公开(公告)号：WO2005089510A3

公开(公告)日：2007-02-01

申请号：PCT/US2005009299

申请日：2005-03-17

Applicant: NORTHROP GRUMMAN CORP ,  BERRY CYNTHIA W ,  BAILEY ALEX E ,  FISHER ROBERT ,  GUPTA TAPAN K ,  BROSEY DANIEL ,  SMALLEY STEVE M ,  THOMAS WILLIAM A

Inventor： BERRY CYNTHIA W ,  BAILEY ALEX E ,  FISHER ROBERT ,  GUPTA TAPAN K ,  BROSEY DANIEL ,  SMALLEY STEVE M ,  THOMAS WILLIAM A

IPC: H05K3/02 ,  C03B29/00 ,  C04B33/34 ,  C04B37/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/10 ,  H01L23/12 ,  H01L23/495 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K1/14 ,  H05K3/10 ,  H05K3/22 ,  H05K3/24

CPC classification number: H05K3/248 ,  H01L21/4867 ,  H05K1/092 ,  H05K3/1291 ,  H05K2201/035 ,  H05K2203/1126 ,  H05K2203/1476 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49163

Abstract: An LTCC module (10) includes a base (24) on one or more surfaces for receiving one or more external components (26, 30, 36) to be attached to the module. A base (24) is formed of a plurality of layers of metallization (12) in a predetermined pattern. The layers include an adhesion layer (44) on the LTCC module surface, with one or more intermediate layers (46), followed by a top layer (48). The module is fired with each application of the layers at a reduced temperature lower than the normal cofÊring temperamre of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.

Abstract translation: LTCC模块（10）在一个或多个表面上包括用于接收要连接到模块的一个或多个外部组件（26,30,36）的基座（24）。 基底（24）由预定图案的多层金属化（12）形成。 这些层包括在LTCC模块表面上的粘附层（44），具有一个或多个中间层（46），随后是顶层（48）。 在低于LTCC模块的正常共振温度的降低的温度下，每层施加该模块，但是具有足够的值以部分地烧结层。 在最后施加的顶层之后，模块在升高的温度下被烧一次以完全烧结层。

公开(公告)号：WO2006042228A1

公开(公告)日：2006-04-20

申请号：PCT/US2005/036417

申请日：2005-10-06

Applicant: NORTHROP GRUMMAN CORPORATION ,  BERRY, Cynthia W. ,  BAILEY, Alex E. ,  GUPTA, Tapan K.

Inventor： BERRY, Cynthia W. ,  BAILEY, Alex E. ,  GUPTA, Tapan K.

IPC: B32B37/10 ,  B32B38/04

CPC classification number: B32B37/0023

Abstract: A method of producing an LTCC substrate having improved cavity bondability is disclosed that involves providing a stack of green ceramic tape sheets (12) having a cavity (24), placing a template (20) having an opening corresponding to the cavity over the stack, placing a stretchable sheet (36) of material coated with graphite or zinc stearate over the template, isostatically laminating the stack to produce an LTCC substrate having a cavity, and removing the template and sheet of stretchable material from the stack.

Abstract translation: 公开了一种生产具有改进的腔体粘合性的LTCC基板的方法，其涉及提供具有空腔（24）的一层绿色陶瓷带状薄片（12），将具有对应于空腔的开口的模板（20）放置在堆叠上， 将涂覆有石墨或硬脂酸锌的材料的可拉伸片材（36）放置在模板上，均匀地层叠该叠层以产生具有空腔的LTCC基底，并从堆叠中移除可拉伸材料的模板和片材。

公开(公告)号：WO2005089510A2

公开(公告)日：2005-09-29

申请号：PCT/US2005/009299

申请日：2005-03-17

Applicant: NORTHROP GRUMMAN CORPORATION ,  BERRY, Cynthia, W. ,  BAILEY, Alex, E. ,  FISHER, Robert ,  GUPTA, Tapan, K. ,  BROSEY, Daniel ,  SMALLEY, Steve, M. ,  THOMAS, William, A.

