公开(公告)号：WO2018094162A1

公开(公告)日：2018-05-24

申请号：PCT/US2017/062209

申请日：2017-11-17

Applicant: SAMTEC INC.

Inventor： MOBLEY, Tim ,  KEUSSEYAN, Roupen, Leon

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/42

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

公开(公告)号：EP3975232A1

公开(公告)日：2022-03-30

申请号：EP21207971.9

申请日：2017-11-17

Applicant: Samtec Inc

Inventor： MOBLEY, Tim ,  KEUSSEYAN, Roupen, Leon

IPC: H01L21/768 ,  H05K1/09 ,  H05K1/16 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03 ,  H01L23/15 ,  H01L23/48 ,  H05K3/00 ,  H05K3/42 ,  H01L21/48 ,  H01L23/498

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to ta second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

公开(公告)号：WO2018094177A4

公开(公告)日：2018-05-24

申请号：PCT/US2017/062240

申请日：2017-11-17

Applicant: SAMTEC INC.

Inventor： MOBLEY, Tim ,  KEUSSEYAN, Roupen, Leon

IPC: H01L21/768

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to ta second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

公开(公告)号：WO2018094177A1

公开(公告)日：2018-05-24

申请号：PCT/US2017/062240

申请日：2017-11-17

Applicant: SAMTEC INC.

Inventor： MOBLEY, Tim ,  KEUSSEYAN, Roupen, Leon

IPC: H01L21/768

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to ta second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

公开(公告)号：WO2018094162A4

公开(公告)日：2018-05-24

申请号：PCT/US2017/062209

申请日：2017-11-17

Applicant: SAMTEC INC.

Inventor： MOBLEY, Tim ,  KEUSSEYAN, Roupen, Leon

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/42

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.