公开(公告)号：WO2008057518A3

公开(公告)日：2008-05-15

申请号：PCT/US2007/023336

申请日：2007-11-01

Applicant: CHROMA ATE, INC.

Inventor： TSENG, I-shih

IPC: H05K7/20

Abstract: It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(ρu m d)/μ≥2,500; with p being the fluid density, u m being the free-stream fluid velocity, d being the pipe distance or diameter, μ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

公开(公告)号：WO2008057519A2

公开(公告)日：2008-05-15

申请号：PCT/US2007/023337

申请日：2007-11-01

Applicant: CHROMA ATE, INC.

Inventor： TSENG, I-shih

IPC: H05K7/20

CPC classification number: H01L23/467 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: It s a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(ρu m d)/μ≥2,500; with ρ being the fluid density, u m being the free- stream fluid velocity, d being the pipe distance or diameter, μ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

Abstract translation:

这是一种顶部安装表面气流散热器，利用由气隙隔开的上部天花板壁，与产生气流的加热装置（微处理器）的上表面一起工作。 这是一个简单的设备，使用雷诺方程Re =（ρum d）/μ≥2,500以低成本; 其中ρ是流体密度，um是自由流体流速，d是管道距离或直径，μ是流体粘度。 由于气流产生空气湍流，它会导致空气中频繁的热交换。 它也会导致不同空气层内的明显温度变化。 因此，它大大增加了散热的效率。 它只需要输入空气。 操作简单，可以使用更高的发热设备。 因此，它促进了这种顶部安装散热装置在电路板组件安装中的替代使用。