Inventor： BERRY, Cynthia, W. ,  BAILEY, Alex, E. ,  FISHER, Robert ,  GUPTA, Tapan, K. ,  BROSEY, Daniel ,  SMALLEY, Steve, M. ,  THOMAS, William, A.

IPC: C03B29/00 ,  H01L21/48 ,  H01L23/495 ,  H05K1/09 ,  H05K3/24

CPC classification number: H05K3/248 ,  H01L21/4867 ,  H05K1/092 ,  H05K3/1291 ,  H05K2201/035 ,  H05K2203/1126 ,  H05K2203/1476 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49163

Abstract: An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.

Abstract translation: LTCC模块包括在一个或多个表面上的基座，用于接收要连接到模块的一个或多个外部组件。 基底由预定图案的多层金属化形成。 这些层包括在LTCC模块表面上的粘附层，具有一个或多个中间层，随后是顶层。 在低于LTCC模块的正常共烧温度的降低温度下，每层施加该模块，但具有足够的值以部分地烧结层。 在最后施加的顶层之后，模块在升高的温度下被烧一次以完全烧结层。

公开(公告)号：WO2005101493A3

公开(公告)日：2006-08-03

申请号：PCT/US2005005655

申请日：2005-02-23

Applicant: NORTHROP GRUMMAN CORP ,  BERRY CYNTHIA W ,  BAILEY ALEX E

Inventor： BERRY CYNTHIA W ,  BAILEY ALEX E

IPC: H01L23/053 ,  H01L23/02 ,  H01L23/13 ,  H01L23/498 ,  H05K1/00 ,  H05K1/09 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32

CPC classification number: H01L23/49883 ,  H01L23/13 ,  H01L23/49833 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05K1/092 ,  H05K1/182 ,  H05K3/248 ,  H05K3/328 ,  H05K2201/035 ,  H05K2203/049 ,  Y10T29/49018 ,  Y10T29/49078 ,  Y10T29/49155

Abstract: An LTCC (low temperature cofired ceramic) structure which has conductors to which leads are to be bonded for connection to external circuitry. The conductors include additives to promote adhesion to the ceramic layer. The presence of these additives degrade bonding performance. For better bondability of the leads, a pure conductor metal layer, devoid of the additives is placed on the conductors in areas where leads are to be bonded. This pure conductor metal layer may be cofired with the stack of ceramic layers or may be post fired after stack firing.

Abstract translation: LTCC（低温共烧陶瓷）结构，其具有用于连接到外部电路的引线的导体。 导体包括用于促进与陶瓷层的粘附的添加剂。 这些添加剂的存在降低了粘合性能。 为了使引线具有更好的粘合性，在引线要被接合的区域中的导体上放置没有添加剂的纯导体金属层。 该纯导体金属层可以与陶瓷层的堆叠共烧，或者可以在堆叠烧制之后进行烧制。

公开(公告)号：WO2005109458A3

公开(公告)日：2007-02-15

申请号：PCT/US2005014932

申请日：2005-04-29

Applicant: NORTHROP GRUMMAN CORP ,  BERRY CYNTHIA W ,  BAILEY ALEX E

Inventor： BERRY CYNTHIA W ,  BAILEY ALEX E

IPC: H05K3/36 ,  B32B37/00 ,  H01G7/00 ,  H01L21/48 ,  H01M8/12 ,  H05K1/03 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01M8/12 ,  H01L21/481 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T156/1062

Abstract: A method of forming an LTCC structure having at least one open cavity on each of first and second opposing sides is disclosed that includes the steps of forming a first LTCC structure including a first side having a plurality of cavities and a second side, subjecting the first LTCC structure to a first pressure, forming a second LTCC structure including a first side having a plurality of cavities and a second side, subjecting the second LTCC structure to a second pressure, arranging the first LTCC structure and the second LTCC structure such that the first LTCC structure second side faces the second LTCC structure second side, and subjecting the placed-together first and second LTCC structures to a third pressure to join the first LTCC structure to the second LTCC structure. A product formed by the subject method is also disclosed.

