公开(公告)号：WO2006047460A1

公开(公告)日：2006-05-04

申请号：PCT/US2005/038273

申请日：2005-10-21

Applicant: HONEYWELL INTERNATIONAL INC. ,  AVRAMESCU, Viorel, V. ,  PAVELESCU, Loan ,  COBIANU, Cornel, P.

Inventor： AVRAMESCU, Viorel, V. ,  PAVELESCU, Loan ,  COBIANU, Cornel, P.

IPC: G01L9/00

CPC classification number: G01L9/0025 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49 ,  Y10T29/49007 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A vacuum sealed SAW pressure sensor is disclosed herein, which includes a sensing element configured as a SAW device (e.g. SAW resonator or SAW delay line) supported by a thin diaphragm. The substrate material can be implemented as a quartz wafer (i.e., “base” wafer). The SAW device can be configured on one side of the wafer and the diaphragm etched on the opposite side. A quartz micromachined pressure sensor can thus be realized, which operates based on a variation of the surface wave velocity of a SAW device situated on the thin diaphragm. The SAW sensor is generally sealed in a vacuum and diaphragm sustains the sensor, thereby implementing a sensor on a wafer scale while allowing for a cost reduction per chip.

Abstract translation: 本文公开了一种真空密封的SAW压力传感器，其包括被配置为由薄隔膜支撑的SAW器件（例如SAW谐振器或SAW延迟线）的感测元件。 衬底材料可以实现为石英晶片（即，“基底”晶片）。 SAW器件可以配置在晶片的一侧，并且隔膜在相对侧蚀刻。 因此可以实现基于位于薄隔膜上的SAW器件的表面波速度的变化而操作的石英微加工压力传感器。 SAW传感器通常在真空中密封并且隔膜维持传感器，从而在晶片秤上实现传感器，同时允许每个芯片的成本降低。

公开(公告)号：WO2007084434A2

公开(公告)日：2007-07-26

申请号：PCT/US2007/000988

申请日：2007-01-12

Applicant: HONEYWELL INTERNATIONAL INC. ,  COBIANU, Cornel, P. ,  AVRAMESCU, Viorel, V. ,  GEORGESCU, Ion

Inventor： COBIANU, Cornel, P. ,  AVRAMESCU, Viorel, V. ,  GEORGESCU, Ion

CPC classification number: G01L9/008 ,  G01L9/0025

Abstract: A SAW sensor module can be produced with a true all quartz sensor package (TAQSP) attached to a substrate. The TAQSP has a quartz cover direct quartz bonded to a SAW sensor on a quartz substrate. The TAQSP can be mass produced by direct quartz bonding a quartz cover wafer, having many covers, to a quartz sensor wafer, having many sensors, thereby producing a wafer tandem. The wafer tandem can be further processed because the bond protects the sensors within. Individual sensor packages can be obtained by cutting stripes out of the cover wafer, revealing SAW sensor bonding pads, and then dicing the wafer tandem. A SAW sensor module results when the sensor packages are attached to an antenna bearing substrate and then sealed.

Abstract translation: SAW传感器模块可以使用附着在基板上的真正的所有石英传感器封装（TAQSP）来生产。 TAQSP具有石英盖直接石英结合到石英基板上的SAW传感器。 TAQSP可以通过将具有许多盖的石英盖晶片直接石英粘合到具有许多传感器的石英传感器晶片上进行批量生产，从而制造晶圆串联。 晶圆串联可以进一步处理，因为焊接保护传感器内部。 可以通过从盖晶片上切割条纹，露出SAW传感器接合焊盘，然后将晶片串联切割来获得各个传感器封装。 当传感器封装安装在天线轴承衬底上，然后密封时，会产生SAW传感器模块。

公开(公告)号：WO2007067453A2

公开(公告)日：2007-06-14

申请号：PCT/US2006/046154

申请日：2006-12-01

Applicant: HONEYWELL INTERNATIONAL INC. ,  Cobianu, Cornel, P. ,  Pavelescu, Ioan ,  Avramescu, Viorel, V. ,  Cook, James, D. ,  McNally, Leonard, J.

