公开(公告)号：EP2563871B1

公开(公告)日：2019-07-24

申请号：EP11713821.4

申请日：2011-04-12

Applicant: tesa SE

Inventor： DOLLASE, Thilo ,  KOOP, Matthias ,  SCHREIBER, Ralph

IPC: C09J7/24

公开(公告)号：EP1474494B1

公开(公告)日：2019-05-08

申请号：EP02722172.0

申请日：2002-03-04

Applicant: tesa SE

Inventor： DOLLASE, Thilo ,  HUSEMANN, Marc ,  LÜHMANN, Bernd

IPC: C09J153/00 ,  C09J153/02 ,  C08L53/00 ,  C08L53/02 ,  C08F293/00

公开(公告)号：EP3452524A1

公开(公告)日：2019-03-13

申请号：EP17711137.4

申请日：2017-03-15

Applicant: tesa SE

Inventor： DOLLASE, Thilo ,  GARGIULO, Jessika ,  KUPSKY, Marco ,  WEDEL, Bastian

IPC: C08F220/32 ,  C09J133/06

公开(公告)号：EP3452522A1

公开(公告)日：2019-03-13

申请号：EP17718030.4

申请日：2017-04-06

Applicant: tesa SE

Inventor： DOLLASE, Thilo ,  BRODBECK, Markus ,  FISCHER, Alexander ,  KUPSKY, Marco ,  PRENZEL, Alexander

IPC: C08F120/32 ,  C09J7/02 ,  C09J133/06

公开(公告)号：EP3362529A1

公开(公告)日：2018-08-22

申请号：EP16787759.6

申请日：2016-10-13

Applicant: tesa SE

Inventor： DOLLASE, Thilo ,  ALTENWEGNER, Tanja ,  GARBERS, Julia

IPC: C09J7/02 ,  C09J153/02

CPC classification number: C09J153/02 ,  C08L91/00 ,  C09J7/387 ,  C09J109/00 ,  C09J109/06 ,  C09J2201/618 ,  C09J2201/622 ,  C09J2400/226 ,  C09J2400/243

Abstract: The invention relates to an adhesive mass, consisting of (a) at least one elastomer component, of a polybutadiene- polyvinyl aromatic block copolymer type, having a proportion with respect to the total adhesive mass of 42 to 55 wt.% and having a diblock proportion with respect to the total block copolymer content of 32 to 55 wt.%, preferably up to 50 wt.%, (b) at least one adhesive resin, which is a hydrocarbon resin having a DACP value of at least +5 °C and at most +50 °C and a MMAP value of at least +50 °C and at most +85 °C, (c) optionally at least one soft resin having a proportion of 0 to 15 wt.% with respect to the total adhesive mass, and (d) optionally further additives, which adhesive mass is particularly suitable for adhering on rough substrates such as plaster or woodchip wallpaper.

公开(公告)号：EP3330335A1

公开(公告)日：2018-06-06

申请号：EP17200004.4

申请日：2017-11-03

Applicant: tesa SE

Inventor： OSTERWINTER, Gregor ,  SALERT, Beatrice ,  DOLLASE, Thilo ,  EGGER, Michael

IPC: C09J7/38 ,  C09J7/24 ,  C08K9/10

CPC classification number: C09J153/02 ,  A47G1/175 ,  B32B5/32 ,  B32B2405/00 ,  C08K9/10 ,  C09J7/24 ,  C09J7/387 ,  C09J2201/122 ,  C09J2201/60 ,  C09J2201/606 ,  C09J2201/618 ,  C09J2201/622 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2400/243 ,  C09J2453/00 ,  C09J2453/006

Abstract: Die Erfindung betrifft einen Haftklebestreifen, der sich durch dehnendes Verstrecken im Wesentlichen in der Verklebungsebene rückstands- und zerstörungsfrei wieder ablösen 5 lässt, enthaltend zumindest eine Klebemassenschicht, die mit Mikroballons geschäumt ist, und zumindest einen Träger B, wobei sowohl die Klebemassenschicht, als auch der Träger B Polyvinylaromaten-Polydien-Blockcopolymere mit bestimmten Eigenschaften enthalten.
Die Haftklebestreifen werden zur Verklebung von Bauteilen, wie insbesondere Akkus und elektronischen Geräten, wie insbesondere Handys, verwendet.

