公开(公告)号：EP1467121A2

公开(公告)日：2004-10-13

申请号：EP04251874.6

申请日：2004-03-30

Applicant: COM DEV LTD.

Inventor： Heinemann, Mark ,  Voss, Eric Henry

IPC: F16F15/073 ,  B64G1/64

CPC classification number: B64G1/64 ,  F16F15/073

Abstract: A shock attenuating mounting bracket (30) for isolating a hardware component from shocks associated with an underlying structure includes a base (32) and a planar strip (34) coupled together. The base (32) is coupled to the underlying structure and the planar strip (34) is coupled to the hardware component. The planar strip has at least two bends (36,38) along its length for dissipating the shocks associated with the underlying structure. The planar strip can be C-shaped with first and second free ends coupled to the base and a mid-section coupled to the hardware component. Alternatively, the planar strip can have a C-shaped notch formed within and the bracket can include a multi-sided gusset plate that braces the base to the planar strip. The bracket is designed to improve the shock attenuation in shock sensitive designs while maintaining sufficient structural stiffness to sustain random vibration loads and minimum natural frequencies greater than 100 Hz.

Abstract translation: 用于将硬件部件与与下面的结构相关联的冲击隔离的减震安装支架（30）包括联接在一起的基座（32）和平面条带（34）。 基座（32）连接到下面的结构，并且平面条（34）耦合到硬件部件。 平面条沿其长度具有至少两个弯曲部（36,38），用于消除与下面的结构相关联的冲击。 平面条带可以是C形的，其中第一和第二自由端连接到基部，并且中间部分耦合到硬件部件。 或者，平面条可以具有形成在其内的C形凹口，并且支架可以包括将基部支撑到平面条的多边角撑板。 支架设计用于改善冲击敏感设计中的冲击衰减，同时保持足够的结构刚度以维持随机振动载荷和大于100 Hz的最小固有频率。

公开(公告)号：EP0908964B1

公开(公告)日：2004-01-28

申请号：EP98307405.5

申请日：1998-09-14

Applicant: COM DEV LTD.

Inventor： Evans, Gwyn

IPC: H01P5/04

CPC classification number: H01P5/04

公开(公告)号：EP1187248A3

公开(公告)日：2003-07-02

申请号：EP01120504.4

申请日：2001-08-28

Applicant: COM DEV LTD.

Inventor： Sivadas, Apu ,  Yu, Ming ,  Smith, David ,  Fitzpatrick, William

IPC: H01P1/208

CPC classification number: H01P1/208

Abstract: A microwave filter has a set of irises to couple cavities within the filter. A trifurcated iris comprises a central iris and a pair of peripheral irises. The peripheral irises are configured and oriented to couple a primary mode having a magnetic field in the axial direction of a filter cavity. The central iris is configured and oriented to couple a secondary mode having a magnetic field in the azimuthal direction of the filter cavity. The configuration of the trifurcated iris is further oriented to minimize the influence of higher order signals such as the TE 21X mode. The peripheral iris are oriented at null points of the primary TE 21X mode and the central iris is also located at a null point. An input and an output iris are configured to receive electromagnetic energy in the axial direction of the filter. The input and output irises are oriented to minimize signals in the TE 21X secondary mode and any TM modes.

公开(公告)号：EP0276582B2

公开(公告)日：2003-06-25

申请号：EP87311547.1

申请日：1987-12-31

Applicant: COM DEV LTD.

Inventor： Au-Yeung, Henry Yuk Man

IPC: H01P1/12 ,  H01P5/02

CPC classification number: H01P1/122

公开(公告)号：EP0760561B1

公开(公告)日：2003-03-26

申请号：EP96113034.1

申请日：1996-08-13

Applicant: COM DEV LTD.

Inventor： Peach, Robert ,  Miller, Nigel ,  Tailor, Bharat ,  Ali, Kamal ,  Beauchamp, Gary ,  Lam, Simon ,  Lazaris-Brunner, Ken

IPC: H04B7/204

CPC classification number: H04B7/2041

公开(公告)号：EP1215747A1

公开(公告)日：2002-06-19

申请号：EP01310351.0

申请日：2001-12-11

Applicant: COM DEV LTD.

Inventor： Mansour, Raafat R.

IPC: H01P1/208

CPC classification number: H01P1/2082 ,  H01P1/2084 ,  H01P1/2086

Abstract: A microwave cavity (4) has a cut resonator (3) therein that is conductor-loaded. The resonators (5) have a modified shape. Filters made from one or more cavities (6) having cut resonators (5) therein have improved spurious performance over previous filters. A filter can have two conductor loaded resonators (5)in one cavity (10) or a combination of conductor loaded resonators (5)and dielectric resonators (16) in different cavities(7). The cut resonator (3) is out of contact with a wall of the cavity (4).

Abstract translation: 微波腔（4）在其中具有导体负载的切割谐振器（3）。 谐振器（5）具有改进的形状。 由其中具有切割谐振器（5）的一个或多个空腔（6）制成的滤波器具有改进的先前滤波器的杂散性能。 一个滤波器可以在一个空腔（10）中具有两个导体负载的谐振器（5）或者在不同空腔（7）中的导体负载的谐振器（5）和介质谐振器（16）的组合。 切割谐振器（3）与空腔（4）的壁不接触。

公开(公告)号：EP0920067A2

公开(公告)日：1999-06-02

申请号：EP98309240.4

申请日：1998-11-11

Applicant: COM DEV LTD.

Inventor： Mansour, Raafat R.

