LASER BEAM MACHINE
    81.
    发明专利

    公开(公告)号:JPH02251388A

    公开(公告)日:1990-10-09

    申请号:JP7042789

    申请日:1989-03-24

    Abstract: PURPOSE:To exactly measure the laser power and to exactly execute the positioning and the alignment adjustment of an optical axis by providing plural power monitors on a prescribed position of a work base. CONSTITUTION:At the time of measuring the laser power, the measurement is executed by condensing a laser light 2 to a power monitor 7-1 determined in advance among four pieces of power monitors 7-1-7-4 by an action of a mirror 3. In this case, an output of the monitor 7-1 is always monitored at the time when the laser light 2 is in the vicinity of the monitor 7-1, and a value at the time when its value becomes maximum is derived as the laser power. Also, as for a position of a work base 5, a position in which an output of each monitor 7-1-7-4 becomes maximum is derived as a position of each monitor 7-1-7-4, and by comparing a position of the work base 5 on a work base carrying means 8 and its position, its error is derived. By moving the work base 5 by the work base carrying means 8 by a portion of this error, positioning of the work base 5 is executed, and also, the alignment adjustment of an optical axis of the laser light and the work base 5 is also performed.

    MANUFACTURE OF CERAMIC MULTILAYER INTERCONNECTION BOARD

    公开(公告)号:JPH01251696A

    公开(公告)日:1989-10-06

    申请号:JP7644488

    申请日:1988-03-31

    Abstract: PURPOSE:To prevent an iron metal layer and a high melting point metal conductor layer from being oxidized by a method wherein a conductive paste layer containing at least one or more of copper, nickel or cobalt as its main component and added a reducing agent of silicon, boron, or a compound consisting of these elements is provided between the iron metal layer and a thick film conductor layer. CONSTITUTION:A conductive paste layer 16' containing copper, cobalt or nickel as its main component and containing a reducing agent is subjected to screen printing on an iron plated layer and moreover, a thick film conductive paste layer 17' containing a base metal, such as copper, as its main component is formed on both of the layer 16' and an insulating layer 14 by printing into a necessary circuit pattern and thereafter, the layer 17' is fired in an atmosphere containing such inert gas as nitrogen gas to obtain an oxidation-resistant protective layer 16 and a thick film conductor layer 17. In case silicon, for example, is used as the reducing agent, its content is set in 1.5-3.0wt.% or thereabout and in case manganese boride is used, its content is set in 1.5-3.0wt.% or thereabout. A simultaneous firing becomes possible by this reducing agent and the iron group metal layer and a high-melting point metal conductor layer 12 are prevented from being oxidized.

    MANUFACTURE OF CERAMIC MULTILAYER INTERCONNECTION BOARD

    公开(公告)号:JPH01251695A

    公开(公告)日:1989-10-06

    申请号:JP7644388

    申请日:1988-03-31

    Abstract: PURPOSE:To prevent a high-melting point metal conductor layer from being oxidized by a method wherein an oxidation resistant protective layer consisting of a silver-gold alloy or a silver-palladium alloy of a specified composition is heat-treated and formed between an iron metal layer and a thick film conductor layer. CONSTITUTION:A conductive paste layer containing Ag as its main component and containing 0.5wt.% or more of Au or Pd is subjected to screen printing on an iron-plated layer 15. A substrate provided with the layer 15 printed with the conductive paste layer is heat-treated at 900-1050 deg.C for a prescribed time in a reducing atmosphere containing H2 or the like to fuse the conductive paste layer and at the same time, to form it into an alloy. An oxidation- resistant protective layer 16 is formed of this conductive paste layer and the thickness of this layer 16 is varied by the firing temperature of a thick film conductor layer 17, which is provided on the upper layer of the layer 16, but a thickness of 5-30mum is suitable as the thickness. Moreover, a thick film conductor paste layer containing a base metal, such as copper, as its main component is printed on both of the layer 16 and an insulating layer 14 of the heat-treated ceramic substrate in a necessary circuit pattern and is fired at a firing temperature of 900 deg.C for 10 minutes at a time, for 60 minutes in total, under an atmosphere containing such inert gas as N2 gas.

    WIRING SUBSTRATE
    84.
    发明专利

    公开(公告)号:JPH01251688A

    公开(公告)日:1989-10-06

    申请号:JP7644288

    申请日:1988-03-31

    Abstract: PURPOSE:To facilitate the bonding of a conductive metallic layer onto a low temperature sintering ceramics thereby manufacturing a wear resistant contact electrode in specific hardness by a method wherein at least one kind of specific relatively low melting point metal is added to a relatively high melting point metal to lower the sintering temperature of the metallic components while a low melting point glass is mixed with these metallic components. CONSTITUTION:Within a wiring substrate wherein a conductive metallic layer is provided on the surface of a substrate comprising low temperature sintering ceramics, as for a metallic component forming the conductive metallic layer, Mo is used while as for the other metallic component, at least one kind out of Ni, Co, Fe, Pd is contained. Furthermore, a glass component which is hardly reduced in reducing atmosphere and fused at the temperature not exceeding 1100 deg.C is mixed with said metallic components for preparation. Through these procedures, a wear resistant electrode in specific hardness can be manufactured.

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