公开(公告)号：EP3212723A1

公开(公告)日：2017-09-06

申请号：EP15790041.6

申请日：2015-10-15

Applicant: tesa SE

Inventor： DOLLASE, Thilo ,  KOOP, Matthias ,  REITER, Sven ,  SCHMITZ-STAPELA, Daniel ,  KATZ, Susanne ,  STOLTZE, Jerome

IPC: C09J5/00 ,  C08K5/32 ,  C09J7/02 ,  C09J175/04 ,  B32B7/12 ,  B32B37/06 ,  B32B37/12 ,  B32B37/26 ,  C08J5/12

CPC classification number: B32B37/1207 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B17/064 ,  B32B27/08 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/365 ,  B32B37/06 ,  B32B2255/00 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/205 ,  B32B2255/28 ,  B32B2307/412 ,  B32B2307/414 ,  B32B2307/50 ,  B32B2307/712 ,  B32B2307/728 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2551/00 ,  C08G18/798 ,  C08G2170/80 ,  C08J3/241 ,  C08J5/128 ,  C08J2333/12 ,  C08J2347/00 ,  C08J2369/00 ,  C08J2375/04 ,  C08J2377/00 ,  C08J2475/04 ,  C08K9/10 ,  C09J5/02 ,  C09J5/06 ,  C09J7/10 ,  C09J7/20 ,  C09J175/04 ,  C09J2201/61 ,  C09J2205/102 ,  C09J2400/123 ,  C09J2400/126 ,  C09J2400/143 ,  C09J2400/146 ,  C09J2400/163 ,  C09J2400/166 ,  C09J2475/00 ,  C09J2483/003

Abstract: The invention relates to a method for adhering two substrates, namely a first substrate A and a second substrate B, to each other using a latent-reactive adhesive film with at least one latent-reactive adhesive film layer which has a thermoplastic component with a melting temperature T(melt), where 35°C ≤ T(melt) ≤ 90°C, said thermoplastic component containing functional groups that can react to isocyanate, and an isocyanate-containing component that is dispersed into the thermoplastic component in a particulate form and is blocked, microencapsulated, or substantially deactivated in the region of the particle surface. The particles have a start temperature T(start) of 40°C ≤ T(start) ≤ 120°C, wherein T(start) ≥ T(melt). A surface of the first substrate A is brought into contact with a first surface of the latent-reactive adhesive film, and a surface of the second substrate B is brought into contact with the second surface of the latent-reactive adhesive film. The adhesion is caused by heating the latent-reactive adhesive film to a temperature which corresponds to or is higher than at least the start temperature T(start). The invention is characterized in that at least the surface of the first substrate A which is brought into contact with the latent-reactive adhesive film is treated with a primer before the first substrate A is brought into contact with the latent-reactive adhesive film, and/or at least the first surface of the latent-reactive adhesive film which is brought into contact with the first substrate A is treated with a primer before the first substrate A is brought into contact with the latent-reactive adhesive film.

Abstract translation: 本发明涉及使用具有至少一个潜热反应性粘合剂膜层的潜在反应性粘合剂膜将两个基板（即第一基板A和第二基板B）彼此粘合的方法，所述潜热反应性粘合剂膜层具有热塑性组分 所述含有可与异氰酸酯反应的官能团的热塑性组分以及以颗粒形式分散在所述热塑性组分中的含异氰酸酯的组分，和其中35℃≤T（熔体）≤90℃的温度T（熔体） 在颗粒表面的区域中被封闭，微胶囊化或基本失活。 起始温度T（起始）为40℃≤T（起始）≤120℃，其中T（起始）≥T（熔化）。 第一基板A的表面与潜在反应性粘合膜的第一表面接触，并且第二基板B的表面与潜伏反应性粘合膜的第二表面接触。 通过将潜在反应性粘合剂膜加热到对应于或高于至少起始温度T（开始）的温度来引起粘合。 本发明的特征在于，在第一基板A与潜在反应性粘合膜接触之前，至少第一基板A的与潜伏反应性粘合膜接触的表面用底漆处理，并且 /或在使第一基材A与潜在反应性粘合剂膜接触之前，用底漆处理与第一基材A接触的潜在反应性粘合剂膜的至少第一表面。

公开(公告)号：EP2951123A1

公开(公告)日：2015-12-09

申请号：EP14701685.1

申请日：2014-01-13

Applicant: Tesa SE

Inventor： KEITE-TELGENBÜSCHER, Klaus ,  SCHUH, Christian ,  LÜHMANN, Bernd ,  DOLLASE, Thilo ,  BAI, Minyoung ,  KRAWINKEL, Thorsten