IPC: H01P1/10

CPC classification number: H01P1/127 ,  H01P1/10 ,  Y10S505/70 ,  Y10S505/703

Abstract: An HTS microwave circuit comprises a first layer (4) and a second layer (6), the first layer having a first HTS microwave circuit (8) extending between an input (15) and output (16), and the second layer having a second microwave circuit (17) that is coupled to the first circuit. The second circuit (17) has switch elements (19) that are compatible with MEMs technology, or flip-chip technology, but incompatible with HTS material. The switch elements are connected into the second circuit to interact with and control the HTS circuit.

Abstract translation: HTS微波电路包括第一层（4）和第二层（6），第一层具有在输入（15）和输出（16）之间延伸的第一HTS微波电路（8），第二层具有 第二微波电路（17），其耦合到第一电路。 第二电路（17）具有与MEMs技术或倒装芯片技术兼容但与HTS材料不兼容的开关元件（19）。 开关元件连接到第二电路中以与HTS电路相互作用和控制。

公开(公告)号：EP0883203A2

公开(公告)日：1998-12-09

申请号：EP98304360.5

申请日：1998-06-02

Applicant: COM DEV LTD.

Inventor： Lundquist, Steven Barton ,  Zybura, Andre J.

IPC: H01P1/208 ,  H01P1/30 ,  H01P7/06

CPC classification number: H01P1/208 ,  H01P1/30 ,  H01P7/06

Abstract: A temperature compensated filter has a compensating screw (18) mounted in a support (40) in the wall (22) of a cavity. The support is made from a material having a high coefficient of thermal expansion compared to the material of the cavity and the material of the compensating screw. As temperature changes, the support moves the compensating screw either further into the cavity or further out of the cavity to compensate for the change in resonant frequency of the cavity that would otherwise occur. The compensating screw can be used with single, dual or triple mode cavities. The compensating screw can be made of metallic material or it can be made of non-metallic material with a metallic outer surface. The compensating screw is locked in the support before the support is inserted into the wall of the cavity. The support is then locked in the wall of the cavity and the screw automatically changes position within the cavity as temperature changes. An RF barrier (50) can be used to prevent RF energy from the cavity from entering the area of the support.

公开(公告)号：EP0865093A1

公开(公告)日：1998-09-16

申请号：EP98301812.8

申请日：1998-03-11

Applicant: COM DEV LTD.

Inventor： Mansour, Raafat R.

IPC: H01P1/203 ,  H01P11/00

CPC classification number: H01P1/20363 ,  H01P11/007 ,  Y10S505/70 ,  Y10S505/866

Abstract: A high power superconductive circuit (64) has a thin film of high temperature superconductive material (40) on a substrate. The circuit is formed from wafers (62) that are placed into corresponding grooves (60) within the substrate and held in place by adhesive. In one embodiment, the grooves (60) are through holes, and the wafers (62) have a corresponding size and shape. The wafers include a thin film of high temperature superconductive material (40) and form resonators. A circuit constructed in this manner has a relatively high power handling capability compared to circuits created by etching.

Abstract translation: 高功率超导电路（64）具有在衬底上的高温超导材料（40）的薄膜。 该电路从晶片（62）而形成被放置做进衬底内的相应的凹槽（60）和通过粘合剂保持在适当位置。 在一个中，实施例的槽（60）是通孔，并在晶片（62）具有相应的尺寸和形状。 晶片包括高温超导材料（40）和形式谐振器的薄膜。 以这种方式构成的电路具有相对高的功率处理能力相比，通过蚀刻产生电路。

公开(公告)号：EP0780998A3

公开(公告)日：1998-09-16

申请号：EP96119806

申请日：1996-12-10

Applicant: COM DEV LTD

Inventor： PEACH ROBERT ,  BEAUCHAMP GARY ,  O'DONOVAN VAL

IPC: H04B7/185

CPC classification number: H04B7/18521

Abstract: This invention concerns improvements in the efficiency and flexibility of multi-beam communications satellites connected by intersatellite links. It will increase the number of customers serviced and hence the revenue generated when intersatellite links are employed by multibeam satellites which use the currently available technology in a bent-pipe microwave architecture.
Existing multibeam systems use the bent-pipe microwave architecture. Information from one geographic region uplinked to one satellite can be transferred to a second satellite via intersatellite link and then downlinked into a second geographic region. These multibeam systems waste available bandwidth capacity by tying up complete intersatellite link transponders even if the channels are not full because information switching is conducted at a full transponder level. Further, if information is broadcast, as in news-gathering applications, to several downlink beams, the system ties up, in the receiving satellite, one transponder per downlink beam.
In future systems using on-board digital-processing technology, it is theoretically possible that information can be switched at a much finer bandwidth level. Hence, one intersatellite channel could handle traffic originating from several uplink beams on the first satellite with destinations to several downlink beams on the second satellite which avoids the inefficiency of a partially full transponder. However, customer terminals have to be designed for the modulation and coding architecture specific to that system and cannot be used with any other system.
The present invention solves spectral flexibility and inefficiency problems of existing systems, and is transparent to all modulation and coding architectures while still allowing for communication with all terminals currently in use with communications satellites. The approach used is to combine switching at a subchannel level (solving flexibility and inefficiency problems) while using technologies compatible with bent-pipe architecture (solving terminal-compatibility problems) with an intersatellite link. Technologies used include Surface Acoustic Wave (SAW) filtering and solid-state switching.
This invention will provide spectral efficiency and flexibility approaching but not equalling the theoretical efficiency and flexibility of future systems employing digital signal processing. It will, however, be significantly more efficient than future digital satellite systems in terms of the two most expensive satellite resources, power and mass.