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    Microspring structure for hardware trusted platform module
    83.
    发明授权
    Microspring structure for hardware trusted platform module 有权

    公开(公告)号：US11289443B2

    公开(公告)日：2022-03-29

    申请号：US15492799

    申请日：2017-04-20

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Warren B. Jackson ,  Vanishree Rao ,  Eugene M. Chow

    IPC: H01L23/00 ,  G06F21/86 ,  H01L23/31 ,  G06F21/57 ,  H04L9/32

    Abstract: A secured system includes at least one semiconductor chip comprising information processing circuitry. An array of contact pads is disposed on a surface of the chip and is electrically coupled to the information processing circuitry. The secured system includes one or more semiconductor chiplets. Each chiplet comprises at least a portion of at least one hardware trusted platform module that cryptographically secures the information processing circuitry. An array of electrically conductive microsprings is disposed on a surface of the chiplet and is electrically coupled between the hardware trusted platform module and the contact pads.

    Monitor for particle injector
    88.
    发明授权
    Monitor for particle injector 有权

    公开(公告)号：US10064995B2

    公开(公告)日：2018-09-04

    申请号：US15209450

    申请日：2016-07-13

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Peter Kiesel ,  Joerg Martini ,  Eugene M. Chow ,  Scott Uhland ,  Noble M. Johnson

    IPC: A61M5/30 ,  G01N15/14 ,  G01B11/14 ,  G01N15/10 ,  G01N15/00 ,  A61M5/20

    Abstract: Approaches for determining the delivery success of a particle, such as a drug particle, are disclosed. A system for monitoring delivery of particles to biological tissue includes a volume, an optical component, a detector, and an analyzer. The volume comprises a space through which a particle can pass in a desired direction. The optical component is configured to provide a measurement light. The detector is positioned to detect light emanating from the particle in response to the measurement light. The detected light is modulated as the particle moves along a detection axis. The detector is configured to generate a time-varying signal in response to the detected light. The analyzer is configured to receive the time-varying signal and determine a delivery success of the particle into a biological tissue based upon characteristics of the time-varying signal.

    Fabrication method for microelectronic components and microchip inks used in electrostatic assembly
    90.
    发明授权
    Fabrication method for microelectronic components and microchip inks used in electrostatic assembly 有权
    用于静电组装的微电子元件和微芯片油墨的制造方法

    公开(公告)号：US09305807B2

    公开(公告)日：2016-04-05

    申请号：US14192456

    申请日：2014-02-27

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Gregory L. Whiting ,  Rene A. Lujan ,  Eugene M. Chow ,  JengPing Lu

    IPC: H01L21/302 ,  H01L21/461 ,  H01L21/48 ,  H01L21/78 ,  H01L23/00 ,  H01L21/67

    CPC classification number: H01L21/481 ,  H01L21/67132 ,  H01L21/67271 ,  H01L21/78 ,  H01L24/95 ,  H01L2924/12041 ,  H01L2924/00

    Abstract: Charge-encoded chiplets are produced using a sacrificial metal mask and associated fabrication techniques and materials that are compatible with typical semiconductor fabrication processes to provide each chiplet with two different (i.e., positive and negative) charge polarity regions generated by associated patterned charge-inducing material structures. A first charge-inducing material having a positive charge polarity is formed on a silicon wafer over previously-fabricated integrated circuits, then a sacrificial metal mask is patterned only over a portion of the charge-inducing material structure, and a second charge-inducing material structure (e.g., a self-assembling octadecyltrichlorosilane monolayer) is deposited having a negative charge polarity. The sacrificial metal mask is then removed to expose the masked portion of the first charge-inducing material structure, thereby providing the chiplet with both a positive charge polarity region and a negative charge polarity region.

    Abstract translation: 使用牺牲金属掩模和与典型的半导体制造工艺兼容的相关制造技术和材料来产生电荷编码的小芯片，以向每个小芯片提供由相关联的图案化电荷诱导材料产生的两个不同（即正和负）电荷极性区域 结构。 在预先制造的集成电路上的硅晶片上形成具有正电荷极性的第一电荷诱导材料，然后牺牲金属掩模仅在电荷诱导材料结构的一部分上被图案化，并且第二电荷诱导材料 沉积具有负电极极性的结构（例如，自组装十八烷基三氯硅烷单层）。 然后去除牺牲金属掩模以暴露第一电荷诱导材料结构的掩蔽部分，从而为小电极提供正电荷极性区域和负电荷极性区域。

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