公开(公告)号：WO2007004765A1

公开(公告)日：2007-01-11

申请号：PCT/KR2005/002557

申请日：2005-08-05

Applicant: CHEIL INDUSTRIES INC. ,  JUN, Jung Bae ,  PARK, Jin Gyu ,  LEE, Jae Ho ,  BAE, Tae Sub ,  PARK, Jung Il ,  LEE, Sang Woon

Inventor： JUN, Jung Bae ,  PARK, Jin Gyu ,  LEE, Jae Ho ,  BAE, Tae Sub ,  PARK, Jung Il ,  LEE, Sang Woon

IPC: C08J3/12

CPC classification number: H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/25 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and consists of nickel (Ni) and gold (Au).

Abstract translation: 本文公开了具有优异的电可靠性的各向异性导电颗粒，其可用作电连接结构的材料。 还公开了一种制备导电颗粒的方法，该导电颗粒包括聚合物树脂基础颗粒和形成在基础颗粒表面上的导电复合金属镀层，其中导电复合金属镀层具有基本连续的密度梯度，由镍（Ni）和 金（Au）。

公开(公告)号：WO2005045851A1

公开(公告)日：2005-05-19

申请号：PCT/KR2004/002847

申请日：2004-11-05

Applicant: CHEIL INDUSTRIES INC. ,  PARK, Jin Gyu ,  JUN, Jung Bae ,  BAE, Tae Sub ,  LEE, Jae Ho

Inventor： PARK, Jin Gyu ,  JUN, Jung Bae ,  BAE, Tae Sub ,  LEE, Jae Ho

IPC: H01B3/10

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  Y10T428/24942 ,  Y10T428/25

Abstract: The insulated conductive particles of the present invention comprise a substrate resin particle 41 having an average particle size of 1 to 10 gm, a Ni layer 42 coated on the surface of the substrate resin particle with a thickness of 0.010.1 ,um, an Au layer 43 coated on the Ni layer with a thickness of 0.03-0.3 gm, and an inorganic insulative layer 44 coated on the Au layer with a thickness of 0.051 gm. An anisotropic conductive film of the present invention comprises the insulated conductive particles in the number of 10,00080,000 per square millimeter (mm2).

Abstract translation: 本发明的绝缘导电性粒子包含平均粒径为1〜10gm的基材树脂粒子41，涂覆在基材树脂粒子的表面上的Ni层42，厚度为0.010.1μm，Au 涂覆在Ni层上的厚度为0.03-0.3gm的层43和涂覆在Au层上的厚度为0.051gm的无机绝缘层44。 本发明的各向异性导电膜包括10,000平方毫米（mm2）的绝缘导电颗粒。

公开(公告)号：WO2006090950A1

公开(公告)日：2006-08-31

申请号：PCT/KR2005/001558

申请日：2005-05-27

Applicant: CHEIL INDUSTRIES INC. ,  JUN, Jung Bae ,  PARK, Jin Gyu ,  LEE, Jae Ho ,  BAE, Tae Sub

Inventor： JUN, Jung Bae ,  PARK, Jin Gyu ,  LEE, Jae Ho ,  BAE, Tae Sub

IPC: H01B1/12

CPC classification number: H01B1/22 ,  H01L2224/73204 ,  H01L2924/07811 ,  H05K3/323 ,  H05K2201/0212 ,  H05K2201/0221 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00

Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which are used in the mounting field of circuit boards. The conductive particles exhibit superior electrical reliability. Further disclosed are polymer particles having good compressive deformability and recoverability from deformation without being ruptured when an adhesive film containing the conductive particles is interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Since the polymer particles have a spherical shape, a uniform particle diameter, and a narrow particle diameter distribution, they show enhanced conducting properties.

Abstract translation: 这里公开的是各向异性导电粘合剂膜中所含的各向异性导电颗粒，其用于电路板的安装领域。 导电颗粒表现出优异的电可靠性。 进一步公开了当含有导电颗粒的粘合剂膜在连接基板之间插入并压缩时，具有良好的压缩变形性和变形性的可回复性而不破裂的聚合物颗粒，从而实现了颗粒与连接基板之间的充分的接触面积。 由于聚合物颗粒具有球形，均匀的粒径和窄的粒径分布，因此它们显示出增强的导电性能。

公开(公告)号：WO2006065009A1

公开(公告)日：2006-06-22

申请号：PCT/KR2005/002005

申请日：2005-06-27

Applicant: CHEIL INDUSTRIES INC. ,  JUN, Jung Bae ,  PARK, Jin Gyu ,  LEE, Jae Ho ,  BAE, Tae Sub

Inventor： JUN, Jung Bae ,  PARK, Jin Gyu ,  LEE, Jae Ho ,  BAE, Tae Sub

IPC: C08J3/12

CPC classification number: H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which are used in the mounting field of circuit boards. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.

Abstract translation: 这里公开的是各向异性导电粘合剂膜中所含的各向异性导电颗粒，其用于电路板的安装领域。 导电颗粒具有均匀的形状，窄的粒径分布，以及适当的压缩成形性和可变形性。 此外，导电颗粒在连接基板之间插入和压缩时表现出增强的导电性能而不会破裂，从而实现了颗粒和连接基板之间的足够的接触面积。 进一步公开的是在导电颗粒中使用的基于聚合物的颗粒。

公开(公告)号：WO2005109447A1

公开(公告)日：2005-11-17

申请号：PCT/KR2004/001173

申请日：2004-05-18

Applicant: CHEIL INDUSTRIES INC. ,  PARK, Jin Gyu ,  BAE, Tae Sub ,  JUN, Jung Bae ,  LEE, Jae Ho ,  HONG, Jae Geun

Inventor： PARK, Jin Gyu ,  BAE, Tae Sub ,  JUN, Jung Bae ,  LEE, Jae Ho ,  HONG, Jae Geun

IPC: H01B1/14

CPC classification number: H01B1/22 ,  H01L2224/29399 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H05K3/323 ,  H05K2201/0212 ,  H05K2201/0224 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/29 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00

Abstract: The present invention provides an insulated conductive particle comprises a conductive particle, and insulating fixative particles discontinuously fixated on the surface of the conductive particle for insulation among other adjacent insulated conductive particles, whereby the insulated conductive particle is electrically connected between electrodes by the insulating fixative particles being deviated from its position. The present invention also provides a method for manufacturing the insulated conductive particle, an anisotropic conductive adhesive film containing the insulated conductive particles, and an electrically connected structure using the film.

Abstract translation: 本发明提供一种绝缘导电粒子，其包含导电粒子，绝缘固定粒子不连续地固定在导电粒子的表面上，用于在其它相邻绝缘导电粒子之间进行绝缘，由此绝缘导电粒子通过绝缘固定颗粒电连接在电极之间 偏离其立场。 本发明还提供一种制造绝缘导电颗粒的方法，含有绝缘导电颗粒的各向异性导电粘合剂膜以及使用该膜的电连接结构。