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公开(公告)号：WO2010035788A1
公开(公告)日：2010-04-01
申请号：PCT/JP2009/066661
申请日：2009-09-25
Applicant: デンカAGSP株式会社 , 佐野 博和 , 吉村 栄二
IPC: H01L33/00
CPC classification number: H01L33/486 , H01L33/642 , H01L2224/48091 , H01L2924/00014
Abstract: 放熱のための凸部を有する基板を、簡易な工程でコスト的に有利に製造することができる発光素子搭載用基板、及びその製造方法を提供する。少なくとも発光素子３０の搭載位置にプレス加工により形成された凸部１０ａを有する金属板１０と、少なくとも凸部１０ａの近傍に形成された絶縁層１６と、その絶縁層１６の上面に設けられた給電用パターン２０ａと、を備える発光素子搭載用基板。
Abstract translation: 公开了一种用于安装发光元件的基板，其具有用于散热的突出部分，并且可以以有利的成本通过简单的工艺制造。 还公开了一种用于制造用于安装发光元件的基板的方法。 用于安装发光元件的基板包括金属板（10），其具有通过至少在要安装发光元件（30）的位置处按压而形成的突出部（10a），绝缘层 （16），形成在所述突出部（10a）的至少附近，以及形成在所述绝缘层（16）的上表面上的供电图案（20a）。
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2.发明专利Substrate for mounting light-emitting element, light-emitting element panel, light-emitting element package, and method of manufacturing substrate for mounting light-emitting element 有权用于安装发光元件的基板，发光元件面板，发光元件封装以及用于安装发光元件的基板的制造方法
公开(公告)号：JP2010021434A
公开(公告)日：2010-01-28
申请号：JP2008181812
申请日：2008-07-11
Applicant: Denka Agsp Kk , デンカAgsp株式会社
Inventor： YOSHIMURA EIJI
IPC: H01L33/48
CPC classification number: H01L2224/48091 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To provide a substrate for mounting light-emitting elements that achieves satisfactory light reflection of a light-emitting element, can prevent the degradation in a resin layer, and is further advantageous in terms of manufacturing costs by coating the resin layer with a ceramic layer for formation, and to provide a method of manufacturing the substrate for mounting light-emitting elements.
SOLUTION: The substrate for mounting light-emitting elements incldues: a metal substrate 10; a columnar metal section 14 formed on the metal substrate 10 directly or via a metal layer 12; an insulating resin layer 16 formed around the columnar metal section 14; the ceramic layer 18 formed while covering the upper surface of the insulating resin layer 16; and a power feed pattern 20a formed on an upper surface of the ceramic layer 18. The method of manufacturing the light-emitting element includes a step of laminating a resin material of the insulating resin layer 16 and metal foil having the ceramic layer in one piece on the metal substrate 10 having the columnar metal section 14, for forming a protrusion A on the surface, for removing the protrusion A, for exposing the columnar metal section 14, and for etching the metal foil 19 by a prescribed pattern to expose the ceramic layer 18.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：为了提供一种用于安装实现发光元件的令人满意的光反射的发光元件的基板，可以防止树脂层的劣化，并且在制造成本方面进一步有利于涂层 具有用于形成的陶瓷层的树脂层，并且提供一种制造用于安装发光元件的基板的方法。
解决方案：用于安装发光元件的基板包括：金属基板10; 直接或经由金属层12形成在金属基板10上的柱状金属部分14; 形成在柱状金属部14周围的绝缘树脂层16; 形成为覆盖绝缘树脂层16的上表面的陶瓷层18; 以及形成在陶瓷层18的上表面上的供电图案20a.发光元件的制造方法包括将绝缘树脂层16的树脂材料和具有陶瓷层的金属箔层压成一体的步骤 在具有柱状金属部分14的金属基板10上，用于在表面上形成突起A，用于移除突起A，用于暴露柱状金属部分14，并且用规定图案蚀刻金属箔19以暴露陶瓷 第18层。版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009253045A
公开(公告)日：2009-10-29
申请号：JP2008099603
申请日：2008-04-07
Applicant: Denka Agsp Kk , デンカAgsp株式会社
Inventor： YOSHIMURA EIJI , USAMI YOSHITAKA
IPC: H05K3/00
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board in which the suitable wiring board is obtained while production efficiency is improved and curvature that is highly likely to be generated on the wiring board during continuous production is suppressed. SOLUTION: The method of manufacturing the wiring board includes: a continuous process of forming at least an insulating layer on a long-sized metal foil to continuously obtain a primary laminate; a bonding process of obtaining a secondary laminate in such a way that a pair of the primary laminates are bonded in a state the primary laminates are in opposite vertical directions; a wiring layer forming process of obtaining a tertiary laminate having at least wiring layers on both surface sides of the secondary laminate; and a dividing process of obtaining wiring boards by dividing the tertiary laminate. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：提供一种制造布线板的方法，其中在提高生产效率的同时获得合适的布线板，并且抑制在连续生产期间在布线板上很可能产生的曲率。 解决方案：制造布线板的方法包括：在长尺寸金属箔上形成至少绝缘层的连续工艺，以连续获得初级层压体; 获得二次层压体的接合工艺，使得一对初级层压板在初级层压板处于相反的垂直方向的状态下接合; 布线层形成工序，得到二次层压体的两面的至少布线层的三层层叠体; 以及通过划分第三层压板来获得布线板的划分过程。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009033199A
公开(公告)日：2009-02-12
申请号：JP2008268892
申请日：2008-10-17
Applicant: Denka Agsp Kk , デンカAgsp株式会社
Inventor： YOSHIMURA EIJI
CPC classification number: H01L2224/48091 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To provide a light emitting element mounting substrate and its manufacturing method capable of preferably raising light radiation efficiency and of reduced cost and high accuracy with high heat dissipation efficiency from a light emitting element.
