표시 기판과, 이의 제조 방법 및 이를 구비한 표시 장치
    83.
    发明公开
    표시 기판과, 이의 제조 방법 및 이를 구비한 표시 장치 有权
    显示基板,其制造方法和具有显示基板的显示装置

    公开(公告)号:KR1020080078202A

    公开(公告)日:2008-08-27

    申请号:KR1020070017967

    申请日:2007-02-22

    Inventor: 김현영 정관욱

    Abstract: A display substrate, a method for manufacturing the same, and a display device having the same are provided to improve coherence with an integrated circuit electrically connected with a pad part through a conductive bonding member by forming a bonding part including a plurality of holes which are formed in the vicinity of the pad part. A display substrate comprises a base substrate, pixel electrodes(PE), a pad part(210), a bonding parts(220), and a conductive bonding member. The base substrate includes a display area(DA) and a peripheral area(PA) which encloses the display area. The pixel electrodes are formed at the display area of the base substrate. The pad part, formed at the peripheral area of the base substrate, includes a plurality of pads(211). The bonding part includes a plurality of holes which are formed in the vicinity of the pad part. The conductive bonding member, formed on the pad part and the bonding part, electrically bonds the pad part with the ports of an integrated circuit.

    Abstract translation: 提供了一种显示基板及其制造方法以及具有该显示基板的显示装置,以通过形成包括多个孔的接合部来提高与通过导电接合部与焊盘部电连接的集成电路的一致性, 形成在焊盘部分附近。 显示基板包括基底基板,像素电极(PE),焊盘部分(210),接合部分(220)和导电接合部件。 基底基板包括显示区域(DA)和围绕显示区域的外围区域(PA)。 像素电极形成在基底基板的显示区域。 形成在基底基板周边区域的焊盘部分包括多个焊盘(211)。 接合部包括形成在焊盘部附近的多个孔。 形成在焊盘部分和接合部分上的导电接合部件将焊盘部分与集成电路的端口电连接。

Patent Agency Ranking