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    THROUGH-SUBSTRATE WAVEGUIDE
    84.
    发明申请
    THROUGH-SUBSTRATE WAVEGUIDE 审中-公开

    公开(公告)号：US20200294939A1

    公开(公告)日：2020-09-17

    申请号：US16394905

    申请日：2019-04-25

    Applicant: Intel Corporation

    Inventor： Aleksandar Aleksov ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Gilbert W. Dewey ,  Hyung-Jin Lee

    IPC: H01L23/66 ,  H01L23/00 ,  H01L23/13 ,  H01L23/498 ,  H01L21/48

    Abstract: Embodiments may relate to a semiconductor package that includes a die and a package substrate. The package substrate may include one or more cavities that go through the package substrate from a first side of the package substrate that faces the die to a second side of the package substrate opposite the first side. The semiconductor package may further include a waveguide communicatively coupled with the die. The waveguide may extend through one of the one or more cavities such that the waveguide protrudes from the second side of the package substrate. Other embodiments may be described or claimed.

    MICROELECTRONIC ASSEMBLIES
    87.
    发明公开
    MICROELECTRONIC ASSEMBLIES 审中-公开

    公开(公告)号：US20240258296A1

    公开(公告)日：2024-08-01

    申请号：US18630302

    申请日：2024-04-09

    Applicant: Intel Corporation

    Inventor： Adel A. Elsherbini ,  Georgios Dogiamis ,  Shawna M. Liff ,  Zhiguo Qian ,  Johanna M. Swan

    IPC: H01L25/18 ,  H01L23/00 ,  H01L23/532 ,  H01L23/538 ,  H01L23/66

    CPC classification number: H01L25/18 ,  H01L23/5329 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/17 ,  H01L2223/6627 ,  H01L2224/0237

    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate having a surface; a first die, having opposing first and second surfaces, in a first dielectric layer, wherein the first dielectric layer is between a second dielectric layer and the surface of the package substrate, and the first surface of the first die is coupled to the surface of the package substrate; a second die, having opposing first and second surfaces, in the second dielectric layer, and wherein the second dielectric layer is between the first dielectric layer and a third dielectric layer; a third die, having opposing first and second surfaces, in the third dielectric layer, wherein the first surface of the third die is coupled to the surface of the package substrate by a conductive pillar; and a conductive, radio frequency shield structure surrounding the conductive pillar.

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