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公开(公告)号：JP2010267970A
公开(公告)日：2010-11-25
申请号：JP2010111089
申请日：2010-05-13
Inventor： CHENG CHI WAH , CHOW LAP KEI
IPC: H01L21/301
CPC classification number: H01L21/681 , H01L21/67092
Abstract: PROBLEM TO BE SOLVED: To reduce cycle time, space requirements and costs, and determine a cutting line of a substrate.
SOLUTION: There is provided a method for determining a cutting line of a substrate before singulation. The substrate includes alignment marks of first and second rows substantially parallel to each other, and alignment from the alignment marks of the first and second rows are configured to set positions of cutting lines. The method includes a step of positioning the alignment marks of the first row along a relative movement path of a first camera and positioning the alignment marks of the second row along a relative movement path of a second camera. While the substrate is moved without stop along the respective relative movement paths with respect to the first and second cameras, the first and second cameras capture images of the alignment marks of multiple pairs from the alignment marks of the first and second rows during the movement. After that, the positions of the cutting lines are determined from the images of the alignment marks of the pairs along the alignment marks of the first and second rows with respect to the cutting lines, and stored in a storing device so as to be utilized during singulation.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题：减少循环时间，空间要求和成本，并确定基材的切割线。 解决方案：提供了一种在分割之前确定衬底的切割线的方法。 基板包括基本上彼此平行的第一和第二行的对准标记，并且来自第一行和第二行的对准标记的对准被配置为设置切割线的位置。 该方法包括沿着第一相机的相对移动路径定位第一行的对准标记并沿着第二相机的相对移动路径定位第二行的对准标记的步骤。 当基板相对于第一和第二相机沿相应的相对移动路径移动而不停止时，第一和第二相机在移动期间从第一和第二行的对准标记捕获多对的对准标记的图像。 之后，切割线的位置由相对于切割线的第一行和第二行的对准标记的对的对准标记的图像确定，并存储在存储装置中，以便在 分割。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2009177142A
公开(公告)日：2009-08-06
申请号：JP2008311209
申请日：2008-12-05
Inventor： LAM KUI KAM , IP CHUN HUNG SAMUEL
IPC: H01L21/52
CPC classification number: B23K1/0016 , B23K3/063 , B23K2201/40 , H01L24/743 , H01L2224/743 , H01L2924/07802 , H01L2924/14 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a unit for discharging soft solder to form a layer of uniformly distributed solder in order to bond a semiconductor chip onto a substrate. SOLUTION: A method for mounting a semiconductor chip onto a substrate includes a step of positioning a solder discharge unit with the substrate and a step of passing a solder wire of a prescribed length to the substrate through the solder discharge unit. Feeding of the wire to the substrate in a feeding direction is controlled by a wire feeder. The solder discharge unit, simultaneously with the feeding of the solder wire to the surface of the substrate and discharging a line of molten solder to the surface of the substrate, is moved by a positioning device with respect to the substrate along at least one of two orthogonal axes approximately vertical to the feeding direction. Then, the semiconductor chip is mounted on the molten solder discharged onto the substrate. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：为了提供用于放电软焊料的单元以形成均匀分布的焊料层，以将半导体芯片粘合到基板上。 解决方案：一种用于将半导体芯片安装到基板上的方法包括将焊料放电单元定位在基板上的步骤，以及通过焊料放电单元将规定长度的焊丝通过基板的步骤。 通过送线器来控制导线在馈送方向上的馈送。 焊料放电单元同时将焊丝馈送到衬底的表面并将一束熔融焊料排出到衬底表面，通过定位装置相对于衬底沿着两个以上的至少一个移动 大致垂直于进给方向的正交轴。 然后，将半导体芯片安装在排出到基板上的熔融焊料上。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2004363607A
公开(公告)日：2004-12-24
申请号：JP2004164998
申请日：2004-06-02
Inventor： LAM KUI KAM , NG MAN CHUNG RAYMOND , TANG YEN HSI TERRY , OU GANG
CPC classification number: H01L21/67144 , Y10T156/1092 , Y10T156/1097 , Y10T156/12 , Y10T156/1707 , Y10T156/1754 , Y10T156/1776
Abstract: PROBLEM TO BE SOLVED: To provide an improved apparatus that is designed to increase throughput without disadvantages by using a double delivery device for delivering materials onto a substrate. SOLUTION: The apparatus is provided for transferring components from a pick-up position in a supply source of the component to a placement position on a receptor, such as die pad, during semiconductor processing. The apparatus has a first delivery device and a second delivery device which function alternatively to transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position. COPYRIGHT: (C)2005,JPO&NCIPI
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4.发明专利
公开(公告)号：JP2012104828A
公开(公告)日：2012-05-31
申请号：JP2011243597
申请日：2011-11-07
Inventor： LAM KUI KAM , TANG YEN HSI , WONG YIU YAN , HOK MAN WONG
CPC classification number: H01L21/6715 , H01L24/27 , H01L24/743 , H01L2224/743 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a dual head dispenser system having a small installation area.SOLUTION: Adhesive for die bonding is dispensed on a substrate including a row of bonding pads along a first axis, and a column along a second axis perpendicular to the first axis. A first dispenser head 12 incorporating a first nozzle 20, and a second dispenser head 14 incorporating a second nozzle 22 are provided, pattern of the bonding pad is recognized using an optical system 18, and then adhesive is dispensed onto a dispense target position in the same columnar section of the substrate by driving the first nozzle 20 and the second nozzle 22 simultaneously.