SOLUTION: The manufacturing method of a light emitting element mounting substrate includes a process of selectively etching a surface metal layer 22 laminated on a metal substrate 10 to form a metal protruded part 22b at a mounting position of a light emitting element; and a process of forming an electrode 23a in the vicinity of the metal protruded part 22b.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供一种发光元件安装基板及其制造方法，其能够优选地从发光元件提高散热效率并降低成本和高精度以及高散热效率。 解决方案：发光元件安装基板的制造方法包括选择性地蚀刻层叠在金属基板10上的表面金属层22，以在发光元件的安装位置形成金属突出部22b的工序; 以及在金属突出部22b附近形成电极23a的工序。 版权所有（C）2009，JPO＆INPIT
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5.发明专利Substrate for mounting light emitting element, and method for producing the same 有权用于安装发光元件的基板及其制造方法
公开(公告)号：JP2011108688A
公开(公告)日：2011-06-02
申请号：JP2009259159
申请日：2009-11-12
Applicant: Denka Agsp Kk , デンカAgsp株式会社
Inventor： YOSHIMURA EIJI
IPC: H01L33/48
CPC classification number: H01L33/647 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/48227 , H01L2224/73265 , H01L2924/1715 , H01L2924/181 , H01L2933/0066 , Y10T29/49124 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To provide a method for producing a substrate for mounting a light emitting element in which the substrate for mounting the light emitting element that can supply electric power through columnar metal bodies even when side surfaces of the columnar metal bodies do not have pads can be produced inexpensively through easy processes without laminating a metal foil, performing plating and so on, to provide the substrate for mounting the light emitting element, and to provide a light emitting element package. SOLUTION: The substrate for mounting the light emitting element includes two or more columnar metal bodies 14a to 14c, two or more electrodes 10a to 10b provided on back sides of the columnar metal bodies 14a to 14c while electrically connecting with the columnar metal bodies 14a to 14c, and an insulating layer 16 exposing top surfaces of the columnar metal bodies 14a to 14c, the side surfaces of the columnar metal bodies do not have pads. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 解决的问题：提供一种制造用于安装发光元件的基板的方法，其中，即使在柱状金属体的侧表面上也可以通过柱状金属体安装用于安装发光元件的发光元件的基板 不需要通过简单的方法可以廉价地生产垫，而不需要层压金属箔，进行电镀等，以提供用于安装发光元件的基板，并提供发光元件封装。 解决方案：用于安装发光元件的基板包括两个或更多个柱状金属体14a至14c，设置在柱状金属体14a至14c的背侧上的两个或更多个电极10a至10b，同时与柱状金属 主体14a至14c，以及暴露柱状金属体14a至14c的顶表面的绝缘层16，柱状金属体的侧表面不具有焊盘。 版权所有（C）2011，JPO＆INPIT
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Patent Agency Ranking6.发明专利
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8.发明专利
公开(公告)号：JP2010103182A
公开(公告)日：2010-05-06
申请号：JP2008271244
申请日：2008-10-21
Applicant: Denka Agsp Kk , デンカAgsp株式会社
Inventor： YOSHIMURA EIJI
IPC: H01L33/48
CPC classification number: H01L24/32 , H01L2224/16 , H01L2224/48091 , H01L2224/73265 , H01L2924/07802 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a light-emitting device capable of preventing an insulating resin layer from being deteriorated, and capable of improving reflection of light in a light-emitting element, and to provide a substrate for mounting the light-emitting element. SOLUTION: The light-emitting device includes: the light-emitting element 30 having at least one electrode 32 on its bottom face; an upside metal layer having a pad 20b at a position facing the electrode 32 and a peripheral pattern part 20a provided all around the pad 20b with a non-pattern part 16a interposed; an insulating resin layer 16 provided in the lower part of the upside metal layer while having an interlayer connection part 14 in the lower part of the pad 20b; and a bottom side metal layer 10 connected to the interlayer connection part 14, and the electrode 32 of the light-emitting element 30 is electrically connected to the pad 20b with the non-pattern part 16a disposed on the further inside than an outline PL formed by projecting the light-emitting element 30. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 解决的问题：提供一种能够防止绝缘树脂层劣化并且能够改善发光元件中的光的反射的发光装置，并且提供一种用于安装发光元件的基板， 发光元件。 解决方案：发光器件包括：发光元件30在其底面上具有至少一个电极32; 具有在与电极32相对的位置处的焊盘20b的上侧金属层和设置在焊盘20b周围的非图案部分16a的周边图案部分20a; 设置在上侧金属层的下部的绝缘树脂层16，同时在焊盘20b的下部具有层间连接部14; 和连接到层间连接部14的底侧金属层10，并且发光元件30的电极32电连接到焊盘20b，其中非图案部分16a设置在比形成的轮廓PL的更靠内侧 通过投影发光元件30.版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP4294967B2
公开(公告)日：2009-07-15
申请号：JP2003035185
申请日：2003-02-13
Applicant: デンカAgsp株式会社
Inventor： 栄二 吉村
CPC classification number: H05K3/4647 , H05K3/06 , H05K3/062 , H05K2201/0361 , H05K2203/0384
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10.发明专利
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