-
81.
公开(公告)号:WO2019040610A1
公开(公告)日:2019-02-28
申请号:PCT/US2018/047504
申请日:2018-08-22
Applicant: SAMTEC, INC.
Inventor: BIDDLE, Gary E.
IPC: H01R13/6581
Abstract: A receptacle includes a cage, a bezel opening in the cage, and at least one bezel clip mounted adjacent to the bezel opening. The at least one bezel clip includes first bezel fingers and second bezel fingers. The first bezel fingers are located along an inner surface of the cage. The second bezel fingers include outer fingers located along an outer surface of the cage and inner fingers located along the inner surface of the cage. The inner and outer fingers of the second bezel fingers are defined by the second bezel fingers passing through a through hole in the cage.
-
公开(公告)号:WO2019018728A1
公开(公告)日:2019-01-24
申请号:PCT/US2018/043025
申请日:2018-07-20
Applicant: SAMTEC INC.
Inventor: FAITH, Chadrick Paul
IPC: H01R13/627
Abstract: A first electrical connector includes a first latch that is configured to releasably engage a second latch of a second electrical connector when the first and second electrical connectors are mated to each other. The first latch can include an attachment portion that attaches to the connector housing of the first electrical connector, and an engagement portion that is movable with respect to the attachment portion between an engaged position and a disengaged position.
-
公开(公告)号:WO2018231896A1
公开(公告)日:2018-12-20
申请号:PCT/US2018/037198
申请日:2018-06-13
Applicant: SAMTEC INC.
Inventor: BUCK, Jonathan E. , MONGOLD, John
IPC: H01R13/514 , H01R13/6471 , H01R13/518
Abstract: An orthogonal electrical connector system includes vertical electrical connectors that are configured to e mated to each other so as to place respective pluralities of first and second substrates that are oriented orthogonal to each other in data communication with each other through the mated electrical connectors. Other connector systems are also disclosed.
-
公开(公告)号:WO2018094177A4
公开(公告)日:2018-05-24
申请号:PCT/US2017/062240
申请日:2017-11-17
Applicant: SAMTEC INC.
Inventor: MOBLEY, Tim , KEUSSEYAN, Roupen, Leon
IPC: H01L21/768
Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to ta second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.
-
公开(公告)号:WO2018094177A1
公开(公告)日:2018-05-24
申请号:PCT/US2017/062240
申请日:2017-11-17
Applicant: SAMTEC INC.
Inventor: MOBLEY, Tim , KEUSSEYAN, Roupen, Leon
IPC: H01L21/768
Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to ta second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.
-
公开(公告)号:WO2018094162A4
公开(公告)日:2018-05-24
申请号:PCT/US2017/062209
申请日:2017-11-17
Applicant: SAMTEC INC.
Inventor: MOBLEY, Tim , KEUSSEYAN, Roupen, Leon
Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.
-
公开(公告)号:WO2017014827A1
公开(公告)日:2017-01-26
申请号:PCT/US2016/031980
申请日:2016-05-12
Applicant: SAMTEC, INC.
Inventor: ZBINDEN, Eric Jean
CPC classification number: G02B6/3885 , G02B6/32 , G02B6/325 , G02B6/3672 , G02B6/383 , G02B6/3851 , G02B6/3853 , G02B6/3882
Abstract: An optical connection includes a first lens with a first strength, a second lens with a second strength weaker than the first strength, a gap between the first lens and the second lenses, and optical fibers that are connected to the first and second lenses and that provide or receive light from the first and second lenses. No intermediate image is formed, and a beam of light in the gap region is either diverging or converging.
Abstract translation: 光学连接包括具有第一强度的第一透镜,具有弱于第一强度的第二强度的第二透镜,第一透镜和第二透镜之间的间隙,以及连接到第一透镜和第二透镜的光纤,以及连接到第一透镜和第二透镜的光纤, 提供或接收来自第一和第二透镜的光。 不形成中间图像,并且间隙区域中的光束是发散的或会聚的。
-
公开(公告)号:WO2013036865A3
公开(公告)日:2013-07-11
申请号:PCT/US2012054304
申请日:2012-09-07
Applicant: SAMTEC INC , BIDDLE GARY ELLSWORTH , NADOLNY JAMES
Inventor: BIDDLE GARY ELLSWORTH , NADOLNY JAMES
IPC: H05K3/46
CPC classification number: H05K1/0245 , H05K1/0251 , H05K3/4015
Abstract: An electrical system including (1) a printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via; and (2) a connector including first and second signal contacts arranged to transmit the first differential signal. The first differential signal transmitted through the printed circuit board and the connector has a common central axis.
Abstract translation: 一种电气系统,包括:(1)印刷电路板,包括位于所述印刷电路板的顶表面上并且布置为传输第一差分信号的第一信号焊盘和第二信号焊盘;第一信号通孔和第二信号通孔,延伸穿过所述印刷电路板并且布置成 传输该第一差分信号,位于该印刷电路板的上表面上并连接该第一信号焊盘与该第一信号通孔的第一信号迹线以及位于该印刷电路板的上表面上的第二信号迹线, 第二信号焊盘和第二信号通孔; (2)包括第一和第二信号触点的连接器,所述第一和第二信号触点被布置为传送所述第一差分信号。 通过印刷电路板和连接器传输的第一差分信号具有共同的中心轴。
-
公开(公告)号:WO2013036862A3
公开(公告)日:2013-03-14
申请号:PCT/US2012/054301
申请日:2012-09-07
Applicant: SAMTEC, INC. , BIDDLE, Gary Ellsworth , NADOLNY, James
Inventor: BIDDLE, Gary Ellsworth , NADOLNY, James
IPC: H05K3/46
Abstract: A printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, and a first ground plane located on a layer below the top surface of the printed circuit board and including an antipad that encompasses the first and second signal pads and the first and second signal vias when viewed in plan.
-
公开(公告)号:WO2013006499A3
公开(公告)日:2013-01-10
申请号:PCT/US2012/045127
申请日:2012-06-29
Applicant: SAMTEC, INC. , ZBINDEN, Eric , MUSSER, Randall , VERDIELL, Jean-Marc André , MONGOLD, John , VICICH, Brian , GUETIG, Keith
Inventor: ZBINDEN, Eric , MUSSER, Randall , VERDIELL, Jean-Marc André , MONGOLD, John , VICICH, Brian , GUETIG, Keith
Abstract: An interconnect system includes a first circuit board (18), first (14) and second (18a) connectors connected to the first circuit board (18), and a transceiver (15) including an optical engine (15a) and arranged to receive and transmit electrical and optical signals through a cable (16), to convert optical signals received from the cable (16) into electrical signals, and to convert electrical signals received from the first connector (14) into optical signals to be transmitted through the cable (16). The transceiver (15) is arranged to mate with the first (14) and second (18a) connectors so that at least some converted electrical signals are transmitted to the first connector (14) and so that at least some electrical signals received from the cable (16) are transmitted to the second connector (18a).
-
-
-
-
-
-
-
-
-