01B1/22 , H01L23/04 , H01L23/3178 , H01L23/4928 , H01L23/49883 , H01L24/80 , H01L2224/03332 , H01L2224/03442 , H01L2224/80011 , H01L2924/0002 , H05K7/02 , H01L2924/00
Abstract: A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.
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