Abstract translation: 公开了一种在第一和第二相对侧的每一个上形成具有至少一个开放空腔的LTCC结构的方法，其包括形成第一LTCC结构的步骤，所述第一LTCC结构包括具有多个腔和第二侧的第一侧， LTCC结构形成第一压力，形成包括具有多个空腔的第一侧和第二侧的第二LTCC结构，使第二LTCC结构受到第二压力，将第一LTCC结构和第二LTCC结构布置成使得第一 LTCC结构第二面朝向第二LTCC结构第二侧，并且将放置在一起的第一和第二LTCC结构施加到第三压力以将第一LTCC结构连接到第二LTCC结构。 还公开了通过本发明方法形成的产品。

公开(公告)号：WO2005109458A2

公开(公告)日：2005-11-17

申请号：PCT/US2005/014932

申请日：2005-04-29

Applicant: NORTHROP GRUMMAN CORPORATION ,  BERRY, Cynthia W. ,  BAILEY, Alex E.

Inventor： BERRY, Cynthia W. ,  BAILEY, Alex E.

IPC: H01G7/00

CPC classification number: H01M8/12 ,  H01L21/481 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T156/1062

Abstract: A method of forming an LTCC structure having at least one open cavity on each of first and second opposing sides is disclosed that includes the steps of forming a first LTCC structure including a first side having a plurality of cavities and a second side, subjecting the first LTCC structure to a first pressure, forming a second LTCC structure including a first side having a plurality of cavities and a second side, subjecting the second LTCC structure to a second pressure, arranging the first LTCC structure and the second LTCC structure such that the first LTCC structure second side faces the second LTCC structure second side, and subjecting the placed-together first and second LTCC structures to a third pressure to join the first LTCC structure to the second LTCC structure. A product formed by the subject method is also disclosed.

Abstract translation: 公开了一种在第一和第二相对侧的每一个上形成具有至少一个开放空腔的LTCC结构的方法，其包括形成第一LTCC结构的步骤，所述第一LTCC结构包括具有多个腔和第二侧的第一侧， LTCC结构形成第一压力，形成包括具有多个空腔和第二侧的第一侧的第二LTCC结构，对所述第二LTCC结构进行第二压力，将所述第一LTCC结构和所述第二LTCC结构布置成使得所述第一LTCC结构 LTCC结构第二面朝向第二LTCC结构第二侧，并且将放置在一起的第一和第二LTCC结构施加到第三压力以将第一LTCC结构连接到第二LTCC结构。 还公开了通过本发明方法形成的产品。

公开(公告)号：WO2005101493A2

公开(公告)日：2005-10-27

申请号：PCT/US2005/005655

申请日：2005-02-23

Applicant: NORTHROP GRUMMAN CORPORATION ,  BERRY, Cynthia, W. ,  BAILEY, Alex, E.

Inventor： BERRY, Cynthia, W. ,  BAILEY, Alex, E.

IPC: H01L23/02

CPC classification number: H01L23/49883 ,  H01L23/13 ,  H01L23/49833 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05K1/092 ,  H05K1/182 ,  H05K3/248 ,  H05K3/328 ,  H05K2201/035 ,  H05K2203/049 ,  Y10T29/49018 ,  Y10T29/49078 ,  Y10T29/49155

Abstract: An LTCC (low temperature cofired ceramic) structure which has conductors to which leads are to be bonded for connection to external circuitry. The conductors include additives to promote adhesion to the ceramic layer. The presence of these additives degrade bonding performance. For better bondability of the leads, a pure conductor metal layer, devoid of the additives is placed on the conductors in areas where leads are to be bonded. This pure conductor metal layer may be cofired with the stack of ceramic layers or may be post fired after stack firing.

Abstract translation: LTCC（低温共烧陶瓷）结构，其具有用于连接到外部电路的引线的导体。 导体包括用于促进与陶瓷层的粘附的添加剂。 这些添加剂的存在降低了粘合性能。 为了使引线具有更好的粘合性，在引线要被接合的区域中的导体上放置没有添加剂的纯导体金属层。 该纯导体金属层可以与陶瓷层的堆叠共烧，或者可以在堆叠烧制之后进行烧制。