BOLOMETER AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    BOLOMETER AND MANUFACTURING METHOD THEREOF 审中-公开
    BOLOMETER及其制造方法

    公开(公告)号:WO2013125734A1

    公开(公告)日:2013-08-29

    申请号:PCT/JP2013/055607

    申请日:2013-02-22

    CPC classification number: G01J5/20

    Abstract: The present invention is related to the field of uncooled infrared (IR) or terahertz (THz) bolometers, and especially to low-cost bolometers and their fabrication processes. The device is composed of a photodefinable substrate which enables to suspend a bolometer structure on a diaphragm layer using wet etching technology with a good thermal isolation.

    Abstract translation: 本发明涉及非制冷红外(IR)或太赫兹(THz)辐射计的领域,特别涉及低成本测辐射热计及其制造工艺。 该装置由可光分解的基板组成,其能够使用具有良好热隔离的湿蚀刻技术在隔膜层上悬置测辐射热计结构。

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