Abstract translation: 要解决的问题：提供具有小安装面积的双头分配器系统。 解决方案：用于管芯接合的粘合剂被分配在包括沿着第一轴线的一排接合焊盘的基板和沿着垂直于第一轴线的第二轴线的列。 提供了包括第一喷嘴20的第一分配器头12和结合有第二喷嘴22的第二分配头14，使用光学系统18识别焊盘的图案，然后将粘合剂分配到分配目标位置 通过同时驱动第一喷嘴20和第二喷嘴22，使基板的相同的柱状部分。 版权所有（C）2012，JPO＆INPIT
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5.发明专利System for dispensing soft solder for mounting semiconductor chips using multiple solder wires 审中-公开使用多条焊丝安装半导体芯片的软管分配系统
公开(公告)号：JP2011238924A
公开(公告)日：2011-11-24
申请号：JP2011103040
申请日：2011-05-02
Inventor： LAM KUI KAM , PIN LIAN TU , CHUN HAN SAMUEL EVE
IPC: H01L21/52
CPC classification number: B23K1/20 , B23K1/0016 , B23K3/063 , B23K2201/40 , H01L24/743 , H01L2224/743 , H01L2924/07802 , H01L2924/14 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a soft solder dispensing device for forming a layer of an evenly-distributed solder for attaching semiconductor chips to a substrate and to improve the productivity of the bonding process, particularly for large semiconductor chips.SOLUTION: An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises: a dispensing body; and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operated to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operated to introduce the solder wires in a solid state from the end of the dispensing body, the solder wires being melted upon contact with the substrate which is heated.
Abstract translation: 要解决的问题：提供一种用于形成用于将半导体芯片附接到基板的均匀分布的焊料层的软焊剂分配装置，并且提高接合工艺的生产率，特别是对于大型半导体芯片。 解决方案：用于将衬底分配到衬底上以将半导体芯片安装在衬底上的装置包括：分配本体; 以及延伸穿过分配主体的第一和第二分配通道。 操作每个分配通道以接收单独的焊丝，以将焊丝馈送到面向衬底的分配主体的端部。 分配通道进一步操作以从分配体的端部引入固态的焊丝，焊丝在与被加热的基板接触时熔化。 版权所有（C）2012，JPO＆INPIT
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Patent Agency Ranking
公开(公告)号：JP2010103541A
公开(公告)日：2010-05-06
申请号：JP2009245825
申请日：2009-10-26
Inventor： LI MING , DING YING , TU PING LIANG , LO KING MING , CHUNG KWOK KEE
CPC classification number: H01L24/83 , H01L24/29 , H01L24/75 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/32506 , H01L2224/83191 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/157 , H01L2924/15787 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To provide a direct die bonding method for die bonding, which prevents a deficiency of a die bonding method of a conventional technology at least to some extent. SOLUTION: A method is provided for bonding a die comprising a solder layer of a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. Thereafter, the die is lifted by the bond head, and the die is heated towards temperature T1 to melt the solder layer. The solder layer of the die is pressed onto the substrate to bond the die to the substrate, and thereafter the die is separated from the bond head so that the solder layer is cooled towards T2 and solidifies. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：提供一种芯片接合的直接芯片接合方法，其至少在一定程度上防止了传统技术的芯片接合方法的缺陷。 解决方案：提供一种用于接合包含熔点Tm的焊料层的管芯的方法。 将接合头加热到高于Tm的接合头设定温度T1，将衬底加热到低于Tm的衬底设定温度T2。 此后，通过接合头抬起模具，并将模具加热到温度T1以熔化焊料层。 将模具的焊料层压在基板上以将模具结合到基板上，然后将模具从结合头分离，使得焊料层朝T2冷却并固化。 版权所有（C）2010，JPO＆INPIT
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7.发明专利Coating for reinforcing adhesion of molding compound to semiconductor device 有权用于增强模塑复合物粘合到半导体器件的涂层
公开(公告)号：JP2006179918A
公开(公告)日：2006-07-06
申请号：JP2005367030
申请日：2005-12-20
Inventor： LI JIANXIONG , CHAW CHI CHUEN , TSUI NGAI KIN , LIU DEMING , KWAN YIU FAI
IPC: H01L21/56
CPC classification number: H01L23/3142 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide coating for attaching primer to a whole lead frame in order to reinforce the connection of a plastic molding compound to a lead frame and an IC chip. SOLUTION: A semiconductor device is coated with a polymer primer before molding the semiconductor device so that the adhesion of the semiconductor device to a molding compound can be reinforced with a semiconductor chip mounted on a carrier such as a lead frame. The above mentioned coating of the semiconductor device may be executed by coating the semiconductor with polymer solution, or by attaching the polymer solution to the semiconductor device by dipping, dripping or spraying. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供用于将底漆附着到整个引线框架上的涂层，以便加强塑料模塑料与引线框架和IC芯片的连接。 解决方案：在模制半导体器件之前，半导体器件被涂覆有聚合物底漆，使得半导体器件对模制化合物的粘附可以通过安装在诸如引线框架的载体上的半导体芯片来增强。 上述半导体器件的涂层可以通过用聚合物溶液涂覆半导体，或者通过浸渍，滴落或喷涂将聚合物溶液附着到半导体器件上来执行。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2004258655A
公开(公告)日：2004-09-16
申请号：JP2004046708
申请日：2004-02-23
Inventor： CHEUNG YIU MING , LIU CHOU KEE PETER , YIU CHING HONG
IPC: G02B6/42
CPC classification number: G02B6/4225 , G02B6/4227 , G02B6/4237
Abstract: PROBLEM TO BE SOLVED: To provide an improved device and method for coupling optical transmission between different optical devices such as an optical element and an optical fiber.
