公开(公告)号：US11386521B2

公开(公告)日：2022-07-12

申请号：US17161941

申请日：2021-01-29

Applicant: Intel Corporation

Inventor： Altug Koker ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Josh Mastronarde ,  Naveen Matam ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.

公开(公告)号：US20220129271A1

公开(公告)日：2022-04-28

申请号：US17430963

申请日：2020-03-14

Applicant: Intel Corporation

Inventor： Abhishek R. Appu ,  Aravindh Anantaraman ,  Elmoustapha Ould-Ahmed-Vall ,  Valentin Andrei ,  Nicolas Galoppo Von Borries ,  Varghese George ,  Altug Koker ,  Mike Macpherson ,  Subramaniam Maiyuran ,  Joydeep Ray ,  Vasanth Ranganathan

IPC: G06F9/30 ,  G06F12/0871 ,  G06F12/0811 ,  G06F7/58 ,  G06T15/06

Abstract: Methods and apparatus relating to data initialization techniques. In an example, an apparatus comprises a processor to read one or more metadata codes which map to one or more cache lines in a cache memory and invoke a random number generator to generate random numerical data for the one or more cache lines in response to a determination that the one more metadata codes indicate that the cache lines are to contain random numerical data. Other embodiments are also disclosed and claimed.

公开(公告)号：US20220121421A1

公开(公告)日：2022-04-21

申请号：US17431034

申请日：2020-03-14

Applicant: Intel Corporation

Inventor： Abhishek R. Appu ,  Altug Koker ,  Aravindh Anantaraman ,  Elmoustapha Ould-Ahmed-Vall ,  Valentin Andrei ,  Nicolas Galoppo Von Borries ,  Varghese George ,  Mike Macpherson ,  Subramaniam Maiyuran ,  Joydeep Ray ,  Lakshminarayana Striramassarma ,  Scott Janus ,  Brent Insko ,  Vasanth Ranganathan ,  Kamal Sinha ,  Arthur Hunter ,  Prasoonkumar Surti ,  David Puffer ,  James Valerio ,  Ankur N. Shah

IPC: G06F7/575 ,  G06F7/544 ,  G06F9/30 ,  G06F9/38 ,  G06F12/128 ,  G06F12/0875 ,  G06F12/0866 ,  G06F12/0895 ,  G06F12/02

Abstract: Methods and apparatus relating to techniques for multi-tile memory management. In an example, an apparatus comprises a cache memory, a high-bandwidth memory, a shader core communicatively coupled to the cache memory and comprising a processing element to decompress a first data element extracted from an in-memory database in the cache memory and having a first bit length to generate a second data element having a second bit length, greater than the first bit length, and an arithmetic logic unit (ALU) to compare the data element to a target value provided in a query of the in-memory database. Other embodiments are also disclosed and claimed.

公开(公告)号：US20220058053A1

公开(公告)日：2022-02-24

申请号：US17472975

申请日：2021-09-13

Applicant: Intel Corporation

Inventor： Valentin Andrei ,  Aravindh Anantaraman ,  Abhishek R. Appu ,  Nicolas C. Galoppo von Borries ,  Altug Koker ,  SungYe Kim ,  Elmoustapha Ould-Ahmed-Vall ,  Mike Macpherson ,  Subramaniam Maiyuran ,  Vasanth Ranganathan ,  Joydeep Ray ,  Varghese George

IPC: G06F9/48 ,  G06F13/16 ,  G06F13/42 ,  G06N3/08

Abstract: One embodiment provides for a general-purpose graphics processing unit comprising a set of processing elements to execute one or more thread groups of a second kernel to be executed by the general-purpose graphics processor, an on-chip memory coupled to the set of processing elements, and a scheduler coupled with the set of processing elements, the scheduler to schedule the thread groups of the kernel to the set of processing elements, wherein the scheduler is to schedule a thread group of the second kernel to execute subsequent to a thread group of a first kernel, the thread group of the second kernel configured to access a region of the on-chip memory that contains data written by the thread group of the first kernel in response to a determination that the second kernel is dependent upon the first kernel.