Inventor： Cobianu, Cornel, P. ,  Pavelescu, Ioan ,  Avramescu, Viorel, V. ,  Cook, James, D. ,  McNally, Leonard, J.

CPC classification number: G01L9/0025 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908

Abstract: Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surround the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.

Abstract translation: 改进的SAW压力传感器及其制造方法。 可以提供包括设置在其上的多个SAW换能器的SAW晶片。 还可以提供覆盖晶片，其中玻璃壁位于盖晶片和SAW晶片之间。 覆盖晶片可以固定到SAW晶片，使得玻璃壁围绕SAW换能器。 在一些情况下，玻璃壁可以至少部分地限定覆盖晶片和SAW晶片之间的间隔。 也可以在盖晶片和SAW晶片之间提供一个或多个轮廓，使得当盖晶片相对于SAW晶片设置在上方并且被固定时，轮廓中的至少一个围绕至少一个SAW换能器。

公开(公告)号：WO2008118740A3

公开(公告)日：2008-12-24

申请号：PCT/US2008057635

申请日：2008-03-20

Applicant: HONEYWELL INT INC ,  SERBAN BOGDAN CATALIN ,  AVRAMESCU VIOREL V ,  COBIANU CORNEL P ,  GEORGESCU ION ,  VARACHIU NICOLAE

Inventor： SERBAN BOGDAN CATALIN ,  AVRAMESCU VIOREL V ,  COBIANU CORNEL P ,  GEORGESCU ION ,  VARACHIU NICOLAE

IPC: G01N29/02 ,  B81B3/00 ,  G01N29/24 ,  H03H9/25

CPC classification number: G01N29/022 ,  B81B2201/0214 ,  B81C1/00206 ,  G01N29/2462 ,  G01N2291/021 ,  G01N2291/0423

Abstract: The design and deposition of a sensing layer for room temperature SAW/BAW chemical sensors utilizing macrocyclic compounds in accordance with supra-molecular chemistry principles. The gas to be sensed is attached to the organic sensing film thus changing its visco-elastic properties and creating a mass increase of the film deposited on the surface of SAW/BAW devices. A direct printing method can be used as an additive, mask-less procedure to deposit metallic interdigital transducers and electrodes required for SAW/BAW devices, along with the deposition of a guiding layer and the organic films only on the location required by the sensing SAW/BAW principle of the sensor. Different thermal treatment solutions can be used for the consolidation of the gelly organic films deposited by the direct printing methods.

Abstract translation: 根据超分子化学原理，使用大环化合物的室温SAW / BAW化学传感器的感测层的设计和沉积。 待感测的气体被附着到有机传感膜上，从而改变其粘弹性，并且产生沉积在SAW / BAW装置的表面上的膜的质量增加。 直接印刷方法可以用作为SAW / BAW器件所需的金属叉指式换能器和电极的添加剂，无掩模程序，以及引导层和有机膜的沉积仅在感测SAW所需的位置 / BAW原理的传感器。 不同的热处理溶液可用于固化通过直接印刷方法沉积的凝胶状有机膜。

公开(公告)号：WO2007084434A3

公开(公告)日：2007-10-11

申请号：PCT/US2007000988

申请日：2007-01-12

Applicant: HONEYWELL INT INC ,  COBIANU CORNEL P ,  AVRAMESCU VIOREL V ,  GEORGESCU ION

Inventor： COBIANU CORNEL P ,  AVRAMESCU VIOREL V ,  GEORGESCU ION

IPC: G01L9/00

CPC classification number: G01L9/008 ,  G01L9/0025

Abstract: A SAW sensor module can be produced with a true all quartz sensor package (TAQSP) attached to a substrate. The TAQSP has a quartz cover direct quartz bonded to a SAW sensor on a quartz substrate. The TAQSP can be mass produced by direct quartz bonding a quartz cover wafer, having many covers, to a quartz sensor wafer, having many sensors, thereby producing a wafer tandem. The wafer tandem can be further processed because the bond protects the sensors within. Individual sensor packages can be obtained by cutting stripes out of the cover wafer, revealing SAW sensor bonding pads, and then dicing the wafer tandem. A SAW sensor module results when the sensor packages are attached to an antenna bearing substrate and then sealed.

