Abstract:
밀착형 이미지 센서 유닛은, 원고 조명용의 광원(10)과, 상기 광원(10)으로부터의 광을 원고로 유도하기 위한 막대 형상의 도광체(11)와, 상기 원고로부터의 반사광을 광전 변환 소자에 결상하는 결상 소자(12)와, 상기 광전 변환 소자가 실장된 센서 기판(14)과, 이들을 장착함과 함께 상기 도광체(11)를 장착하기 위한 위치 결정부(200)를 갖는 프레임(15)과, 상기 도광체(11)를 착탈 가능하게 지지하고, 또한 상기 위치 결정부(200)에 착탈 가능하게 장착되는 지지 부재(16)를 구비하고 있다. 접착재를 사용하지 않고, 도광체(11)를 프레임(15)에 장착할 수 있으므로, 도광체(11)의 변형이나 밀착형 이미지 센서 유닛의 휨 등을 방지할 수 있다.
Abstract:
본 발명의 이미지센서는, 케이스(4)와, 피판독체(K)를 향해 광을 조사하도록 상기 케이스(4)내에 배치된 광원과, 상기 피판독체(K)로부터의 반사광을 받아 화상신호를 출력하는 수광소자(52)를 표면에 탑재한 이미지센서 기판(6)을 구비한다. 이미지센서 기판(6)은, 그 표면이 상기 케이스(4)의 내부를 향하도록 설치되어 있다. 이미지센서 기판(6)의 이면중 그 이미지센서 기판(6)의 표면에 있어서의 상기 복수의 수광소자(52)의 탑재영역에 대응하는 부분이 적어도 모두 차광층(61)에 의해 덮여 있으며, 외란광이 케이스(4)의 내부에 침입하지 못하도록 하고 있다.
Abstract:
A contact image sensor unit includes: a light source (10) illuminating an original; a rod-like light guide (11) guiding light from the light source to the original; an imaging element (12) forming reflected light from the original on a plurality of photoelectric conversion elements; a sensor substrate (14) on which the plurality of photoelectric conversion elements are mounted; a frame (15) to which they are attached and which has a positioning part (200) for attaching the light guide (11) thereto; and a supporting member (16) which attachably/detachably supports the light guide (11) and is attachably/detachably attached to the positioning part (200). Since the light guide (11) can be attached to the frame (15) without using an adhesive, the deformation of the light guide (11), the warpage of the contact image sensor unit and so on can be prevented.
Abstract:
A solid-state image pickup device comprising: a multilayer wiring board 2 having an opening portion 21; a spacer 3 covered with a conductive film 32, and fixed to the multilayer wiring board 2 in a state of making the conductive film 32 face contact with a reference potential electrode exposed into the opening portion 21 of the multilayer wiring board 2; a solid-state image pickup element 4 fixed to the spacer 3 in a state of face contact with the conductive film 32 of the spacer 3, and arranged in the opening portion 21; and an optical element 5 fixed at a position opposing the solid-state image pickup element 4 via the spacer 3, and transmitting light into the opening portion.
Abstract:
An imaging system (60) comprises a housing (200) with reference surfaces (274,276), a lens (570) in contact with the reference surfaces (274,276), a member (600) retained to the housing in contact with the lens, and a spring (720) located between and in contact with a portion (282,332,342) of the housing and the lens. In a first operating condition, the member (600) is retained to the housing at a first location (350,360,370,380) and the lens is translatable with respect to the housing (200) and in a second operating condition, the member (600) is retained to the housing at a second location (420,424) and the lens is not translatable with respect to the housing.
Abstract:
An imaging system (60) comprises a housing (200) with reference surfaces (274,276), a lens (570) in contact with the reference surfaces (274,276), a member (600) retained to the housing in contact with the lens, and a spring (720) located between and in contact with a portion (282,332,342) of the housing and the lens. In a first operating condition, the member (600) is retained to the housing at a first location (350,360,370,380) and the lens is translatable with respect to the housing (200) and in a second operating condition, the member (600) is retained to the housing at a second location (420,424) and the lens is not translatable with respect to the housing.