公开(公告)号：WO2017052566A1

公开(公告)日：2017-03-30

申请号：PCT/US2015/052063

申请日：2015-09-24

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  OSTER, Sasha N. ,  DOGIAMIS, Georgios C.

IPC: H01Q1/52 ,  H01Q1/38

CPC classification number: H01Q1/38 ,  H01Q1/2266 ,  H01Q1/2283 ,  H01Q1/525 ,  H01Q21/28

Abstract: Embodiments of the invention may include packaged device that may be used for reducing cross-talk between neighboring antennas. In an embodiment the packaged device may comprise a first package substrate that is mounted to a printed circuit board (PCB). A plurality of first antennas may also be formed on the first package. Embodiments may also include a second package substrate that is mounted to the PCB, and the second package substrate may include a second plurality of antennas. According to an embodiment, the cross-talk between the first and second plurality of antennas is reduced by forming a guiding structure between the first and second packages. In an embodiment the guiding structure comprises a plurality of fins that define a plurality of pathways between the first antennas and the second antennas.

Abstract translation: 本发明的实施例可以包括可用于减少相邻天线之间的串扰的封装装置。 在一个实施例中，封装的器件可以包括安装到印刷电路板（PCB）的第一封装衬底。 多个第一天线也可以形成在第一封装上。 实施例还可以包括安装到PCB的第二封装衬底，并且第二封装衬底可以包括第二多个天线。 根据实施例，通过在第一和第二封装之间形成引导结构来减少第一和第二多个天线之间的串扰。 在一个实施例中，引导结构包括在第一天线和第二天线之间限定多个通路的多个翅片。