公开(公告)号：US20220036500A1

公开(公告)日：2022-02-03

申请号：US17500375

申请日：2021-10-13

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US20210326176A1

公开(公告)日：2021-10-21

申请号：US17317387

申请日：2021-05-11

Applicant: Intel Corporation

Inventor： Subramaniam Maiyuran ,  Varghese George ,  Altug Koker ,  Aravindh Anantaraman ,  SungYe Kim ,  Valentin Andrei ,  Joydeep Ray

IPC: G06F9/48 ,  G06F9/38 ,  G06F12/0837 ,  G06F9/30 ,  G06F9/50

Abstract: Accelerated synchronization operations using fine grain dependency check are disclosed. A graphics multiprocessor includes a plurality of execution units and synchronization circuitry that is configured to determine availability of at least one execution unit. The synchronization circuitry to perform a fine grain dependency check of availability of dependent data or operands in shared local memory or cache when at least one execution unit is available.

公开(公告)号：US20210303481A1

公开(公告)日：2021-09-30

申请号：US17212503

申请日：2021-03-25

Applicant: Intel Corporation

Inventor： Joydeep Ray ,  Altug Koker ,  Elmoustapha Ould-Ahmed-Vall ,  Michael Macpherson ,  Aravindh V. Anantaraman ,  Vasanth Ranganathan ,  Lakshminarayanan Striramassarma ,  Varghese George ,  Abhishek Appu ,  Prasoonkumar Surti

IPC: G06F13/16 ,  G06F9/50 ,  G06F9/38 ,  G06F9/30 ,  G06T1/20 ,  G06T1/60

Abstract: An apparatus to facilitate efficient data sharing for graphics data processing operations is disclosed. The apparatus includes a processing resource to generate a stream of instructions, an L1 cache communicably coupled to the processing resource and comprising an on-page detector circuit to determine that a set of memory requests in the stream of instructions access a same memory page; and set a marker in a first request of the set of memory requests; and arbitration circuitry communicably coupled to the L1 cache, the arbitration circuitry to route the set of memory requests to memory comprising the memory page and to, in response to receiving the first request with the marker set, remain with the processing resource to process the set of memory requests.

公开(公告)号：US20210191724A1

公开(公告)日：2021-06-24

申请号：US16724831

申请日：2019-12-23

Applicant: Intel Corporation

Inventor： Supratim Pal ,  Sasikanth Avancha ,  Ishwar Bhati ,  Wei-Yu Chen ,  Dipankar Das ,  Ashutosh Garg ,  Chandra S. Gurram ,  Junjie Gu ,  Guei-Yuan Lueh ,  Subramaniam Maiyuran ,  Jorge E. Parra ,  Sudarshan Srinivasan ,  Varghese George

IPC: G06F9/38 ,  G06F9/30

Abstract: Embodiments described herein provide for an instruction and associated logic to enable a vector multiply add instructions with automatic zero skipping for sparse input. One embodiment provides for a general-purpose graphics processor comprising logic to perform operations comprising fetching a hardware macro instruction having a predicate mask, a repeat count, and a set of initial operands, where the initial operands include a destination operand and multiple source operands. The hardware macro instruction is configured to perform one or more multiply/add operations on input data associated with a set of matrices.

公开(公告)号：US20210035258A1

公开(公告)日：2021-02-04

申请号：US17064427

申请日：2020-10-06

Applicant: Intel Corporation

Inventor： Joydeep Ray ,  Scott Janus ,  Varghese George ,  Subramaniam Maiyuran ,  Altug Koker ,  Abhishek Appu ,  Prasoonkumar Surti ,  Vasanth Ranganathan ,  Andrei Valentin ,  Ashutosh Garg ,  Yoav Harel ,  Arthur Hunter, JR. ,  SungYe Kim ,  Mike Macpherson ,  Elmoustapha Ould-Ahmed-Vall ,  William Sadler ,  Lakshminarayanan Striramassarma ,  Vikranth Vemulapalli

IPC: G06T1/20 ,  G06F9/50 ,  G06F15/80 ,  G06F12/0806 ,  G06N3/04 ,  G06N3/08 ,  G06F17/16

Abstract: Embodiments described herein include, software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. Embodiment described herein provided techniques to skip computational operations for zero filled matrices and sub-matrices. Embodiments additionally provide techniques to maintain data compression through to a processing unit. Embodiments additionally provide an architecture for a sparse aware logic unit.

公开(公告)号：US10909652B2

公开(公告)日：2021-02-02

申请号：US16355303

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Altug Koker ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Josh Mastronarde ,  Naveen Matam ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.