SOLUTION: This device for actively matching and coupling separate optical elements consisting of a light emitting element and a light receiving element is equipped with: a first matching means having a comparatively low optical resolution stage composed so as to perform rough matching of the light emitting element in search of approximated position of the highest strength position; and a second matching means having a comparatively high optical resolution stage composed so as to perform fine matching of the light emitting element in search of more accurate position of that highest strength position. Thus, rough matching can be performed using a multimode fiber. Also, fine matching can be performed using a single mode fiber capable of coupling the light emitting element.
COPYRIGHT: (C)2004,JPO&NCIPI-
公开(公告)号：JP2012142579A
公开(公告)日：2012-07-26
申请号：JP2011288055
申请日：2011-12-28
Inventor： MAN CHUNG NG , LAM WING FAI , CHUN WAI KWAN
CPC classification number: H01L24/75 , H01L2924/01005 , H01L2924/01006 , H01L2924/01075 , Y10T29/4913 , Y10T29/53178
Abstract: PROBLEM TO BE SOLVED: To provide an apparatus which is used for transferring substrates fron one position to another position.SOLUTION: A bonding apparatus for performing bonding on each substrate includes a first substrate holding device 18 for clamping a first substrate during bonding and a second substrate holding device 20 for clamping a second substrate during the bonding. A first actuator operates so as to drive the first substrate holding device 18 along a first supply path from an on-loading position thereof to a bonding position thereof, and along a first feedback path from an off-loading position thereof to the on-loading position. A second actuator operates so as to drive the second substrate holding device 20 along a second supply path from an on-loading position thereof to a bonding position thereof, and along a second feedback path from an off-loading position thereof to the on-loading position.
Abstract translation: 要解决的问题：提供一种用于将一个位置的基板传送到另一位置的装置。 解决方案：用于在每个基板上进行结合的接合装置包括用于在接合期间夹持第一基板的第一基板保持装置18和用于在接合期间夹紧第二基板的第二基板保持装置20。 第一致动器操作以便沿着第一供应路径从其载入位置驱动第一基板保持装置18到其接合位置，并且沿着从其卸载位置到载入位置的第一反馈路径 位置。 第二致动器操作以便沿着第二供应路径从其从装载位置到其接合位置驱动第二基板保持装置20，并且沿着从其卸载位置到上载荷的第二反馈路径 位置。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP2006191121A
公开(公告)日：2006-07-20
申请号：JP2006003008
申请日：2006-01-10
Inventor： CHENG CHI WAH , TANG HOI SHUEN JOSEPH , MAK TIM WAI TONY , LEUNG CHI HANG
IPC: H01L21/50
Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and method for aligning semiconductor devices on a carrier. SOLUTION: An apparatus and method are provided for aligning a plurality of semiconductor devices placed on a carrier. Alignment guides are located adjacent to each device in use and are arranged, such that they correspond to a desired alignment of each semiconductor device. For alignment, the semiconductor devices are held by a positioning device comprising a plurality of holders, each holder being configured to generate a force for holding a semiconductor device. Actuators are also provided that act to move the positioning device and holders to make the semiconductor devices biased with respect to the alignment guides to orientate the semiconductor devices, until they become aligned with the alignment guides. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种用于使载体上的半导体器件对准的装置和方法。 解决方案：提供一种用于对准放置在载体上的多个半导体器件的装置和方法。 对准引导件位于与使用中的每个设备相邻并且被布置成使得它们对应于每个半导体器件的期望对准。 为了对准，半导体器件由包括多个保持器的定位装置保持，每个保持器被配置为产生用于保持半导体器件的力。 还提供致动器，其用于移动定位装置和保持器，以使半导体器件相对于对准引导件偏置以使半导体器件定向，直到它们与对准引导件对准。 版权所有（C）2006，JPO＆NCIPI
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