IPC: B82Y40/00 ,  C09J7/02 ,  C09J153/02 ,  H01L51/52

CPC classification number: C09J7/0221 ,  B82Y30/00 ,  B82Y40/00 ,  C08L63/00 ,  C08L2205/04 ,  C09J7/387 ,  C09J125/08 ,  C09J153/00 ,  C09J153/025 ,  C09J2201/122 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2425/00 ,  C09J2453/00 ,  H01L51/5253 ,  Y10T428/269 ,  Y10T428/287

Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced, especially by a cross-linking build-up reaction, the first phase (elastomeric phase) having at least a softening temperature according to DSC of less than 23°C, and the second phase, after the build-up reaction, having a softening temperature according to DSC of greater than 23°C, the two phases having the morphology of a cross-linked nanoparticle network after the build-up reaction.

公开(公告)号：EP2925507A1

公开(公告)日：2015-10-07

申请号：EP13795491.3

申请日：2013-11-25

Applicant: Tesa SE

Inventor： DOLLASE, Thilo ,  KRAWINKEL, Thorsten ,  SCHERF, Lesmona ,  BAI, Minyoung

IPC: B29C65/50 ,  B32B7/12 ,  C09J7/00 ,  C09J7/02 ,  B29C65/48

CPC classification number: B32B7/12 ,  B32B27/22 ,  B32B37/12 ,  B32B2305/72 ,  C08J5/124 ,  C08J2369/00 ,  C08J2400/00 ,  C08J2453/00 ,  C08J2463/00 ,  C09J7/20 ,  C09J7/35 ,  C09J153/00 ,  C09J2463/00 ,  C09J2467/006 ,  C09J2499/00

Abstract: The invention relates to a laminate made of two rigid substrates and an adhesive film arranged between said substrates. At least one of the rigid substrates is transparent, the thickness of the adhesive film is not greater than 80 µm, and the adhesive film comprises at least one adhesive layer made of an adhesive compound to which one or more plasticizers are added, at least one plasticizer of said plasticizers being a reactive plasticizer. The proportion of the plasticizers to the adhesive compound totals at least 15 wt.%, and the proportion of the reactive plasticizer to the adhesive compound is at least 5 wt.%.

公开(公告)号：EP2768919A1

公开(公告)日：2014-08-27

申请号：EP12775254.1

申请日：2012-10-19

Applicant: Tesa SE

Inventor： DOLLASE, Thilo ,  KRAWINKEL, Thorsten ,  BAI, Minyoung

IPC: C09J153/00 ,  C03C27/10 ,  C09J163/00 ,  C09J193/00 ,  C09K3/10 ,  B32B17/10 ,  C09J7/00 ,  H01L51/52

CPC classification number: H01L23/293 ,  B32B17/06 ,  B32B17/064 ,  C03C27/10 ,  C08L53/00 ,  C08L63/00 ,  C08L93/00 ,  C08L93/04 ,  C09J7/00 ,  C09J7/387 ,  C09J153/00 ,  C09J163/00 ,  C09J193/00 ,  C09J193/04 ,  C09J2203/326 ,  C09J2453/00 ,  C09K3/10 ,  H01L31/0481 ,  H01L51/52 ,  H01L51/5246 ,  H01L2251/5338 ,  H01L2924/0002 ,  Y02E10/50 ,  Y10T428/269 ,  Y10T428/287 ,  H01L2924/00

Abstract: The invention relates to an adhesive substance, in particular for encapsulating an electronic assembly against permeates, said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types and at least one comonomer type which, when regarded as a hypothetical homopolymer, has a softening temperature greater than 40°C; (b) at least one type of an at least partially hydrogenated adhesive resin; (c) at least one cyclic ether-based type of reactive resin with a softening temperature less than 40 °C, preferably less than 20°C; and (d) at least one type of photoinitiator for initiating cationic curing.

Abstract translation: 本发明涉及一种粘合物质，特别是用于将电子组件封装在渗透物上，所述物质包括：（a）至少一种共聚物，其至少含有异丁烯或丁烯作为共聚单体类型和至少一种共聚单体类型，当被认为是 假设的均聚物，其软化温度大于40℃; （b）至少一种类型的至少部分氢化的粘合剂树脂; （c）至少一种基于环醚类的反应性树脂，其软化温度低于40℃，优选低于20℃; 和（d）至少一种用于引发阳离子固化的光引发剂。