Abstract translation: SAW传感器模块可以使用真正的全石英传感器封装（TAQSP）连接到衬底上。 TAQSP将石英盖直接石英结合到石英衬底上的SAW传感器上。 TAQSP可以通过将具有许多盖的石英盖晶片直接石英键合到具有许多传感器的石英传感器晶片来批量生产，由此产生晶片串联。 晶圆串联可以进一步处理，因为键保护内部的传感器。 单个传感器封装可以通过从盖晶片上切割出条纹，显露SAW传感器焊盘，然后将晶片切割成串联来获得。 当传感器封装连接到天线支承基板上然后密封时，会产生SAW传感器模块。

公开(公告)号：WO2008118740A2

公开(公告)日：2008-10-02

申请号：PCT/US2008/057635

申请日：2008-03-20

Applicant: HONEYWELL INTERNATIONAL INC. ,  SERBAN, Bogdan Catalin ,  AVRAMESCU, Viorel V. ,  COBIANU, Cornel P. ,  GEORGESCU, Ion ,  VARACHIU, Nicolae

Inventor： SERBAN, Bogdan Catalin ,  AVRAMESCU, Viorel V. ,  COBIANU, Cornel P. ,  GEORGESCU, Ion ,  VARACHIU, Nicolae

CPC classification number: G01N29/022 ,  B81B2201/0214 ,  B81C1/00206 ,  G01N29/2462 ,  G01N2291/021 ,  G01N2291/0423

Abstract: The design and deposition of a sensing layer for room temperature SAW/BAW chemical sensors utilizing macrocyclic compounds in accordance with supra-molecular chemistry principles. The gas to be sensed is attached to the organic sensing film thus changing its visco-elastic properties and creating a mass increase of the film deposited on the surface of SAW/BAW devices. A direct printing method can be used as an additive, mask-less procedure to deposit metallic interdigital transducers and electrodes required for SAW/BAW devices, along with the deposition of a guiding layer and the organic films only on the location required by the sensing SAW/BAW principle of the sensor. Different thermal treatment solutions can be used for the consolidation of the gelly organic films deposited by the direct printing methods.

Abstract translation: 根据超分子化学原理，利用大环化合物设计和沉积用于室温SAW / BAW化学传感器的传感层。 待检测的气体附着在有机传感膜上，从而改变其粘弹性，并使沉积在SAW / BAW装置表面上的膜质量增加。 直接印刷方法可用作添加剂，无掩模程序以沉积SAW / BAW装置所需的金属叉指式换能器和电极，以及仅在感测SAW所需的位置处沉积引导层和有机膜 / BAW传感器原理。 不同的热处理解决方案可用于巩固通过直接印刷方法沉积的凝胶有机膜。

公开(公告)号：WO2007067453A3

公开(公告)日：2007-08-30

申请号：PCT/US2006046154

申请日：2006-12-01

Applicant: HONEYWELL INT INC ,  COBIANU CORNEL P ,  PAVELESCU IOAN ,  AVRAMESCU VIOREL V ,  COOK JAMES D ,  MCNALLY LEONARD J

Inventor： COBIANU CORNEL P ,  PAVELESCU IOAN ,  AVRAMESCU VIOREL V ,  COOK JAMES D ,  MCNALLY LEONARD J

IPC: H03H3/08 ,  G01L9/00

CPC classification number: G01L9/0025 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908

Abstract: Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surround the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.

Abstract translation: 改进的SAW压力传感器及其制造方法。 可以提供包括设置在其上的多个SAW换能器的SAW晶片。 还可以提供盖晶片，其中玻璃壁位于盖晶片和SAW晶片之间。 盖晶片可以固定到SAW晶片，使得玻璃壁围绕SAW换能器。 在一些情况下，玻璃壁可以至少部分地限定盖晶片和SAW晶片之间的间隔。 还可以在盖晶片和SAW晶片之间提供一个或多个轮廓，使得当盖晶片相对于SAW晶片设置并相对于SAW晶片固定时，至少一个轮廓围绕至少一个SAW换能器。