Abstract:
PROBLEM TO BE SOLVED: To provide an electric testing device that firstly determines whether or not a tested device is already surely connected to a jig before executing procedures for an interlayer pressure test and is capable of reducing a phenomenon of spark discharge.SOLUTION: An electric testing device according to an embodiment of the invention comprises: a resonant circuit module to be coupled with a tested device; a first power supply module that includes a first switch element and provides first voltage to the resonant circuit module when the first switch element is in an off state; a second power supply module that provides second voltage to the resonant circuit module when the first switch element is in an on state; a measurement module that measures an electric signal generated at least when the resonant circuit module receives the first voltage; and a control module that controls the on or off state of the first switch element on the basis of the electric signal. Therefore, the electric testing device can have functions of open circuit check and inductance measurement.
Abstract:
PROBLEM TO BE SOLVED: To measure a flip-chip LED without causing deformation due to negative pressure during fixing.SOLUTION: A test device 3 for a flip-chip LED includes a transparent substrate 30, a spacer member 32, a soft and transparent support stage 34, and a vacuum generator 36. The spacer member 32 is formed on a first surface 300 of the transparent substrate 30. The soft and transparent support stage 34 for substrate is detachably fitted into the spacer member 32 so as to form a closed space S1 by the soft and transparent support stage 34, the spacer member 32, and the first surface 300 of the transparent substrate 30. The vacuum generator 36 is connected to the closed space S1 to suck out air from the closed space S1, and a part of the soft and transparent support stage 34 is stuck to the first surface 300 to form a test area 340 in which a flip-chip LED is set.
Abstract:
PROBLEM TO BE SOLVED: To provide a new tray for allowing a plurality of porch-shaped batteries to be arranged thereon.SOLUTION: A tray includes: one frame; at least one driving shaft; a plurality of fixed plates; and a plurality of moving plates. The driving shaft is fixed to the frame so as to slide along a driving axis, and has a positioning device for deciding a relative position of the driving shaft to the frame. The fixed plates are vertical to the driving axis, and are successively arranged and fixed along the driving axis in the frame. Also, the moving plates are vertical to the driving axis, are arranged along the driving axis in the frame, and combined with the fixed plates. The moving plates are moved together with the driving shaft. Each of the moving plates and each of the fixed plates define a receiving space for receiving a porch-shaped battery, and are used for clamping each of the porch-shaped battery.
Abstract:
It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(ρu m d)/μ≥2,500; with p being the fluid density, u m being the free-stream fluid velocity, d being the pipe distance or diameter, μ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.
Abstract:
It s a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(ρu m d)/μ≥2,500; with ρ being the fluid density, u m being the free- stream fluid velocity, d being the pipe distance or diameter, μ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.